Contextual Info: SURFACE-MOUNT LED s o p t o e l e c t r o n i cs V I S HAY INTERTE C HNOLO G Y , IN C . CLCC - 6 / CLCC - 6 Flat p r o d uc t o v e r v i e w w w w. v i s h a y. c o m Surface-Mount LEDs CLCC-6 / CLCC-6 Flat Introduction Vishay’s high-power SMD LED’s in CLCC-6 and CLCC-6 flat ceramic package maintains the highest-possible heat dissipation

594 ph

Contextual Info: SURFACE-MOUNT LED s o p t o e l e c t r o n i cs V I S HAY INTERTE C HNOLO G Y , IN C . CLCC - 6 / CLCC - 6 Flat p r o d uc t o v e r v i e w w w w. v i s h a y. c o m Surface-Mount LEDs CLCC-6 / CLCC-6 Flat Introduction Vishay’s high-power SMD LED’s in CLCC-6 and CLCC-6 flat ceramic package maintains the highest-possible heat dissipation

Contextual Info: SURFACE-MOUNT LED s op t o e l e c t r o n i c s V ISHAY INTERTECHN O L O G Y , INC . CLCC - 6 / CLCC - 6 Flat p r o d u c t ov e r v i e w w w w. v i s h a y. c o m Surface-Mount LEDs CLCC-6 / CLCC-6 Flat Introduction Vishay’s high-power SMD LEDs in the CLCC-6 and CLCC-6 flat ceramic package maintain the highest-possible heat

VISHAY -GS08

Contextual Info: SURFACE-MOUNT LED s o p t o e l e c t r o n i cs V I S HAY INTERTE C HNOLO G Y , IN C . CLCC - 6 p r o d uc t o v e r v i e w w w w. v i s h a y. c o m Surface-Mount LEDs CLCC-6 Introduction Vishay’s CLCC-6 ceramic package for high-power LEDs maintains the highest-possible heat dissipation while providing the

CLCC68

Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors

Camera Sensor Omnivision 1.3 Mpixel

Abstract: OmniVision Technologies SCCB OV Sccb interface CLCC-48 omnivision* Sccb OV2610 SCCB DVD LENS circuit diagrams OV02610-C00A
Contextual Info: Omni ision Advanced Information Preliminary Datasheet TM OV2610 Color CMOS UXGA 2.0 MPixel CAMERACHIPTM Applications Ordering Information Product OV02610-C00A (Color, UXGA, SVGA) Package CLCC-48 Dynamic Range Scan Mode Maximum Exposure Interval Pixel Size

OV2610

Abstract: omnivision FSIN B1198 omnivision photo sensor pin diagram ov2610 omnivision cmos omnivision OV 620 UXGA image sensor omnivision Camera Sensor Omnivision 1.3 Mpixel
Contextual Info: Omni ision Advanced Information Preliminary Datasheet TM OV2610 Color CMOS UXGA 2.0 MPixel CAMERACHIPTM Applications Ordering Information Product Package OV2610 (Color, UXGA, SVGA) CLCC-48 Dynamic Range Scan Mode Maximum Exposure Interval Pixel Size Dark Current

26112

Abstract: JESD22 CLCC 96 CY7C374I-JC Nitto-MP8000
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97127VERSION 1.1 August, 1997 UltraLogic 128-Macrocell Flash CPLD CY7C374i/CY7C375i Cypress Semiconductor UltraLogic 128-Mcell Flash CPLD Device: CY7C374I/375I Package: 84-pin PLCC/84-pin CLCC QTP# 97127 Version 1.0

hakko 941

Contextual Info: GTDW1656JTE-24Y-TR Specifications Features Package CLCC type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・100lm/W(2,400K, CRI(Ra):85) of environmentally friendly like CO2 reduction, white color source. ・According to ANSI standard.

Contextual Info: XOCLCC6EVB Crystal Clock Oscillator Module Evaluation Board User's Manual for NBX Family in 6 Pin CLCC 5 mm x 7 mm Package http://onsemi.com EVAL BOARD USER’S MANUAL Generic Evaluation Board: XOCLCC6EVB Devices: NBXxxxx Description Evaluation Board Manual Document Features

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Agilent cmos sensor

Abstract: ADCS-2121 ADCS-1121 vga capture Agilent, CMOS sensor 352x288
Contextual Info: Agilent Technologies CMOS Monochrome Image Sensors ADCS-1121 CIF , ADCS-2121 (VGA) Product Overview Features • High quality, low cost CMOS image sensors • Industry-standard 32-pin CLCC package • VGA resolution (640H x 480V)– ADCS-2121 Description

Contextual Info: Standard Product Specifications GTDW1656JTE-27X-TR Features Package CLCC type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・124lm/W(2,700K, CRI(Ra):70) of environmentally friendly like CO2 reduction, white color source. ・According to ANSI standard.

Contextual Info: GSPW16□3J Series GSPW1643JTE GSPW1653JTE High Efficiency , Power LED Features Package CLCC Type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・133lm/W(5,000K, CRI(Ra):70) of environmentally friendly like CO2 reduction, white color source.

AM0393-320R

Abstract: IPC-A-600E MIL-P-55110D MIL-P-55110-D PCB BOARD DIMENSION BY SMA CONNECT AN8020 casey C0603C104K4RAC HP6624A marking code C3 SMD ic
Contextual Info: XOCLCC6EVB Crystal Clock Oscillator Module Evaluation Board Manual for NBX Family in 6 Pin CLCC 5mm X 7mm Package http://onsemi.com Generic Evaluation Board: XOCLCC6EVB Devices: NBXxxxx Prepared by: Senad Lomigora, Casey Stys and Paul Shockman Description

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

OmniVision CMOS pcb

Abstract: omnivision Sccb OV7431 omnivision* Sccb camerachips CLCC-28 omni 408 OmniVision Technologies a440 ceramic
Contextual Info: Omni ision Advanced Information Preliminary Datasheet TM OV7430 B&W CMOS Analog CAMERACHIPTM OV7431 B&W CMOS Analog CAMERACHIPTM Applications Ordering Information Product Package OV7430 B&W, VGA, EIA, CVO CLCC-28, PLCC-28 OV7431 (B&W with Microlens, VGA, EIA, CVO)

Contextual Info: Standard Product Specifications GTDW1646JTE-40X-TR Features Package CLCC type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・143lm/W(4,000K, CRI(Ra):70) of environmentally friendly like CO2 reduction, white color source. ・According to ANSI standard.

Temprel

Abstract: JIS-C-0806
Contextual Info: Standard Product Specifications GTDW1656JTE-30Z-TR Features Package CLCC type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・86lm/W(3,000K, CRI(Ra):95) of environmentally friendly like CO2 reduction, white color source. ・According to ANSI standard.

Contextual Info: Standard Product Specifications GTDW1656JTE-40Y-TR Features Package CLCC type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・119lm/W(4,000K, CRI(Ra):85) of environmentally friendly like CO2 reduction, white color source. ・According to ANSI standard.

GSPW1653JTE

Contextual Info: GSPW16□3J Series GSPW1643JTE GSPW1653JTE High Efficiency , Power LED Features Package CLCC Type Outer dimension 5.0 x 5.0 x 1.0mm L x W x H Product features ・133lm/W(5,000K, CRI(Ra):70) of environmentally friendly like CO2 reduction, white color source.

LWG6SG

Abstract: CCD barcode
Contextual Info: VLMW61. Vishay Semiconductors Power SMD LED CLCC-6 20623 DESCRIPTION The VLMW61. is one of the most robust and light efficient LEDs in the market. Its ceramic package makes it the ideal light source in applications of high thermal considerations allowing the additional current

CCD barcode

Abstract: E4 smd
Contextual Info: VLMW61. Vishay Semiconductors Power SMD LED CLCC-6 20623 DESCRIPTION The VLMW61. is one of the most robust and light efficient LEDs in the market. Its ceramic package makes it the ideal light source in applications of high thermal considerations allowing the additional current