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    CERAMIC LEADLESS CHIP CARRIER PACKAGE Search Results

    CERAMIC LEADLESS CHIP CARRIER PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CERAMIC LEADLESS CHIP CARRIER PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    leadless chip carrier

    Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A leadless chip carrier L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79

    44 Lead Ceramic Leadless Chip Carrier

    Abstract: leadless chip carrier MIL-STD-1835
    Text: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A 44 Lead Ceramic Leadless Chip Carrier leadless chip carrier

    B-3067

    Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
    Text: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER


    Original     		PDF 16-PIN 28-PIN B-3067 B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J68.A Package
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033


    Original     		PDF 5M-1982. CERAMIC LEADLESS CHIP CARRIER J68.A Package

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 8512E
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.B 0.010 S E H S 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45 SYMBOL o E3 B E A1 0.097 1.78 2.46 6, 7 0.077 1.37 1.96 - B - - - - - B1 0.020 0.030 0.51 0.76 2, 4 0.15 0.56


    Original     		PDF 5M-1982. CERAMIC LEADLESS CHIP CARRIER 8512E

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.B 0.010 S E H S 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.022


    Original     		PDF 5M-1982. CERAMIC LEADLESS CHIP CARRIER

    ordering information

    Abstract: No abstract text available
    Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack


    Original     		PDF 24-pin, MS-027-AC 28-pin, MS-027-AA 32-pin, ordering information

    CQCC1-N20

    Abstract: CERAMIC LEADLESS CHIP CARRIER n20 n
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23


    Original     		PDF MIL-STD-1835 CQCC1-N20 5M-1982. CQCC1-N20 CERAMIC LEADLESS CHIP CARRIER n20 n

    CERAMIC LEADLESS CHIP CARRIER CLCC 28

    Abstract: MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23


    Original     		PDF MIL-STD-1835 CQCC1-N28 5M-1982. CERAMIC LEADLESS CHIP CARRIER CLCC 28 MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: h 033 clcc 68
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083


    Original     		PDF 5M-1982. CERAMIC LEADLESS CHIP CARRIER h 033 clcc 68

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: E2318
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.A 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7 A1 0.044


    Original     		PDF 5M-1982. CERAMIC LEADLESS CHIP CARRIER E2318

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: CQCC1-N32
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060


    Original     		PDF MIL-STD-1835 CQCC1-N32 5M-1982. CERAMIC LEADLESS CHIP CARRIER CQCC1-N32

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J20.C Package
    Text: Ceramic Packages Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060


    Original     		PDF MIL-STD-1835 CQCC3-N20 5M-1982. CERAMIC LEADLESS CHIP CARRIER J20.C Package

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package
    Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.064


    Original     		PDF MIL-STD-1835 CQCC1-N44 5M-1982. CERAMIC LEADLESS CHIP CARRIER J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		PDF STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: Package Information Drawing C2 – 32-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 32 B e1 E3 E2 E D3 A D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.27 B Inches Min Max 3.30 0.095 0.130 2.03 0.050


    Original     		PDF 32-Pad 030195R6 CERAMIC LEADLESS CHIP CARRIER

    EB 203 D

    Abstract: CERAMIC LEADLESS CHIP CARRIER
    Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054


    Original     		PDF 28-Pad 030195R7 EB 203 D CERAMIC LEADLESS CHIP CARRIER

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 28-Pad
    Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054


    Original     		PDF 28-Pad 030195R0 CERAMIC LEADLESS CHIP CARRIER

    CQCC1-N32

    Abstract: CERAMIC LEADLESS CHIP CARRIER
    Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES SYMBOL D3 j x 45 o E3 E A PLANE 2 PLANE 1 -E- 0.007 M E F S H S


    Original     		PDF MIL-STD-1835 CQCC1-N32 5M-1982. CQCC1-N32 CERAMIC LEADLESS CHIP CARRIER

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-


    Original     		PDF MIL-STD-1835 CQCC3-N20 5M-1982.

    MIL-STD-1835 CQCC1-N28

    Abstract: clcc 68 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 datasheet d 442 CERAMIC LEADLESS CHIP CARRIER CLCC 28
    Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-


    Original     		PDF MIL-STD-1835 CQCC1-N28 5M-1982. MIL-STD-1835 CQCC1-N28 clcc 68 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 datasheet d 442 CERAMIC LEADLESS CHIP CARRIER CLCC 28

    Untitled

    Abstract: No abstract text available
    Text: Table of Contents Page Table o f Contents Catalog Description 1 2 Surface Mount Devices Hermetic Flat-Pak - FP200 Series Ceramic Leadless Chip Carrier - LC140 Series Plastic Plastic Leadless Chip Carrier - PL340 Series SOIC - SO 360 Series Micro Divider - MD Series


    OCR Scan     		PDF FP200 LC140 PL340 HD420 TC480 PD520 MS500 CS500 T0-220