Untitled
Abstract: No abstract text available
Text: WILLAS General Purpose Transistors 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE FM120-M+ THRU MMBT3906TT1 FM1200-M+ Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
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OD-123+
FM120-M+
MMBT3906T
FM1200-M+
OD-123H
FM120-MH
FM130-MH
FM140-MH
FM150-MH
FM160-MH
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ATSAMR21G18A
Abstract: 2540AT
Text: USER GUIDE Atmel SAM R21 Xplained Pro Preface The Atmel SAM R21 Xplained Pro evaluation kit is a hardware platform to evaluate the ATSAMR21G18A microcontroller. Supported by the Atmel Studio integrated development platform, the kit provides easy access to the features of the Atmel ATSAMR21G18A and explains how to
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ATSAMR21G18A
ATSAMR21G18A.
42243B-MCU-06/2014
2540AT
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RCB256RFR2-XPRO User Guide
Abstract: User Guides
Text: USER GUIDE RCB256RFR2-XPRO User Guide Introduction This user guide describes how to get started with the Atmel RCB256RFR2XPRO extension board. The extension boards is targeted for evaluating the features of the Atmel ATmega256RFR2 wireless SoC with PCB antenna.
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RCB256RFR2-XPRO
RCB256RFR2XPRO
ATmega256RFR2
2203A-MCU-11/2013
RCB256RFR2-XPRO User Guide
User Guides
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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Untitled
Abstract: No abstract text available
Text: I I I I T PRODUCT NUMBER 8 5 6 4 9 —XYY 34.5 ref 8 REF. 2 REF. RECOMMENDED PCB LAYOUT HOLE PATTERN AT COMPONENT SIDE NOTES: 1 BODY MAT’L: LIQUID CRYSTAL POLYMER 30% GLASS FLAME RETARDANT ACC. UL 94-V O COLOR NATURAL. 2 PIN MAT’ L: PHOSPHOR BRONZE. 3 PLATING ON PRESS FIT AREA SnPb
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-2Y03
--X01
--X02
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Untitled
Abstract: No abstract text available
Text: • p w r t f af M akrnl CofparaBon t r i b dritoarad on _ • S w ift to Mt ta ba rtirlrm f. iwraduead or uaad. - *-* •-“- y - -*-* to g m M to M o a t to • or In part tar Manufatto» ar aaia to anwana amar M i tmptoial — I 4
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HK4748
L717TW
L717TWC27W2P
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IRF2525
Abstract: 91641
Text: PD 9.1641 International Iö R Rectifier IRF2525 PRELIMINARY HEXFET Power MOSFET • • • • • Advanced Process Technology Dynamic dv/dt Rating 150°C Operating Temperature Fast Switching Fully Avalanche Rated V oss = 2 5 0 V RDS on = 0 .1 2 5 Q Description
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IRF2525
IRF2525
91641
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diode sy 171 10
Abstract: "DIODE" SY 171 1 g
Text: PD - 9.12 64 C International IOR Rectifier IRF7606 HEXFET Power MOSFET Generation V Technology Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile <1.1 mm Available in Tape & Reel Fast Switching V qss = -30V f^DS(on) = 0.09Î2
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EIA-541.
diode sy 171 10
"DIODE" SY 171 1 g
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Untitled
Abstract: No abstract text available
Text: S ta n d a rd P r o d u c t PM I I PMC-Sierra, Inc. / PREUMINARY INFORMATION PM5361 TUPP SONET/SDH TRIBUTARY UNIT PAYLOAD PROCESSOR FEA TU RES • Configurable, multi-channel, payload processor for alignment of SONET virtual tributaries VTs or SDH tributary units (TUs). Processes an STS-3 or STM-1 byte
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PM5361
920526S7
920102S8
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P600L-72
Abstract: P600E-12 P600L fuse MIL-F-12456 P600L-R 70720 MIL-F-23419 P600L-72-5
Text: fì€ M , INC 11525 Sorrento Valley Rd. San Diego, California 92121 858 481-0210 SPECIFICATION SHEET P600L CURRENT LIMITING FUSE REVISION: DATE: DRAWN: CHECKED: APPROVED: ECN: A B C D E F G H 11/87 5/90 5/92 7/94 6/95 12/95 6/96 1/97 Jeff Montgomery Yan Ma
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P600L
-55EC
125EC
150EC)
P600L-M
SK406
P600L
P600L-72
P600E-12
P600L fuse
MIL-F-12456
P600L-R
70720
MIL-F-23419
P600L-72-5
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qml-38535
Abstract: 87C51 T0D47Q 5962-87684 ccpm
Text: REVISIONS LTR DESCRIPTION DATE APPROVED YR-M0-DA A Add case outline U. Add vendor cage 18325. Add programming method B. Changes 4.3.1c and 4.3.1e. Editorial changes throughout. 89-03-01 W. Heckman B Add device type 02, editorial changes throughout. Add test
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5962-R231-92.
RUL-103
MIL-BUL-103
QML-38535.
QML-38535
MIL-BUL-103.
TDG47GÃ
87C51
T0D47Q
5962-87684
ccpm
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54ACTS85
Abstract: HL6 smd qml-38535 CDFP4-F16 GDIP1-T16 CDFP4-F16 comparator
Text: REVISIONS LTR DESCRIPTION APPROVED DATE YR-MO-DA REV SHEET REV SHEET REV REV STATUS OF SHEETS SHEET PREPARED BY Thanh V . Nguyen PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE
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5962-E444-96
TQQM70Ã
M1L-HDBK-103.
MIL-HDBK-103
100470fl
54ACTS85
HL6 smd
qml-38535
CDFP4-F16
GDIP1-T16
CDFP4-F16 comparator
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PC410L
Abstract: PC410LENIP mark code t4 X3 diode PC410LEN E64380 transistor uxr phototransistor TIL 51 5911UG uxr transistor
Text: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATIONFOR PHOTOCOUPLER. MODEL No. PC410L o Business dealing name PC410LENIP Business dealing name PC410LEYIP Specified for Enclosed please find copies of the Specifications which consists of 15 pages including cover.
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PC410L
PC410LENIP
PC410LEYIP
PC410hen
PC410LEY1P
PC410L
PC410LENIP
mark code t4 X3 diode
PC410LEN
E64380
transistor uxr
phototransistor TIL 51
5911UG
uxr transistor
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Untitled
Abstract: No abstract text available
Text: PRELIM1 PRELIMINARY l i PIONEER ” S E M IC O N D U C T O R PI74FCT16500T PI74FCT162500T CORPO OR R AA TT II O O N II 11 I 11 I I I I 11 11 I 11 11 I I I I I 11 11 I I I 11 11 11 11 11 I I I I 11 I I I II II 11 I I Fast CMOS 18-Bit Registered Transceivers
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PI74FCT16500T
PI74FCT162500T
18-Bit
PI74FCT16500T
PI74FCT162500T
PI74FCT162652
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pj 929 diode picture
Abstract: bf471 A7R SMD Transistor TDA8391 transistor f488 tda8351 pin-compatible tda1000 Germanium drift transistor marking 3U 3T 3C diode germanium transistor
Text: Philips Sem iconductors Semiconductors for Television and Video Systems Contents PART A page SELECTION GUIDE Functional index 5 Numerical index 17 Maintainance list 27 GENERAL Quality 31 Pro Electron type numbering system for Discrete Semiconductors 31 Pro Electron type numbering system for Integrated Circuits
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BA481
SAA7197
SAA7199B
TDA4680
TDA4685
pA733C
LFC02
MEH469
pj 929 diode picture
bf471
A7R SMD Transistor
TDA8391
transistor f488
tda8351 pin-compatible
tda1000
Germanium drift transistor
marking 3U 3T 3C diode
germanium transistor
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D51820
Abstract: ds1820 1 wire temperature sensor termometer control circuit diagram
Text: DS1820 P R E L IM IN A R Y DALLAS SEMICONDUCTOR DS1820 1-W ire Digital Thermometer PIN ASSIGNMENT FEATURES • U n iq u e 1- W ir e in te rfa c e re q u ire s o n ly o n e p o rt pit for c o m m u n ic a tio n • M u ltid ro p c a p a b ility s im p lifie s d is trib u te d te m p e ra iu re
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DS1820
35PACKAGE
D51820
ds1820 1 wire temperature sensor
termometer control circuit diagram
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ATS 16Mhz
Abstract: 80C51 MSU2958 MSU2958C16 MSU2958C25 MSU2958C40 ZD 103 ma
Text: •■ MSU2958 Preliminary MOSEL VITEUC INC. Ü September 1999 8 - Bit Micro-controller Product List with 3P.KB Hash embedded MSU2958 C l 6 ,16 MHz 32 KB internal memory MCU MSU2958 C25, 25 MHz 32 KB internal memory MCU MSU2958 C40,40 MHz 32 KB internal memory MCU
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MSU2958
MSU2958C16
MSU2958C25,
MSU2958C40,
MSU2958
MSU2958Ã
MSU29:
58ihh
27BSC
ATS 16Mhz
80C51
MSU2958C25
MSU2958C40
ZD 103 ma
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Untitled
Abstract: No abstract text available
Text: DS1820 PRELIMINARY DALLAS SEMICONDUCTOR FEATURES DS1820 One-Wire Digital Thermometer PIN ASSIGNMENT • Unique 1-W ire interface requires only one port pin for comm unication • M ultidrop capability sim plifies distributed temperature sensing applications
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DS1820
Bbl413Q
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A 4506 Optocoupler
Abstract: optocoupler HP 450 f 8 pin ic A 4506 HP 450 opto coupler CUB MARKING CODE HCNW4506 4506 mosfet inverter optocoupler 450
Text: 1 T JnM H E W L E T T * 1 SUM PA C K A R D Intelligent Power Module and Gate Drive Interface Optocouplers T e c h n ic a l D a ta h c pl -4 5 0 6 HCPL-0466 HCNW4506 F ea tu res Applications • Perform ance Specified for Common IPM A pplications over Industrial Tem perature
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HCPL-0466
HCNW4506
HCNW4506
HCPL-4506
UL1577
HCPL-4506,
5964-8904E
A 4506 Optocoupler
optocoupler HP 450 f
8 pin ic A 4506
HP 450 opto coupler
CUB MARKING CODE
4506 mosfet inverter
optocoupler 450
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HCTS541
Abstract: qml-38535 qml38535
Text: REVISIONS LTR DATE DESCRIPTION APPROVED Y R -M O -D A REV SHEET REV SHEET 15 16 REV STATUS OF SHEETS PM IC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE REV SHEET 1 2 3 4
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M1L-BUL-103.
MIL-BUL-103
HCTS541
qml-38535
qml38535
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