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    CERAMIC DUAL IN-LINE PACKAGE Search Results

    CERAMIC DUAL IN-LINE PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CERAMIC DUAL IN-LINE PACKAGE Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CERAMIC DUAL-IN-LINE PACKAGE National Semiconductor Ceramic Dual-in-Line Package (Cerdip) Original PDF
    Ceramic Dual-In-Line Packages Cypress Semiconductor Ceramic Dual-In-Line Packages Original PDF

    CERAMIC DUAL IN-LINE PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    ceramic package

    Abstract: CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ
    Text: Ceramic Dual-in-Line Package Cerdip 8 Lead Ceramic Dual-in-Line Package NS Package Number J08A 2000 National Semiconductor Corporation MS101109 www.national.com Ceramic Dual-in-Line Package (Cerdip) August 1999 Ceramic Dual-in-Line Package (Cerdip) 14 Lead Ceramic Dual-in-Line Package


    Original     		MS101109 ceramic package CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ PDF

    D24K

    Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
    Text: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com


    Original     		MS101104 D24K d28j D14D D24H D08C D16C D18A D20A D20B D24C PDF

    ca0555

    Abstract: CA555
    Text: Nomenclature Guide CA Types CA3260 A T PART NUMBER CAXXXX ELECTRICAL OPTIONS A, B, C, Blank PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal SBDIP E: Dual-In-Line Plastic (PDIP) F: Ceramic Dual-In-Line Frit-Seal (CERDIP) J: Ceramic Leadless Chip Carrier (CLCC)


    Original     		CA3260 CA555 CA0555. 1-888-INTERSIL ca0555 PDF

    PQL176

    Abstract: CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100
    Text: SECTION 4 PHYSICAL DIMENSIONS CD 020 20-Pin Ceramic Dual In Line Package .4-3 CD3024 24-Pin Slim Ceramic Dual In Line Package .4-4


    Original     		20-Pin CD3024 24-Pin 48-Pin PD3024 PQL176 176-Pin PQL176 CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100 PDF

    CD4067 DATASHEET

    Abstract: cd4067 CD4097 ALL CD4067
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		SCHS052A CD4067 CD4097 24-lead 24-lead CD4067 DATASHEET ALL CD4067 PDF

    CD4067BE

    Abstract: cd4067 cd4067 harris CD4097be
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		SCHS052A CD4067 CD4097 24-lead CD4067B, 16-Channel CD4067BNSR CD4067BE cd4067 harris CD4097be PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide AD Types ADC0803LC PART NUMBER Converters AD, ADC 1 WM -T PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal Seal (SBDIP) H: TO-52 Can N: Dual-In-Line Plastic (PDIP) WM: Small Outline Plastic (SOIC)


    Original     		ADC0803LC 1-888-INTERSIL PDF

    ordering information

    Abstract: No abstract text available
    Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack


    Original     		24-pin, MS-027-AC 28-pin, MS-027-AA 32-pin, ordering information PDF

    oki cross

    Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
    Text: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)


    Original     		82CXXX 80CXXX: 82CXXX: 80C86 10MHz 12MHz oki cross CERAMIC LEADLESS CHIP CARRIER CLCC PDF

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original     		follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1 PDF

    CD4093

    Abstract: CD4093 applications cd4093 harris cd4093 Data SCHS115B
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		SCHS115B CD4093 14-lead 14-lead CD4093 applications cd4093 harris cd4093 Data SCHS115B PDF

    CD4093

    Abstract: CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		SCHS115B CD4093 14-lead 14-lead CD4093BPW CD4093BM96 CD4093BNSR CD4093BPWR CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic PDF

    cd4093

    Abstract: CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		SCHS115B CD4093 14-lead 14-lead PCD4093BF3A CD4093BM CD4093BM96 CD4093BNSR CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application PDF

    CD40106B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original     		SCHS097B CD40106B 14-lead 14-lead PDF

    sot133bh3

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SOT133BH3 18-pin ceramic dual in-line F package


    Original     		OT133BH3 18-pin sot133bh3 PDF

    CD4093 applications

    Abstract: CD4093 cd4093 harris CD4093 Types OF CD4093
    Text: Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form


    Original     		SCHS115A CD4093 14-lead 14-lead CD4093 applications cd4093 harris CD4093 Types OF CD4093 PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Harris I: Intersil 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 4: Ceramic Leadless Chip Carriers (CLCC)


    Original     		O-257 1-888-INTERSIL PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Heritage Products I: New Products 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP)


    Original     		O-257 1-888-INTERSIL PDF

    CD4041UB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original     		SCHS039A CD4041UB 14-lead 14-lead PDF

    173KB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original     		SCHS108A CD40257B 16-lead SCAU001A, SDYZ001A, CD40257BE CD40257BF3A 173KB PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


    Original     		2002/95/EC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    CD40257B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original     		SCHS108A CD40257B 16-lead 16-lead PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original     		SCHS039A CD4041UB 14-lead SDYZ001A, CD4041UBE CD4041UBF CD4041UBF3A PDF

    Untitled

    Abstract: No abstract text available
    Text: Dimensional Outlines Dual-In-Line Welded-Seal Ceramic Packages D S U F F I X (J E D E C MO-OOI-AD) 14-Lead Dual-In-Line Welded-Seal Ceramic Package (D) S U F F I X (J E D E C MO-OOI-AE) 16-Lead Dual-ln-Line Welded-Seal Ceramic Package A INCHES MIN. MAX.


    OCR Scan     		14-Lead 16-Lead 51HES 28-Lead PDF