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    CERAMIC LEADLESS CHIP CARRIER LCC 44 Search Results

    CERAMIC LEADLESS CHIP CARRIER LCC 44 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    R80186 Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 Visit Rochester Electronics LLC Buy
    5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    MR82510/B Rochester Electronics LLC Serial I/O Controller, 1 Channel(s), CMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    X28C512EM-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Visit Rochester Electronics LLC Buy

    CERAMIC LEADLESS CHIP CARRIER LCC 44 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet PDF

    LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
    Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 50mil 650mil 44-pad LCC-44C-F01) C44001SC-2-2 LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC 44 WQFN044-G-S650-1 LCC44 PDF

    QFN048-C-S560-1

    Abstract: LCC-48C-A01
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal LCC-48C-A01 48-pad ceramic LCC (LCC-48C-A01)


    Original     		LCC-48C-A01 QFN048-C-S560-1 48-pad LCC-48C-A01) C4800( C48001SC-4-2 QFN048-C-S560-1 LCC-48C-A01 PDF

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER PDF

    Package 48 LCC

    Abstract: QFN048-C-S560-1 LCC 48 CERAMIC LEADLESS CHIP CARRIER LCC-48C-A01 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 40MIL
    Text: LEADLESS CHIP CARRIER 48 PAD CERAMIC LCC-48C-A01 EIAJ code : ∗QFN048-C-S560-1 Lead pitch 40mil Package width x package length 560 × 560mil Sealing method Metal seal 48-pad ceramic LCC LCC-48C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		LCC-48C-A01 QFN048-C-S560-1 40mil 560mil 48-pad LCC-48C-A01) C48001SC-4-2 Package 48 LCC QFN048-C-S560-1 LCC 48 CERAMIC LEADLESS CHIP CARRIER LCC-48C-A01 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 40MIL PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44 PDF

    LCC-48C-A01

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFN048-C-S560-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC To Top / Package Lineup / Package Index LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal


    Original     		LCC-48C-A01 QFN048-C-S560-1 48-pad LCC-48C-A01) C48001SC-4-2 LCC-48C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFN048-C-S560-1 PDF

    Capacitor 0.01 uF

    Abstract: No abstract text available
    Text: HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable / Disable function. Reflow capable. • APPLICATIONS:


    Original     		10ppm 20ppm 25ppm 30ppm 35ppm 50ppm Capacitor 0.01 uF PDF

    Untitled

    Abstract: No abstract text available
    Text: 5.0 Vdc HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable /Disable function. Reflow capable.


    Original     		10ppm 20ppm 25ppm 30ppm 35ppm 50ppm PDF

    E-44-1

    Abstract: 44-Terminal CERAMIC LEADLESS CHIP CARRIER LCC 44
    Text: 0.100 2.54 0.064 (1.63) 44-Terminal Ceramic Leadless Chip Carrier [LCC] (E-44-1) Dimensions shown in inches and (millimeters) 0.055 (1.40) 0.045 (1.14) 40 39 0.662 (16.82) SQ 0.640 (16.27) 0.050 (1.27) BSC 0.075 (1.91) REF 44 6 1 7 0.028 (0.71) 0.022 (0.56)


    Original     		44-Terminal E-44-1) 22106-A E-44-1 CERAMIC LEADLESS CHIP CARRIER LCC 44 PDF

    Capacitor 0.01 uf

    Abstract: No abstract text available
    Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:53 AM Page 38 3.3 Vdc • HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASV FEATURES: • Leadless chip carrier LCC , low profile. • Tight Symmetry Option. • Tristate Enable / Disable Function.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:53 AM Page 33 HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL FEATURES: • Leadless chip carrier LCC , low profile. • HCMOS and TTL Compatible. • Tristate Enable / Disable Function. • High Density Surface-Mount Applications.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ULTRA LOW PROFILE • HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL2 and ASV2 7.3 x 5.08 x 1.05 mm FEATURES: • • • • Leadless chip carrier LCC , 1.05 mm max. in height.• High density surface-mount applications. HCMOS and TTL compatible, 5V or 3.3VDC.


    Original     		544MHz 20ppm 25ppm 30ppm 35ppm 50ppm PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3 Vdc • HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASV and ASV1 7.0 x 5.08 x 1.8 mm FEATURES: • Leadless chip carrier LCC , Low profile. • Seam welding, 1.4 max. height (ASV1) • Tristate Enable / Disable function. • HCMOS and TTL Compatible, 3.3Vdc operation.


    Original     		10ppm 20ppm 25ppm 30ppm 35ppm 50ppm PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238 PDF

    LM747 pinout

    Abstract: LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin
    Text: Mil Aero Analog Surface Mount Products General Description Features National Semiconductor’s Mil Aero Analog Group offers a large range of military qualified linear devices in surface mount configurations Hardware is available in two small hermetically sealed outlines the Leadless Chip Carrier


    Original     		MIL-STD-883 MIL-M-38510 LM747 pinout LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin PDF

    soic 16 Jedec package outline

    Abstract: 7444J 0502a CERAMIC LEADLESS CHIP CARRIER LCC 24 28P3 CERAMIC LEADLESS CHIP CARRIER LCC 44 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 20P3 MO-047AC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545 PDF

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB PDF