CERAMIC LEADLESS CHIP CARRIER LCC 44
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)
|
Original
|
MS101105
EA20B
EA028C
CERAMIC LEADLESS CHIP CARRIER LCC 44
CERAMIC LEADLESS CHIP CARRIER LCC 68
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER LCC 24
CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER LCC 32
LCC 44
leadless chip carrier
CERAMIC LEADLESS CHIP CARRIER package datasheet
|
PDF
|
leadless chip carrier
Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13
|
Original
|
32-Lead
18-Pin
MIL-STD-1835
20-Pin
22-Pin
24-Pin
28-Pin
MIL-STD-1835
C-11A
leadless chip carrier
L55 PACKAGE DIAGRAM
L51 transistor
diagram
L64 PACKAGE DIAGRAM
20 PIN LEADLESS CHIP CARRIER
|
PDF
|
CERAMIC LEADLESS CHIP CARRIER
Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram
|
Original
|
32-Lead
18-Pin
MIL-STD-1835
20-Pin
22-Pin
24-Pin
28-Pin
MIL-STD-1835
C-11A
CERAMIC LEADLESS CHIP CARRIER
leadless chip carrier
20 PIN LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER 68
MIL-STD
square
L64 PACKAGE DIAGRAM
7c79
|
PDF
|
44 Lead Ceramic Leadless Chip Carrier
Abstract: leadless chip carrier MIL-STD-1835
Text: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13
|
Original
|
32-Lead
18-Pin
MIL-STD-1835
20-Pin
22-Pin
24-Pin
28-Pin
MIL-STD-1835
C-11A
44 Lead Ceramic Leadless Chip Carrier
leadless chip carrier
|
PDF
|
CERAMIC LEADLESS CHIP CARRIER
Abstract: J68.A Package
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033
|
Original
|
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
J68.A Package
|
PDF
|
CERAMIC LEADLESS CHIP CARRIER
Abstract: h 033 clcc 68
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083
|
Original
|
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
h 033
clcc 68
|
PDF
|
ordering information
Abstract: No abstract text available
Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack
|
Original
|
24-pin,
MS-027-AC
28-pin,
MS-027-AA
32-pin,
ordering information
|
PDF
|
EB 203 D
Abstract: CERAMIC LEADLESS CHIP CARRIER
Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054
|
Original
|
28-Pad
030195R7
EB 203 D
CERAMIC LEADLESS CHIP CARRIER
|
PDF
|
Untitled
Abstract: No abstract text available
Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier
|
Original
|
IA82510
IA82510
ENG211001219-01
|
PDF
|
P82510
Abstract: n82510 8250 uart intel 8250 intel uart intel 8250 UART 8250a uart intel TN82510 82510 uart 8250A uart 82510 loopback
Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier
|
Original
|
IA82510
IA82510
ENG211001219-01
P82510
n82510
8250 uart intel
8250 intel uart
intel 8250 UART
8250a uart intel
TN82510
82510 uart
8250A uart
82510 loopback
|
PDF
|
P82510
Abstract: n82510 8250 uart intel intel 8250 UART P8251 8250 ic pin intel 82510 tp82510 IA82510 IA82510-PDW28I-01
Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier
|
Original
|
IA82510
IA82510
ENG211001219-01
P82510
n82510
8250 uart intel
intel 8250 UART
P8251
8250 ic pin
intel 82510
tp82510
IA82510-PDW28I-01
|
PDF
|
Untitled
Abstract: No abstract text available
Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier
|
Original
|
IA82510
IA82510
ENG211001219-01
|
PDF
|
intel PLCC packaging draw
Abstract: No abstract text available
Text: Page 1 of 12 IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier
|
Original
|
IA82510
intel PLCC packaging draw
|
PDF
|
pj 69
Abstract: No abstract text available
Text: 64-Channel Serial To Parallel Converter With Ruggedized High Voltage CMOS Outputs Ordering Information Package Options Device Recommended Operating Vpp Max 84-Pad Ceramic Leadless Chip Carrier 84-J Lead Plastic Chip Carrier 60V HV04H06LC HV04H06PJ 80V HV04H08LC
|
OCR Scan
|
64-Channel
HV04H
HV06H
84-Pad
HV04H06LC
HV04H08LC
HV06H06LC
HV06H08LC
HV04H06PJ
HV04H08PJ
pj 69
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
|
PDF
|
documentation for 32 bit alu in vlsi
Abstract: EPROM 27001 TMS320C25 starter
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
documentation for 32 bit alu in vlsi
EPROM 27001
TMS320C25 starter
|
PDF
|
k534
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
k534
|
PDF
|
SMJ320C25GBM
Abstract: smj320c25
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
SMJ320C25GBM
smj320c25
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
|
PDF
|
documentation for 32 bit alu in vlsi
Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
68-Pin
100-ns
80-ns
documentation for 32 bit alu in vlsi
CERAMIC PIN GRID ARRAY CPGA lead frame
SMJ320C25
D1057
5962-8861902XA
SMJ320C25-50
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
|
PDF
|
SMJ320C25
Abstract: SMJ320C25-50
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
68-Pin
100-ns
80-ns
SMJ320C25
SMJ320C25-50
|
PDF
|
LACT
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
LACT
|
PDF
|
SMJ320C25
Abstract: SMJ320C25-50 0006H rfid
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
|
Original
|
SMJ320C25,
SMJ320C2550
SGUS007D
68-Pin
100-ns
80-ns
SMJ320C25
SMJ320C25-50
0006H rfid
|
PDF
|
