C505C
Abstract: KABEL KOMPLETT STK 641 DS301 stk 402 STK IC MM-214
Text: CANopen-Chip System-Manual Ausgabe Februar 2001 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG CANopen-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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L-315d
L-370d
D-55135
C505C
KABEL KOMPLETT
STK 641
DS301
stk 402
STK IC
MM-214
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STK 641
Abstract: C505C DS301 STK IC dipsw_4 CIA DSP 402 STK 6
Text: CANopen-Chip System-Manual Ausgabe Februar 2000 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG CANopen-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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L-370d
D-55135
STK 641
C505C
DS301
STK IC
dipsw_4
CIA DSP 402
STK 6
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H2257
Abstract: No abstract text available
Text: H2257H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.2 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2257H06A5B
12-Mar-07
H2257
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78L05TO-92
Abstract: 74XX574 IEC1131-3 74xx138 C505C C540U C541U DO15 IEC1131-SPS-Chip sps_chip
Text: Systemhandbuch IEC1131-SPS-Chip Kurzübersicht Ausgabe März 1999 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG IEC1131-SPS-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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IEC1131-SPS-Chip
L-417d
D-55135
78L05TO-92
74XX574
IEC1131-3
74xx138
C505C
C540U
C541U
DO15
IEC1131-SPS-Chip
sps_chip
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Untitled
Abstract: No abstract text available
Text: H2085H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.7 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2085H06A5B
12-Mar-07
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93905
Abstract: HFA08TB60 equivalent
Text: H2090H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.7 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2090H06A5B
12-Mar-07
93905
HFA08TB60 equivalent
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Untitled
Abstract: No abstract text available
Text: H2195H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.2 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2195H06A5B
12-Mar-07
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Untitled
Abstract: No abstract text available
Text: H2115H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.7 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2115H06A5B
12-Mar-07
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Untitled
Abstract: No abstract text available
Text: H2066H06A5B Vishay High Power Products HEXFREDTM Die in Wafer Form PRODUCT SUMMARY VF 1.8 V maximum VBR 600 V Wafer 5" FEATURES RoHS • 100 % tested at probe COMPLIANT • Available in tape and reel upon request • Chip pack, and sawn on film (part number shown is for die
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H2066H06A5B
12-Mar-07
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LL HP
Abstract: chip die hp SOT 23 Package equivalent
Text: Linear Models for Diode Surface Mount Packages Application Note 1124 Introduction When linear or non-linear analyses are performed on diode circuits, both the diode chip and its package must be accurately modeled. The diode chip or die itself may be modeled using SPICE parameters,
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OT-23
OT323
OT-143
OT-363
OT-363
5966-0399E
LL HP
chip die hp
SOT 23 Package equivalent
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
slis089
THMC10DBQR
SSYA008
SZZA017A
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inductive proximity sensor transistor schematic
Abstract: DD 127 D TRANSISTOR SMBus programmable
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
inductive proximity sensor transistor schematic
DD 127 D TRANSISTOR
SMBus programmable
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2N3904
Abstract: 2N3906 HP8116A MO-137 SLIS089 THMC10 temperature monitor
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 − DECEMBER 1999 D Two-Wire SMBus Serial Interface D On-Chip and External Diode-Connected D D D D D Transistor Temperature Monitoring − ±2.5°C Accuracy for On-Die − ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
2N3904
2N3906
HP8116A
MO-137
temperature monitor
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
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HP8116A
Abstract: inductive proximity sensor transistor schematic DD 127 D TRANSISTOR SMBus programmable THMC10 2N3904 2N3906 MO-137 SLIS089
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
HP8116A
inductive proximity sensor transistor schematic
DD 127 D TRANSISTOR
SMBus programmable
2N3904
2N3906
MO-137
SLIS089
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
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MEDICAL PRESSURE die
Abstract: OEM PRESSURE SILICON DIE ANALOG MICROELECTRONICS AM5102-060-G low PRESSURE die TEMPERATURE OEM 22
Text: OEM PRESSURE SILICON DIE AM 5102 FEATURES GENERAL DESCRIPTION • Low Cost • Gage and Absolute Versions • Constant Current or Constant Voltage Drive • Millivolt Output • 5, 15, 30, 60, 100 and 300 PSI Ranges Available The AM 5102 is a silicon micromachined pressure sensing chip. The implanted piezoresistive structure forms a half–open Wheastone
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AM5102-060-G
MEDICAL PRESSURE die
OEM PRESSURE SILICON DIE
ANALOG MICROELECTRONICS
AM5102-060-G
low PRESSURE die
TEMPERATURE OEM 22
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SM 6185
Abstract: MSA0886 MSA-1104 200 mil BeO package GHZ micro-X Package INA-52063 msa-0504 MSA-0670 INA-01100 sot 326
Text: RFIC and MMIC Amplifiers Selection Guides Fixed Gain RFIC Amplifiers in order from lowest to highest frequency Part Number Type MSA-2111 MSA-3111 MSA-3135 MSA-3185 MSA-3186 INA-01100 INA-01170 HPMX-3002 INA-02100 INA-02170 INA-02184 INA-02186 MSA-0600 MSA-0611
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MSA-2111
MSA-3111
MSA-3135
MSA-3185
MSA-3186
INA-01100
INA-01170
HPMX-3002
INA-02100
INA-02170
SM 6185
MSA0886
MSA-1104
200 mil BeO package
GHZ micro-X Package
INA-52063
msa-0504
MSA-0670
INA-01100
sot 326
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sm 34063
Abstract: MMIC SOT 363 MSA-0835 MMIC sot-363 msa0304 INA-01170 msa-0686 INA-0218 ina-02170 MSA-1110
Text: RFIC and MMIC Amplifiers Selection Guides Fixed Gain RFIC Amplifiers in order from lowest to highest frequency Part Number MSA-2111 MSA-3111 MSA-3135 MSA-3185 MSA-3186 INA-01170 HPMX-3002 INA-02170 INA-02184 INA-02186 MSA-0611 MSA-0635 MSA-0636 MSA-0670
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SC-70)
OT-363
OT-343
IVA-05128
sm 34063
MMIC SOT 363
MSA-0835
MMIC sot-363
msa0304
INA-01170
msa-0686
INA-0218
ina-02170
MSA-1110
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PT 2102 ic
Abstract: HXTR-41Q1 HXTR-4101TXV 2N6679 HPAC-70GT HXTR-2101 HXTR-4101 hxtr-6105 6105tx BV EI 302 2003
Text: H E W L E T T - P A C K A R D n CMPNTS EOE D £3 44475Û4 m General Purpose Transistors HXTR-2001 Chip Technical Data Features ^ k laert ; LJ Generic Chip HXTR-2001 Recommended Die Attach and Bonding Procedures Eutectic Die Attach at a stage temperature of 410 ± 10°C under
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HXTR-2001
2N6679,
HXTR-2101,
HXTR-2102,
HXTR-4101,
HXTR-6105,
HXTR-6106,
HXTR-6106
MIL-S-19500,
PT 2102 ic
HXTR-41Q1
HXTR-4101TXV
2N6679
HPAC-70GT
HXTR-2101
HXTR-4101
hxtr-6105
6105tx
BV EI 302 2003
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Untitled
Abstract: No abstract text available
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C HV7022DJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022-C
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
44-lead
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HV09
Abstract: No abstract text available
Text: H V09 Lji Supertex inc. Product Objective Specification 32-Channel Symmetric Row Drivers Ordering Information Package Options * Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 - Lead Ceramic J-Bend MIL-STD-883 Processed"
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OCR Scan
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32-Channel
HV0923DJ
HV0923PJ
HV0923X
MIL-STD-883
RBHV0923DJ
HV0923
200mA
44-lead
V09Function
HV09
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ARSA
Abstract: 2C3741 2C3767
Text: 4-A PNP Power Transistor Chips 2C3741 FEATURES CHIP TYPE: AP • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 30,000 A Nominal Collector - Gold - 3,000 A Nominal • Die Thickness - 10 Mils Nominal • Complement to NPN 2C3767
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2C3741
2C3767
350/is.
0000e!
ARSA
2C3741
2C3767
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Untitled
Abstract: No abstract text available
Text: MPY100 B U R R -B R O W N * E 1 MI L I TARY & DIE VERSIONS AVAILABLE MULTIPLIER-DIVIDER FEATURES A P P LIC A T IO N S LOW COST DIFFERENTIAL INPUT ACCURACY 100% TESTED AND GUARANTEED NO EXTERNAL TRIMMING REQUIRED LOW NOISE 90pV. rmi, 10Hz I* 10kHz HIGHLY RELIABLE ONE-CHIP DESIGN
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OCR Scan
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MPY100
10kHz
T0-100
ANAL06
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