TDA8943SF
Abstract: TDA8943SF/N1 TDA8943 DBS17P TDA8941P TDA8942P TDA8944J TDA8945S TDA8946J TDA894x
Text: TDA8943SF 7 W mono Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. General description The TDA8943SF is a single-channel audio power amplifier with an output power of 7 W at an 8 Ω load and a 12 V supply. The circuit contains a Bridge Tied Load (BTL)
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TDA8943SF
TDA8943SF
TDA894x
TDA8943SF/N1
TDA8943
DBS17P
TDA8941P
TDA8942P
TDA8944J
TDA8945S
TDA8946J
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TDA8945S
Abstract: SIL9P DBS17P TDA8941P TDA8942P TDA8943SF TDA8944J TDA8946J MBK938 TDA894x
Text: TDA8945S 15 W mono Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. General description The TDA8945S is a single-channel audio power amplifier with an output power of 15 W at an 8 Ω load and an 18 V supply. The circuit contains a Bridge Tied Load
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TDA8945S
TDA8945S
TDA894x
SIL9P
DBS17P
TDA8941P
TDA8942P
TDA8943SF
TDA8944J
TDA8946J
MBK938
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TDA8946J
Abstract: DBS17P TDA8944J DBS PACKAGES DESCRIPTION tda8946 TDA8941P TDA8942P TDA8943SF TDA8945S audio amplifier tda8946j
Text: TDA8946J 2 x 15 W stereo Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. General description The TDA8946J is a dual-channel audio power amplifier with an output power of 2 x 15 W at an 8 Ω load and an 18 V supply. The circuit contains two Bridge Tied
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TDA8946J
TDA8946J
17-pin
TDA894x
DBS17P
TDA8944J
DBS PACKAGES DESCRIPTION
tda8946
TDA8941P
TDA8942P
TDA8943SF
TDA8945S
audio amplifier tda8946j
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TDA8944J
Abstract: DBS17P TDA8941P TDA8942P TDA8943SF TDA8945S TDA8946J
Text: TDA8944J 2 x 7 W stereo Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. General description The TDA8944J is a dual-channel audio power amplifier with an output power of 2 x 7 W at an 8 Ω load and a 12 V supply. The circuit contains two Bridge Tied Load
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TDA8944J
TDA8944J
17-pin
TDA894x
DBS17P
TDA8941P
TDA8942P
TDA8943SF
TDA8945S
TDA8946J
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DBS17P
Abstract: TDA8941P TDA8942P TDA8943SF TDA8944J TDA8945S TDA8946J TDA894x
Text: TDA8941P 1.5 W mono Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. Description The TDA8941P is a single-channel audio power amplifier for an output power of 1.5 W at a 16 Ω load and a 9 V supply. The circuit contains a Bridge Tied Load (BTL)
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TDA8941P
TDA8941P
TDA894x
DBS17P
TDA8942P
TDA8943SF
TDA8944J
TDA8945S
TDA8946J
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TDA894x
Abstract: TDA8944J DBS17P TDA8941P TDA8942P TDA8943SF TDA8945S TDA8946J
Text: TDA8942P 2 x 1.5 W stereo Bridge Tied Load BTL audio amplifier 14 April 1999 Preliminary specification 1. Description The TDA8942P is a dual-channel audio power amplifier for an output power of 2 x 1.5 W at a 16 Ω load and a 9 V supply. The circuit contains two Bridge Tied Load
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TDA8942P
TDA8942P
16-pin
TDA894x
TDA8944J
DBS17P
TDA8941P
TDA8943SF
TDA8945S
TDA8946J
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TQFP100 footprint
Abstract: TQFP80 footprint diode databook package outline SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
TQFP100 footprint
TQFP80 footprint
diode databook package outline
SMD codes databook
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
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LQFP64. footprint
Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
LQFP64. footprint
dual infrared transistor
TQFP80 footprint
QFP package weight
diode databook package outline
SMD Packages
TQFP100 footprint
LQFP32
LQFP48
LQFP64
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TQFP80 footprint
Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
TQFP80 footprint
TQFP100 footprint
QFP160
diode databook package outline
SMD CODE databook
SMD Packages
TQFP80 package
LQFP32
LQFP48
LQFP64
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TQFP100 footprint
Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
TQFP100 footprint
TQFP80 footprint
SMD CODE databook
HDIP
TQFP 44 PACKAGE footprint
diode databook package outline
SMD Packages
TQFP80 package
LQFP32
LQFP48
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BP317
Abstract: TDA1387T
Text: INTEGRATED CIRCUITS DATA SHEET TDA1387T Stereo Continuous Calibration DAC CC-DAC Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 11 Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC (CC-DAC)
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TDA1387T
16-bit
TDA1387T
SCD47
513061/50/02/pp16
BP317
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BP317
Abstract: TDA1387T
Text: INTEGRATED CIRCUITS DATA SHEET TDA1387T Stereo Continuous Calibration DAC CC-DAC Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 11 Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC (CC-DAC)
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TDA1387T
16-bit
TDA1387T
SCD47
513061/50/02/pp16
BP317
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adc/dac datasheet
Abstract: QFP44 footprint QFP44 UDA1309H
Text: INTEGRATED CIRCUITS DATA SHEET UDA1309H Low-power stereo bitstream ADC/DAC Product specification Supersedes data of 1996 Jul 18 File under Integrated Circuits, IC01 1998 Jan 06 Philips Semiconductors Product specification Low-power stereo bitstream ADC/DAC
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UDA1309H
256fs
post-filteri31
SCA57
547027/1200/02/pp24
adc/dac datasheet
QFP44 footprint
QFP44
UDA1309H
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TDA8576T
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA8576T Class-H high-output voltage level line driver Preliminary specification File under Integrated Circuits, IC01 1996 May 06 Philips Semiconductors Preliminary specification Class-H high-output voltage level line driver
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TDA8576T
TDA8576T
SCDS48
517021/1200/01/pp12
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IEC134
Abstract: QFP44 TDA8771A TDA8771AH
Text: INTEGRATED CIRCUITS DATA SHEET TDA8771A Triple 8-bit video Digital-to-Analog Converter DAC Product specification File under Integrated Circuits, IC02 1996 Jan 25 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC)
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TDA8771A
TDA8771A
SCDS47
537021/1100/01/pp20
IEC134
QFP44
TDA8771AH
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TDA8771A
Abstract: TDA8771AH IEC134 QFP44
Text: INTEGRATED CIRCUITS DATA SHEET TDA8771A Triple 8-bit video Digital-to-Analog Converter DAC Product specification File under Integrated Circuits, IC02 1996 Jan 25 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC)
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TDA8771A
TDA8771A
SCDS47
537021/1100/01/pp20
TDA8771AH
IEC134
QFP44
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M5M442256
Abstract: QFP100 SAB9077H
Text: INTEGRATED CIRCUITS DATA SHEET SAB9077H Picture-In-Picture PIP controller Preliminary specification File under Integrated Circuits, IC02 1996 Aug 07 Philips Semiconductors Preliminary specification Picture-In-Picture (PIP) controller SAB9077H FEATURES Display
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SAB9077H
SAB9077H
SCA51
537021/50/01/pp32
M5M442256
QFP100
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Untitled
Abstract: No abstract text available
Text: The TDA8946J is a dual-channel audio power amplifier with an output power of 2 x 15 W at an 8 Q, load and an 18 V supply. The circuit contains two Bridge Tied Load BTL amplifiers with an all-NPN output stage and standby/mute logic. The TDA8946J comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8946J is
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TDA8946J
17-pin
TDA894x
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TDA8943
Abstract: No abstract text available
Text: The TDA8943SF is a single-channel audio power amplifier with an output power of 7 W at an 8 Q, load and a 12 V supply. The circuit contains a Bridge Tied Load BTL amplifier with an all-NPN output stage and standby/mute logic. The TDA8943SF comes in a 9-lead single in-line (SIL) medium power package. The TDA8943SF is
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TDA8943SF
TDA894x
D4B77
TDA8943
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TDA8943
Abstract: No abstract text available
Text: The TDA8945S is a single-channel audio power amplifier with an output power of 15 W at an 8 Q, load and an 18 V supply. The circuit contains a Bridge Tied Load BTL amplifier with an all-NPN output stage and standby/mute logic. The TDA8945S comes in a 9-lead single in-line (SIL) power package. The TDA8945S is
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TDA8945S
TDA894x
TDA8943
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TDA8946
Abstract: philips audio power amplifier
Text: The TDA8941P is a single-channel audio power amplifier for an output power of 1.5 W at a 16 Q, load and a 9 V supply. The circuit contains a Bridge Tied Load BTL amplifier with an all-NPN output stage and standby/mute logic. The TDA8941P comes in an 8-pin dual in-line (DIP8) package.The TDA8941P is printed-circuit board
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TDA8941P
TDA894x
D4B76
TDA8946
philips audio power amplifier
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TDA8946
Abstract: No abstract text available
Text: | y : I . " ’ ' """. § l •. 14 & p r il 1 8 88 s p e c H ra is o rs The TDA8944J is a dual-channel audio power amplifier with an output power of 2 x 7 W at an 8 Q, load and a 12 V supply. The circuit contains two Bridge Tied Load
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TDA8944J
17-pin
TDA894x
TDA8946
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TDA*8943sf
Abstract: No abstract text available
Text: The TDA8942P is a dual-channel audio power amplifier for an output power of 2 x 1 . 5 W a t a 1 6 £ i load and a 9 V supply. The circuit contains two Bridge Tied Load BTL amplifiers with an all-NPN output stage and standby/mute logic. The TDA8942P comes in a 16-pin dual in-line (DIP) package.The TDA8942P is
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TDA8942P
16-pin
TDA894x
D4B79
TDA*8943sf
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LQFP64. footprint
Abstract: T317 HDIP
Text: Philips Semiconductors Soldering Package information INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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