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    CERQUAD EIAJ Search Results

    CERQUAD EIAJ Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    74F381SJ Rochester Electronics LLC Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20 Visit Rochester Electronics LLC Buy
    74F182SJ Rochester Electronics LLC Look-Ahead Carry Generator, F/FAST Series, 4-Bit, TTL, PDSO16, 5.30 MM, EIAJ TYPE2, SOP-16 Visit Rochester Electronics LLC Buy

    CERQUAD EIAJ Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CERQUAD EIAJ National Semiconductor Cerquad, EIAJ Original PDF

    CERQUAD EIAJ Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERQUAD

    Abstract: CERQUAD EIAJ W144B WA80A WA80AQ
    Text: Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80A 2000 National Semiconductor Corporation MS101114 www.national.com Cerquad, EIAJ August 1999 Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80AQ www.national.com 2 Cerquad, EIAJ 144 Lead Cerquad, EIAJ


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    PDF WA80A MS101114 WA80AQ W144B CERQUAD CERQUAD EIAJ W144B WA80A WA80AQ

    W120A

    Abstract: No abstract text available
    Text: 120 Lead Cerquad EIAJ NS Package Number W120A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF W120A W120A

    W144A

    Abstract: No abstract text available
    Text: 144 Lead Cerquad EIAJ NS Package Number W144A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF W144A W144A

    W208A

    Abstract: CERQUAD EIAJ
    Text: 208 Lead Cerquad EIAJ NS Package Number W208A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF W208A W208A CERQUAD EIAJ

    WA80AQ

    Abstract: No abstract text available
    Text: 80 Lead Cerquad EIAJ EPROM NS Package Number WA80AQ All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF WA80AQ WA80AQ

    WA80A

    Abstract: No abstract text available
    Text: 80 Lead Cerquad EIAJ NS Package Number WA80A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF WA80A WA80A

    W144B

    Abstract: No abstract text available
    Text: 144 Lead Cerquad EIAJ NS Package Number W144B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF W144B W144B

    W160A

    Abstract: No abstract text available
    Text: 160 Lead Cerquad EIAJ NS Package Number W160A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    PDF W160A W160A

    QFP240-G-3232-0

    Abstract: No abstract text available
    Text: 240K6X-A Glass seal 240pin 32✕32mm CERQUAD EIAJ Package Code QFP240-G-3232-0.50 Weight g MD e JEDEC Code – 181 1 b2 240 ME HD D 180 I2 Symbol HE E Recommended Mount Pad 121 60 61 120 F L1 A b y A1 c A2 e A A1 A2 b c D E e HD HE L L1 y L Detail F b2 I2


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    PDF 240K6X-A 240pin QFP240-G-3232-0

    TO metal package aluminum kovar

    Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
    Text: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/


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    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    2TC66

    Abstract: HPC16004 HPC16064
    Text: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16004-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance


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    PDF MNHPC16004-20-X HPC16064 HPC16004 s394143 HPC003U20/883, HPC083XXX/U/883 HPC004U20/883, HPC064XXX/U/883 2TC66

    HPC16004

    Abstract: HPC16064 core i7 alu HPC003
    Text: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16064-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance


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    PDF MNHPC16064-20-X HPC16064 HPC16004 s394143 HPC003U20/883, HPC083XXX/U/883 HPC004U20/883, HPC064XXX/U/883 core i7 alu HPC003

    ic type diagram

    Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
    Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION


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    TSOP 32 thermal resistance

    Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance
    Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION


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    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


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    PDF MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


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    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


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    PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


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    PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    27128 eprom

    Abstract: MC68HC05L4 000D 001B HC05 MC68HC705L4 Nippon capacitors
    Text: MC68HC05L4/D MC68HC05L4 HC05 TECHNICAL DATA MC68HC05L4 MC68HC705L4 TECHNICAL DATA !MOTOROLA !MOTOROLA 1 MC68HC05L4 MC68HC705L4 2 3 High-density Complementary Metal Oxide Semiconductor HCMOS Microcomputer Unit 4 5 6 7 All Trade Marks recognised. This document contains information on a new product. Specifications and information herein are


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    PDF MC68HC05L4/D MC68HC05L4 MC68HC705L4 27128 eprom MC68HC05L4 000D 001B HC05 MC68HC705L4 Nippon capacitors

    atmel 93C46

    Abstract: 93c46 atmel 93C46 national 93C46 national semiconductor 24c04 Atmel 93c46 I2C atmel 24c04 ATMEL 24c32 atmel 24c02 24c04a atmel
    Text: SERIAL EEPROM Serial EEPROM Cross Reference Guide The purpose of this document is to provide a quick way to determine the closest Microchip equivalent to Serial EEPROMs produced by other manufacturers. The cross reference section is broken down by manufacturer and lists all parts from that manufacturer, and the


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    PDF DS21090D-page atmel 93C46 93c46 atmel 93C46 national 93C46 national semiconductor 24c04 Atmel 93c46 I2C atmel 24c04 ATMEL 24c32 atmel 24c02 24c04a atmel

    MCP4001

    Abstract: MCP4002 MCP4004 MCP4008 DV164001 DVA16XP180 tssop 93c76 EM167200 84l transistor PIC16C77A
    Text: PRODUCT LINE CARD FOURTH QUARTER 1999 uring Feat nalog/ A New erface Int ucts Prod CURRENT MICROCHIP PRODUCT LINE PICmicro 8-BIT MICROCONTROLLER FAMILY PRODUCTS Program Memory OTP/FLASH Words Analog E PROM Data 8-Bit Com Memory RAM ADC paraBytes Bytes Channels tors


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    PDF 10-Bits PIC12CXXX 400ns PIC12C508 512x12 PIC12C508A PIC12C509 1024x12 PIC12C509A MCP4001 MCP4002 MCP4004 MCP4008 DV164001 DVA16XP180 tssop 93c76 EM167200 84l transistor PIC16C77A

    Untitled

    Abstract: No abstract text available
    Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul­ tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.


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    PDF O-220)

    TEMIC ecl

    Abstract: microcontroller radiation tolerance microcontroller radiation hard CLCC 84 CMOS NAND2
    Text: Temic Full Custom: MF Semiconductors 0.8-fxm BiCMOS Gate Array Description MF is a high speed gate array combining 10-GHz n-p-n and integration close to that of CMOS LSIs, keeping low bipolar transistors, with CMOS 0.8-nm, two metal layer power competitiveness.


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    PDF 10-GHz 10-May-96 TEMIC ecl microcontroller radiation tolerance microcontroller radiation hard CLCC 84 CMOS NAND2