Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CERAMIC DUAL-IN-LINE PACKAGES Search Results

    CERAMIC DUAL-IN-LINE PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CERAMIC DUAL-IN-LINE PACKAGES Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Ceramic Dual-In-Line Packages Cypress Semiconductor Ceramic Dual-In-Line Packages Original PDF

    CERAMIC DUAL-IN-LINE PACKAGES Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    D24K

    Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
    Text: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com


    Original     		MS101104 D24K d28j D14D D24H D08C D16C D18A D20A D20B D24C PDF

    CD4067 DATASHEET

    Abstract: cd4067 CD4097 ALL CD4067
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		SCHS052A CD4067 CD4097 24-lead 24-lead CD4067 DATASHEET ALL CD4067 PDF

    CD4067BE

    Abstract: cd4067 cd4067 harris CD4097be
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		SCHS052A CD4067 CD4097 24-lead CD4067B, 16-Channel CD4067BNSR CD4067BE cd4067 harris CD4097be PDF

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original     		follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1 PDF

    CD40106B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original     		SCHS097B CD40106B 14-lead 14-lead PDF

    cd40106b

    Abstract: CD40106BE CD-40106BE
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original     		SCHS097B CD40106B 14-lead CD40106BNSR CD40106BPW CD40106BPWR CD40106BE CD-40106BE PDF

    CD4041UB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original     		SCHS039A CD4041UB 14-lead 14-lead PDF

    173KB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original     		SCHS108A CD40257B 16-lead SCAU001A, SDYZ001A, CD40257BE CD40257BF3A 173KB PDF

    CD40257B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original     		SCHS108A CD40257B 16-lead 16-lead PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original     		SCHS039A CD4041UB 14-lead SDYZ001A, CD4041UBE CD4041UBF CD4041UBF3A PDF

    173KB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original     		SCHS108A CD40257B 16-lead CD40257BNSR CD40257BPW CD40257BPWR 173KB PDF

    226 10k

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original     		SCHS039A CD4041UB 14-lead CD4041UBNSR CD4041UBPW CD4041UB, CD4041UBPWR 226 10k PDF

    CDIP4-T24

    Abstract: MARK S2 CDIP4-T24 DIMENSIONS
    Text: Ceramic Packages Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D24.3 MIL-STD-1835 CDIP4-T24 (D-9, CONFIGURATION C) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S


    Original     		MIL-STD-1835 CDIP4-T24 CDIP4-T24 MARK S2 CDIP4-T24 DIMENSIONS PDF

    CDIP2-T28

    Abstract: D-10
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C) LEAD FINISH 28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S


    Original     		MIL-STD-1835 CDIP2-T28 CDIP2-T28 D-10 PDF

    GDIP3-T24

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F24.3 MIL-STD-1835 GDIP3-T24 (D-9, CONFIGURATION A) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D


    Original     		MIL-STD-1835 GDIP3-T24 GDIP3-T24 PDF

    cdip2-t16

    Abstract: CDIP2-T16 DIMENSIONS
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D


    Original     		MIL-STD-1835 CDIP2-T16 cdip2-t16 CDIP2-T16 DIMENSIONS PDF

    MARK S2

    Abstract: CDIP2-T22
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D22.4 MIL-STD-1835 CDIP2-T22 (D-7, CONFIGURATION C) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D


    Original     		MIL-STD-1835 CDIP2-T22 MARK S2 CDIP2-T22 PDF

    MARK S2

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D40.6 MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D


    Original     		MIL-STD-1835 CDIP2-T40 MARK S2 PDF

    diode t40

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D


    Original     		MIL-STD-1835 GDIP1-T40 diode t40 PDF

    GDIP1-T14

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A) LEAD FINISH 14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D


    Original     		MIL-STD-1835 GDIP1-T14 GDIP1-T14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F22.4 MIL-STD-1835 GDIP1-T22 (D-7, CONFIGURATION A) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D


    Original     		MIL-STD-1835 GDIP1-T22 PDF

    CDIP2-T18

    Abstract: MARK S2 18-LEAD D-6 PACKAGE
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D18.3 MIL-STD-1835 CDIP2-T18 (D-6, CONFIGURATION C) LEAD FINISH 18 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D


    Original     		MIL-STD-1835 CDIP2-T18 CDIP2-T18 MARK S2 18-LEAD D-6 PACKAGE PDF

    CDIP2-T8

    Abstract: 0383D MARK S2
    Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C) LEAD FINISH 8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D BASE


    Original     		MIL-STD-1835 CDIP2-T8 0383D MARK S2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Dimensional Outlines Dual-In-Line Welded-Seal Ceramic Packages D S U F F I X (J E D E C MO-OOI-AD) 14-Lead Dual-In-Line Welded-Seal Ceramic Package (D) S U F F I X (J E D E C MO-OOI-AE) 16-Lead Dual-ln-Line Welded-Seal Ceramic Package A INCHES MIN. MAX.


    OCR Scan     		14-Lead 16-Lead 51HES 28-Lead PDF