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    COPPER 22MM Search Results

    COPPER 22MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    COPPER 22MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: ISOMETRIC VIEW 8mm 0.31in TYP 2 THRU HOLES O 600mm 23.62in 22mm 0.88in 25mm 1in O 4mm 0.16in TYP(9) DRILLED AND TAPPED 10-32 THRU HOLES TOP VIEW 17mm 0.69in 3mm 0.12in REAR VIEW 21mm 0.81in L.S VIEW FRONT VIEW GRDBAR800 PART NUMBERS 1"X0.125" Solid Copper


    Original     		PDF 600mm GRDBAR800

    Untitled

    Abstract: No abstract text available
    Text: ISOMETRIC VIEW 400mm 15.75in 8mm 0.31in TYP 2 THRU HOLES O 25mm 1in TOP VIEW 3mm 0.12in 17mm 0.69in REAR VIEW 22mm 0.88in O 4mm 0.16in TYP(9) DRILLED AND TAPPED 10-32 THRU HOLES 21mm 0.81in L.S VIEW FRONT VIEW GRDBAR600 PART NUMBERS 1"X0.125" Solid Copper


    Original     		PDF 400mm GRDBAR600

    INFORMATION OF IC 7424

    Abstract: 9C1S DIM200MKS12-A000 GP200MKS12
    Text: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MKS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.1 November 2002 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MKS12-A000 GP200MKS12 DS5552-1 INFORMATION OF IC 7424 9C1S DIM200MKS12-A000 GP200MKS12

    INFORMATION OF IC 7424

    Abstract: IC 4560 CIRCUIT DIAGRAM DIM200MLS12-A000 GP200MLS12
    Text: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MLS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-1.1 November 2002 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MLS12-A000 GP200MLS12 DS5553-1 INFORMATION OF IC 7424 IC 4560 CIRCUIT DIAGRAM DIM200MLS12-A000 GP200MLS12

    Untitled

    Abstract: No abstract text available
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PBT FLAMMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: 500 MATING CYCLES


    Original     		PDF UL94-V0 E324776 18Trays/Carton

    INFORMATION OF IC 7424

    Abstract: No abstract text available
    Text: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MKS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MKS12-A000 GP200MKS12 DS5552-1 DIM200MKS12-A000 INFORMATION OF IC 7424

    Untitled

    Abstract: No abstract text available
    Text: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Advance Information Replaces November 2002, issue DS5552-1.2 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS


    Original     		PDF DIM200MKS12-A000 DS5552-1 DIM200y

    Untitled

    Abstract: No abstract text available
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PBT FLAMMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: 500 MATING CYCLES


    Original     		PDF UL94-V0 E324776 17-JUL-14

    M6831

    Abstract: IC 7424
    Text: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue August 2003, version DS5543-3.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5545-4.0 September 2003 KEY PARAMETERS


    Original     		PDF DIM200MBS12-A000 DS5543-3 FDS5545-4 DIM200MBS12-A000 M6831 IC 7424

    INFORMATION OF IC 7424

    Abstract: M6831
    Text: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Advance Information Replaces November 2002, version DS5553-1.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-2 March 2003 KEY PARAMETERS VCES


    Original     		PDF DIM200MLS12-A000 DS5553-1 DS5553-2 DIM200y INFORMATION OF IC 7424 M6831

    DIM200MBS12-A000

    Abstract: DS55452
    Text: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Preliminary Information Replaces issue May 2002, version DS5543-1.3 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5545-2.1 June 2002


    Original     		PDF DIM200MBS12-A000 DS5543-1 DS5545-2 DIM200MBS12-A000 DS55452

    Untitled

    Abstract: No abstract text available
    Text: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue July 2003, version DS5543-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5545-3.1 August 2003 KEY PARAMETERS VDRM


    Original     		PDF DIM200MBS12-A000 DS5543-3 FDS5545-3 DIM200MBS12-A000

    INFORMATION OF IC 7424

    Abstract: DIM200MLS12-A000
    Text: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Replaces November 2002, version DS5553-1.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-2 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MLS12-A000 DS5553-1 DS5553-2 INFORMATION OF IC 7424 DIM200MLS12-A000

    DIM400LSS12-A000

    Abstract: No abstract text available
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5534-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-1.4 May 2002 KEY PARAMETERS


    Original     		PDF DIM400LSS12-A000 DS5534-1 DIM400LSS12-A00arantee DIM400LSS12-A000

    DIM200MHS12-A000

    Abstract: No abstract text available
    Text: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information Replaces issue May 2002, version DS5535-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-2.1 June 2002 KEY PARAMETERS


    Original     		PDF DIM200MHS12-A000 DS5535-1 DS5535-2 DIM200MHS12-A000

    DIM200MKS12-A000

    Abstract: DS-5552
    Text: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Replaces November 2002, issue DS5552-1.2 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MKS12-A000 DS5552-1 60arantee DIM200MKS12-A000 DS-5552

    was dual transistor

    Abstract: DIM200MBS12-A000
    Text: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue May 2002, version DS5543-1.3 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5545-2.1 June 2002 KEY PARAMETERS VDRM


    Original     		PDF DIM200MBS12-A000 DS5543-1 DS5545-2 DIM200MBS12-A000 was dual transistor

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Capacitor PPSA PPSA are non-inductively wound polypropylene capacitors with metal foil electrodes, internally series - connected using copper - clad steel leads and epoxy resin coating. They are ideal for applications as damping and commutating capacitors in power


    Original     		PDF UL94V-0) 400VDC, 630VD

    bi-directional switches IGBT

    Abstract: M6 transistor DIM200MHS12-A000 half bridge circuit diagram INFORMATION OF IC 7424
    Text: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Replaces June 2002, version DS5535-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MHS12-A000 DS5535-2 DS5535-3 bi-directional switches IGBT M6 transistor DIM200MHS12-A000 half bridge circuit diagram INFORMATION OF IC 7424

    Untitled

    Abstract: No abstract text available
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces March 2003, version DS5534-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5534-4.0 July 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM400LSS12-A000 DS5534-3 FDS5534-4 DIM400LSS12-A000

    12v to 1000v inverters circuit diagrams

    Abstract: bi-directional switches IGBT DIM400LSS12-A000 6x55 diode IC LM 2003
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM400LSS12-A000 DS5534-2 DS5534-3 DIM400LSS12-A000 12v to 1000v inverters circuit diagrams bi-directional switches IGBT 6x55 diode IC LM 2003

    DIM400LSS12-A000

    Abstract: IC 4560 CIRCUIT DIAGRAM
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM400LSS12-A000 DS5534-2 DS5534-3 DIM400LSS12-A000 IC 4560 CIRCUIT DIAGRAM

    transistor 9003

    Abstract: DIM200MHS12-A000
    Text: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Replaces June 2002, version DS5535-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM200MHS12-A000 DS5535-2 DS5535-3 transistor 9003 DIM200MHS12-A000

    Untitled

    Abstract: No abstract text available
    Text: 10 ;± e CONFIDENTIAL NO TES MATERIAL /'A Tv A ij&6# LOP ] U L92V -0 ( * ] HOUSINC:LIQUID C RYSTA L POLYMER UL9AV-0 (COLOR:BLACK 7 - y ±/l TERMINAL COPPER ALLOY FITTING NAIL COPPER ALLOY 2 7y PLATING A - $ i ^ TERMINAL . y>T #7 • EE GOLD (PITCH) UNDER PLATING : NICKEL


    OCR Scan     		PDF SD-503776-003