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    COMPONENT CONSTRUCTION Search Results

    COMPONENT CONSTRUCTION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    XPQR8308QB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 80 V, 350 A, 0.00083 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    COMPONENT CONSTRUCTION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    04ZDS00003

    Abstract: madison
    Text: 1 PAIR 28 AWG + 2 CONDUCTOR 28 AWG SHIELDED USB CABLE COLOR CODE Component I Qty=1 Component # Component Conductor #1 Conductor #2 1 I Green White 2 II Black 3 II Red Component II (Qty=2) Binder ELECTRICAL CHARACTERISTICS Inner Shield Drain Wire Component I – 28 AWG Pair


    Original     		PDF AP-03A 04ZDS00003 04ZDS00003 madison

    Component Construction

    Abstract: componen metal detector metal detectors circuit leadframe photodetector emitter metal detector CIRCUIT metal detector datasheet
    Text: Component Construction Vishay Semiconductors Component Construction Photodetector and infrared emitter components are available in plastic or metal packages. Plastic devices mostly include a lens to improve radiant sensitivity or radiant intensity. Detector chips are mounted on


    Original     		PDF 94erating 06-Jun-08 Component Construction componen metal detector metal detectors circuit leadframe photodetector emitter metal detector CIRCUIT metal detector datasheet

    WIPED 51

    Abstract: B3F-6020 B3F-6050 B3F-6150 transistor pt 6020 B3F-6000 B3F-6002 B3F-6005 B3F-6022 B3F-6052
    Text: Mechanical Key Switch Radial Taped Radial Switches IB3F–6 IB3F_6 Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the


    Original     		PDF B3F-6000 B3F-6002 B3F-6102 B3F-6005 B3F-6105 B3F-6020 B3F-6120 WIPED 51 B3F-6020 B3F-6050 B3F-6150 transistor pt 6020 B3F-6000 B3F-6002 B3F-6005 B3F-6022 B3F-6052

    C 6351 G

    Abstract: No abstract text available
    Text: Back Mechanical Key Switch Radial B3F-6 Taped Radial Switches Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the


    Original     		PDF B3F-6000 B3F-6000 C 6351 G

    EIA-RS-198

    Abstract: No abstract text available
    Text: Surface Mounting Guide MLC Chip Capacitors Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave


    Original     		PDF MIL-STD202 EIA-RS-198. EIA-RS-198

    Untitled

    Abstract: No abstract text available
    Text: 24 V and 300 V DC-DC Converter Modules Module Construction & Component Derating This document provides a detailed view of the construction for Maxi, Mini and Micro DC-DC converters as well as the component design derating guidelines. Qualification Testing


    Original     		PDF MIL-STD-810F,

    Untitled

    Abstract: No abstract text available
    Text: File E156996 Project 94ME78496 October 27, 1994 REPORT on COMPONENT - POWER SUPPLIES, INFORMATION TECHNOLOGY EQUIP. INCLUDING ELEC. BUSINESS EQUIP. * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * COMPONENT - POWER SUPPLIES, TELEPHONE Westcor Corp.


    Original     		PDF E156996 94ME78496

    Untitled

    Abstract: No abstract text available
    Text: Mechanical Key Switch Radial B3F-6 Taped Radial Switches Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the B3F Series for a definite click action.


    Original     		PDF B3F-6000 B3F-6002,

    MIL-STD-810F shock

    Abstract: MIL-STD-810F 500.4 V24A12M400BL MIL-STD-810F MIL-STD-810F 509.4 V24C5M100BL helicopter construction MIL-STD-810F Acceleration V24B5H200BL helicopter main rotor design
    Text: 24 V and 300 V DC-DC Converter Modules Module Construction & Component Derating This document provides a detailed view of the construction for Maxi, Mini and Micro DC-DC converters as well as the component design derating guidelines. Module Size/Power Chart


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Standard Products!! SLF10145-H TYPE SMD Power Inductor Component Image & Dimension Features : Pb Free!! 4.5+/-0.3mm a Component Size : Mount Area : 10.1mm x 10.1mm Low Profile : 4.8mm Max. Height b) Generic use for portable DC/DC Converter. c) High Magnetic Shield Construction should actualize


    Original     		PDF SLF10145-H 100M2R5-H 150M2R2-H 220M1R9-H 330M1R6-H 470M1R420% -40degC 95degC

    96182 eaton

    Abstract: MS3320 ms3320-5 eaton 96182 MS35206 DATA SHEET ms25244 MS3320-20 MS26574 ms3320-2 MS3320-10
    Text: Electric Distribution & Controls Circuit Breakers Military/Aerospace Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their


    Original     		PDF TF300-1 TF300-1A 96182 eaton MS3320 ms3320-5 eaton 96182 MS35206 DATA SHEET ms25244 MS3320-20 MS26574 ms3320-2 MS3320-10

    A42 B331

    Abstract: 96182 eaton eaton 96182 MS27903-1 ms90311 mil-s-8834 NEC k719 ms24547-1 MS25237 nec k591
    Text: Electric Distribution & Controls Switch Catalog Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their subsystem integration


    Original     		PDF TF300-5 A42 B331 96182 eaton eaton 96182 MS27903-1 ms90311 mil-s-8834 NEC k719 ms24547-1 MS25237 nec k591

    96182 eaton

    Abstract: 1841-1-5620 eaton 96182 sm600ba SM15CXD1 SM601BA SM600BA75A1 MS24141-D1 SM15AXD1 ms24171-d1
    Text: Electric Distribution & Controls Relay Catalog Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their subsystem integration capability


    Original     		PDF TF300-9 96182 eaton 1841-1-5620 eaton 96182 sm600ba SM15CXD1 SM601BA SM600BA75A1 MS24141-D1 SM15AXD1 ms24171-d1

    SLF12575-TYPE-H

    Abstract: SLF12575T
    Text: TDK New Products!! SLF12575-TYPE-H Automotive Target SMD Power Inductor Component Image & Dimension Features : LEAD Free!! a Component Size : Mount Area : 12.5mm x 12.5mm Low Profile : 7.85mm Max. Height 7.5±0.35 b) Generic use for Automotive Appliance.


    Original     		PDF SLF12575-TYPE-H SLF12575-TYPE-H SLF12575T

    TECHNICAL FILE

    Abstract: LAMBDA Part LAMBDA
    Text: www.lambdapower.com Jan 2007 WHAT LEGISLATION APPLIES TO COMPONENT POWER SUPPLIES? There are many directives that could affect the end equipment into which component power supplies are fitted, and of course some affect the power supplies themselves. Here Bob Taylor,


    Original     		PDF 73/23/EEC 50VAC 1000VAC 75VDC SC62A TECHNICAL FILE LAMBDA Part LAMBDA

    TCDT1120

    Abstract: TCDT1124 TCDT1120G VDE0884 IEC60065
    Text: TCDT1120/ TCDT1120G Vishay Semiconductors Optocoupler, Phototransistor Output Features • • • • • Extra low coupling capacity - typical 0.2 pF High Common Mode Rejection Four CTR groups available Lead-free component Component in accordance to RoHS 2002/95/EC


    Original     		PDF TCDT1120/ TCDT1120G 2002/95/EC 2002/96/EC IEC60950 IEC60065 VDE0884) 08-Apr-05 TCDT1120 TCDT1124 TCDT1120G VDE0884 IEC60065

    Untitled

    Abstract: No abstract text available
    Text: Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their subsystem integration capability to better serve the consolidating global


    Original     		PDF AS9100. TF300-5B

    SMD Marking WZR

    Abstract: weidmuller eg 01 1324460000 weidmuller relay AP 309 bsk 45 dk qb weidmuller seg/u 2 Pin Screw Terminal Block Connector 5mm Pitch 0383560000
    Text: Component Carriers and Housings 292 Component Carriers and Housings Weidmüller EG 4 housing are suitable for the installation of electronic components with a maximum diameter or width of 4.5 mm. Four independent clamping yoke screw connections are available.


    Original     		PDF

    gold metal detectors

    Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
    Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of


    Original     		PDF CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008

    TCDT1120

    Abstract: No abstract text available
    Text: TCDT1120/ TCDT1120G Vishay Semiconductors Optocoupler, Phototransistor Output Features • • • • • Extra low coupling capacity - typical 0.2 pF High Common Mode Rejection Four CTR groups available Lead-free component Component in accordance to RoHS 2002/95/EC


    Original     		PDF TCDT1120/ TCDT1120G 2002/95/EC 2002/96/EC UL1577, E76222 IEC60950 IEC60065 VDE0884) VDE0884 TCDT1120

    bicc* cable

    Abstract: BICC
    Text: BICC BRAND-REX LTD 24AWG 25 Pair CAT 5 Our Ref: PowerPlus 155 COMPONENT II CABLE CONSTRUCTION Conductor 24 AW G solid bare copper Insulation Polyolefin Pair 2 cores twisted together to form a pair Component I 3 pairs twisted together Component II 4 pairs twisted together


    OCR Scan     		PDF 24AWG bicc* cable BICC

    25PR

    Abstract: BICC bicc* cable
    Text: BM8BHR8BEBSB8 BICC BRAND-REX LTD 24AW G 25 Pair CAT 5 Our Ref: C5U - 25PR - HF1 CABLE CONSTRUCTION Conductor 24 AWG solid bare copper Insulation Polyolefin Pair 2 cores twisted together to form a pair Component I 3 pairs twisted together Component II 4 pairs twisted together


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: COMPONENT RESEARCH CO I bSE D • 53G3111 □□□□71T fill A19 Component Research METALLIZED POLYPHENYLENE SULFIDE A 1 9 S P E C IF IC A T IO N S CONSTRUCTION M etallized polyphenylene su lfid e d ie le ctric, herm etically sealed, extended metal film


    OCR Scan     		PDF 53G3111 IL-C-83421. 100Hz, A19B203 A19B223 A19B273 A19B333 A19B393

    Untitled

    Abstract: No abstract text available
    Text: COMPONENT RESEARCH — Component Research CO I bSE D • 2303^11 0000714 E3T D I O METALLIZED _ ^ PO LY C A R B O N A T E CAPACITOR * P 1 2 S P E C IF IC A T IO N S CONSTRUCTION Metallized polycarbonate dielectric, hermetically sealed, extended metal film electrodes


    OCR Scan     		PDF MIL-C-83421.