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    CERAMIC LEADLESS CHIP CARRIER Search Results

    CERAMIC LEADLESS CHIP CARRIER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CERAMIC LEADLESS CHIP CARRIER Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CERAMIC LEADLESS CHIP CARRIER LCC National Semiconductor Ceramic Leadless Chip Carrier (LCC) Original PDF

    CERAMIC LEADLESS CHIP CARRIER Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet PDF

    leadless chip carrier

    Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A leadless chip carrier L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram


    Original     		32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79 PDF

    44 Lead Ceramic Leadless Chip Carrier

    Abstract: leadless chip carrier MIL-STD-1835
    Text: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A 44 Lead Ceramic Leadless Chip Carrier leadless chip carrier PDF

    B-3067

    Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
    Text: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER


    Original     		16-PIN 28-PIN B-3067 B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J68.A Package
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER J68.A Package PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 8512E
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.B 0.010 S E H S 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45 SYMBOL o E3 B E A1 0.097 1.78 2.46 6, 7 0.077 1.37 1.96 - B - - - - - B1 0.020 0.030 0.51 0.76 2, 4 0.15 0.56


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER 8512E PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.B 0.010 S E H S 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.022


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER PDF

    CQCC1-N20

    Abstract: CERAMIC LEADLESS CHIP CARRIER n20 n
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23


    Original     		MIL-STD-1835 CQCC1-N20 5M-1982. CQCC1-N20 CERAMIC LEADLESS CHIP CARRIER n20 n PDF

    CERAMIC LEADLESS CHIP CARRIER CLCC 28

    Abstract: MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23


    Original     		MIL-STD-1835 CQCC1-N28 5M-1982. CERAMIC LEADLESS CHIP CARRIER CLCC 28 MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: h 033 clcc 68
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER h 033 clcc 68 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: E2318
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.A 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7 A1 0.044


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER E2318 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: CQCC1-N32
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060


    Original     		MIL-STD-1835 CQCC1-N32 5M-1982. CERAMIC LEADLESS CHIP CARRIER CQCC1-N32 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J18B CERAMIC LEADLESS CHIP CARRIER package
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.B 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7


    Original     		5M-1982. CERAMIC LEADLESS CHIP CARRIER J18B CERAMIC LEADLESS CHIP CARRIER package PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.064


    Original     		MIL-STD-1835 CQCC1-N44 5M-1982. CERAMIC LEADLESS CHIP CARRIER J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package PDF

    Untitled

    Abstract: No abstract text available
    Text: LC140, 141, 142 Vishay Electro-Films Hermetic Leadless Chip Carrier FEATURES Vishay Electro-Films EFI line of precision resistor networks in ceramic leadless chip carriers offer the designer flexibility and low cost in military, space or other harsh environmental


    Original     		LC140, 07-Aug-01 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: Package Information Drawing C2 – 32-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 32 B e1 E3 E2 E D3 A D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.27 B Inches Min Max 3.30 0.095 0.130 2.03 0.050


    Original     		32-Pad 030195R6 CERAMIC LEADLESS CHIP CARRIER PDF

    EB 203 D

    Abstract: CERAMIC LEADLESS CHIP CARRIER
    Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054


    Original     		28-Pad 030195R7 EB 203 D CERAMIC LEADLESS CHIP CARRIER PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 28-Pad
    Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054


    Original     		28-Pad 030195R0 CERAMIC LEADLESS CHIP CARRIER PDF

    ordering information

    Abstract: No abstract text available
    Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack


    Original     		24-pin, MS-027-AC 28-pin, MS-027-AA 32-pin, ordering information PDF

    CQCC1-N32

    Abstract: CERAMIC LEADLESS CHIP CARRIER
    Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES SYMBOL D3 j x 45 o E3 E A PLANE 2 PLANE 1 -E- 0.007 M E F S H S


    Original     		MIL-STD-1835 CQCC1-N32 5M-1982. CQCC1-N32 CERAMIC LEADLESS CHIP CARRIER PDF

    Untitled

    Abstract: No abstract text available
    Text: Table of Contents Page Table o f Contents Catalog Description 1 2 Surface Mount Devices Hermetic Flat-Pak - FP200 Series Ceramic Leadless Chip Carrier - LC140 Series Plastic Plastic Leadless Chip Carrier - PL340 Series SOIC - SO 360 Series Micro Divider - MD Series


    OCR Scan     		FP200 LC140 PL340 HD420 TC480 PD520 MS500 CS500 T0-220 PDF

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: leadless chip carrier 28-pin 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A
    Text: Package Diagram Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 20-Lead Quarter Size Outline Q5 1 Package Diagram 24-Lead Quarter Size Outline Q13 Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL–STD–1835 C–12


    Original     		16-Lead 20-Lead 24-Lead 32-Pin 20-Pin 28-Pin 44-Pin CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A PDF