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    CONTACT SPIKING MOS Search Results

    CONTACT SPIKING MOS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    XPJ1R004PB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 160 A, 0.001 Ω@10V, S-TOGL Visit Toshiba Electronic Devices & Storage Corporation

    CONTACT SPIKING MOS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    a5657

    Abstract: EOS ESD S 61.1 A5655 transistor databook st 2000 Packaging
    Text: ESD/EOS 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD can occur in the manufacturing, shipping, receiving, and field handling of integrated circuits or


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    MIL-STD 833 test method 3015

    Abstract: marking cdm Physical Analysis of Data on Fused-Open Bond Wires A114A cmos esd sensitivity instantaneous overcurrent relay
    Text: EOS/ESD ADI Reliability Handbook Introduction Electrical overstress EOS has historically been one of the leading causes of integrated circuit failures, regardless of the semiconductor manufacturer. In general terms, electrical overstress can be defined as any condition where


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    PDF AN-397, notes/AN-397 AN-311, notes/AN311 MIL-STD 833 test method 3015 marking cdm Physical Analysis of Data on Fused-Open Bond Wires A114A cmos esd sensitivity instantaneous overcurrent relay

    a5657

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines
    Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


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    DOD Handbook 263

    Abstract: ZIF socket design guidelines walk through gate COMPONENT HANDLING PRECAUTIONS
    Text: CHAPTER 6 COMPONENT HANDLING PRECAUTIONS ESD Electrostatic Discharge ESD Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components non-functional circuit boards and scrambled or missing information ESD can occur in the manufacturing shipping receiving and field handling of integrated


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    a5657

    Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology
    Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


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    PDF yo980. a5657 DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology

    DOD Handbook 263

    Abstract: chapter 5.3 preventive maintenance Electrostatic Discharge Damage and Control EOS ESD S 61.1 ZIF socket design guidelines manpower profile
    Text: 2 6 Component Handling Precaution 1/22/97 10:16 AM CH06WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 6 COMPONENT HANDLING PRECAUTION 6.1. 6.1.1. ESD Electrostatic Discharge (ESD) Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in


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    PDF CH06WIP DOD Handbook 263 chapter 5.3 preventive maintenance Electrostatic Discharge Damage and Control EOS ESD S 61.1 ZIF socket design guidelines manpower profile

    injection molding machine wire diagram

    Abstract: A112-A TIP 133c
    Text: CHAPTER 4 RELIABILITY 4.1 THE RELIABILITY APPROACH “Architects and designers have for millennia tried to design structures and products for long life. What is new is the movement to quantify reliability.” Dr. Joseph M. Juran In a customer ’s finished product,


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    Untitled

    Abstract: No abstract text available
    Text: PWR-82341 Make sure the next Card you purchase has. SMART POWER H-BRIDGE MOTOR DRIVE FEATURES •Small size 1.8" x 1.4" x 0.25" •100 Vdc Rating •5 A Continuous, 10 A peak Capability •High-Efficiency MOSFET Drive Stage •Direct Drive from PWM •Drive Brush or Brushless DC


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    PDF PWR-82341 PWR-82341 PWR82341 100Vdc 1-800-DDC-5757 A5976 D-10/05-0

    Untitled

    Abstract: No abstract text available
    Text: PWR-82341 Make sure the next Card you purchase has. SMART POWER H-BRIDGE MOTOR DRIVE FEATURES •Small size 1.8" x 1.4" x 0.25" •100 Vdc Rating •5 A Continuous, 10 A peak Capability •High-Efficiency MOSFET Drive Stage •Direct Drive from PWM •Drive Brush or Brushless DC


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    PDF PWR-82341 PWR-82341 PWR82341 100Vdc 1-800-DDC-5757 A5976 E-11/06-0

    LM621

    Abstract: LM621N A45V C1995 N18A 30-degree dc motor sensor phasings 78
    Text: LM621 Brushless Motor Commutator Y General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors The part is compatible with both three- and four-phase motors It can directly drive the power switching devices used to drive the motor The LM621 provides an adjustable dead-time circuit to eliminate ‘‘shootthrough’’ current spiking in the power switching circuitry


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    PDF LM621 18-pin LM621N A45V C1995 N18A 30-degree dc motor sensor phasings 78

    MIC4424

    Abstract: MIC4424AJ piezoelectric driver 100khz MIC4423AJ How can I DO test IC TL494 74Cxxx MIC4423 MIC4423BWM MIC4423CN MIC4423CWM
    Text: MIC4423/4424/4425 Micrel MIC4423/4424/4425 Dual 3A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The MIC4423/4424/4425 family are highly reliable BiCMOS/ DMOS buffer/driver/MOSFET drivers. They are higher output current versions of the MIC4426/4427/4428, which are


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    PDF MIC4423/4424/4425 MIC4423/4424/4425 MIC4426/4427/4428, MIC426/427/428. MIC4424xWM MIC4424xN/J MIC4425xWM MIC4425xN/J MIC4424 MIC4424AJ piezoelectric driver 100khz MIC4423AJ How can I DO test IC TL494 74Cxxx MIC4423 MIC4423BWM MIC4423CN MIC4423CWM

    FETs Field Effect Transistors

    Abstract: 9S12DP256 AN2434 MC9S12C32 MC9S12DP256 MC9S12E128 HCS12 M68HC08 M68HC12 9S12H
    Text: Freescale Semiconductor Application Note AN2434 Rev. 0, 9/2004 Input/Output I/O Pin Drivers on HCS12 Family MCUs By: Paul Atkinson 8/16 Bit Division Applications Engineering Austin, Texas Introduction Most microcontroller units (MCUs) must connect to other devices. The input/output (I/O) pins provide this


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    PDF AN2434 HCS12 FETs Field Effect Transistors 9S12DP256 AN2434 MC9S12C32 MC9S12DP256 MC9S12E128 M68HC08 M68HC12 9S12H

    9S12DP256B

    Abstract: FETs Field Effect Transistors AN2434 pin diagram of hcs12 microcontroller 9S12DP256 HCS12 M68HC08 M68HC12 MC9S12C32 MC9S12DP256
    Text: Freescale Semiconductor Application Note AN2434 Rev. 0, 9/2004 Input/Output I/O Pin Drivers on HCS12 Family MCUs By: Paul Atkinson 8/16 Bit Division Applications Engineering Austin, Texas Introduction Most microcontroller units (MCUs) must connect to other devices. The input/output (I/O) pins provide this


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    PDF AN2434 HCS12 9S12DP256B FETs Field Effect Transistors AN2434 pin diagram of hcs12 microcontroller 9S12DP256 M68HC08 M68HC12 MC9S12C32 MC9S12DP256

    exor

    Abstract: solid state RF HIGH-POWER SWITCH 1N4148 230CC diode B05 ex-OR max4341 1n4148 high speed solid state diode
    Text: 3ME T> □111742 O O D O B l b 7 INRO S Z -JL ! DRIVERS DEFINED 4 A driver is an interface between digital circuitry (TTL, ECL, etc. and solid state RF/m icrowave switch circuitry. The switch usually consists of PIN/NIP diodes or Field Effect Transistors. In order to maintain


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    1n4148 high speed solid state diode

    Abstract: No abstract text available
    Text: 3ME T> □1117ME D0DD31b 7 INRO S Z -Z ! DRIVERS DEFINED A driver is an interface between digital circuitry (TTL, ECL, etc. and solid state RF/microwave switch circuitry. The switch usually consists of PIN/NIP diodes or Field Effect Transistors. In order to maintain


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    PDF 1117ME D0DD31b 1n4148 high speed solid state diode

    diode PJ 0416

    Abstract: No abstract text available
    Text: MIC4423/4424/4425 Dual 3A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The MIC4423/4424/4425 family are highly reliable BiCMOS/ DMOSbuffer/driver/MOSFET drivers. They are higher output current versions of the MIC4426/4427/4428, which are


    OCR Scan
    PDF MIC4423/4424/4425 MIC4423/4424/4425 MIC4426/4427/4428, MIC426/427/428. Ml04423/4424/4425 14-Pin diode PJ 0416

    4424 ym

    Abstract: MIC4423AJBQ MIC4424CN
    Text: IEH e L MIC4423/4424/4425 Dual 3A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The MIC4423/4424/4425 family of parts are CMOS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new MIC4426 family of


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    PDF MIC4423/4424/4425 500mA 1800pF 4423X MIC4424XWM MIC4425XWM 16-lead 4424 ym MIC4423AJBQ MIC4424CN

    MIC4424AJ

    Abstract: 74Cxxx MIC4425AJ tl494 equivalent mic4423aj IC4424 5962-8850305PX
    Text: MIC4423/4424/4425 3A Dual High Speed MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The M IC 4423/4424/4425 fam ily of parts are CM OS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new MIC4426 fam ily of


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    PDF MIC4423/4424/4425 MIC4426 IC426/427/428 IC4423/24/25 MIC4424AJ 74Cxxx MIC4425AJ tl494 equivalent mic4423aj IC4424 5962-8850305PX

    ic4424

    Abstract: 5962-8850305PX
    Text: MIC4423/4424/4425 Dual 3A Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The MIC4423/4424/4425 fam ily of parts are CMOS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new M IC4426 fam ily of


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    PDF MIC4423/4424/4425 MIC4423/4424/4425 IC4426 IC426/427/428 MIC4423/24/25 withoutIC4423/4424/4425 MIC4423xWM MIC4424xN/J MIC4424xWM MIC4425xWM ic4424 5962-8850305PX

    Untitled

    Abstract: No abstract text available
    Text: MIC4423/4424/4425 3A Dual High Speed MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The M IC 4423/4424/4425 fam ily of parts are CMOS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new MIC4426 fam ily of


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    PDF MIC4423/4424/4425 MIC4426 IC426/427/428 MIC4423/24/25 IC4423/4424/4425

    Untitled

    Abstract: No abstract text available
    Text: LM621 National Semiconductor LM621 Brushless Motor Commutator General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The part is compatible with both three- and four-phase motors. It can directly drive the power switching devices used to drive the motor. The LM621 pro­


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    PDF LM621 LM621 TL/H/8679-11

    Untitled

    Abstract: No abstract text available
    Text: MIC4423/4424/4425 Dual 3A Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The MIC4423/4424/4425 family of parts are CMOS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new MIC4426 family of


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    PDF MIC4423/4424/4425 MIC4423/4424/4425 MIC4426 IC426/427/428 IC4423/24/25 MIC4424XN/J 4424XW MIC4425xN/J 16-lead

    MIC4424AJ

    Abstract: MIC4425AJ
    Text: OCT 2 9 1990 MIC4423/4424/4425 -J , S ite s ,- j 3A Dual High Speed MOSFET Driver S E M I C O N D U C T O R THE INTELLIGENT POWER COMPANY GENERAL DESCRIPTION The MIC4423/4424/4425 family of parts are CMOS buffer/ drivers built using a highly reliable ‘lough” CMOS process.


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    PDF MIC4423/4424/4425 MIC4423/4424/4425 MIC4426 MIC426/427/428 MIC4423/24/25 MIC4424AJ MIC4425AJ

    IC4423

    Abstract: MIC4424AJ MIC4423BJ IC4423/4424/4425
    Text: MIC4423/4424/4425 3A Dual High Speed MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features The M IC4423/4424/4425 family of parts are CMOS buffer/ drivers built using a highly reliable BCD process. They are higher output current versions of the new M IC4426 family of


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    PDF MIC4423/4424/4425 IC4423/4424/4425 IC4426 MIC426/427/428 IC4423/24/25 SS014 IC4423 MIC4424AJ MIC4423BJ