COPPER BOND WIRE MOTOROLA Search Results

COPPER BOND WIRE MOTOROLA Result Highlights (5)

Part	Manufacturer	Description	Download
SF-NDCCGJ28GB-003M	Amphenol Cables on Demand	Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version)	Datasheet
SF-NDCCGJ28GB-002M	Amphenol Cables on Demand	Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version)	Datasheet
SF-NDCCGJ28GB-005M	Amphenol Cables on Demand	Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG	Datasheet
SF-NDAAFJ100G-002M	Amphenol Cables on Demand	Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss)	Datasheet
CS-DSDMDB09MF-010	Amphenol Cables on Demand	Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft	Datasheet

COPPER BOND WIRE MOTOROLA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: MOTOROLA Freescale Semiconductor, Inc. Order Number: AN1545/D SEMICONDUCTOR TECHNICAL DATA Rev 1, 08/2001 AN1545 Thermal Data for MPC Clock Drivers Freescale Semiconductor, Inc. Prepared by: Todd Pearson Applications Engineering 9 INTRODUCTION This application note provides general information on thermal	Original	AN1545/D AN1545 200lfpm)	PDF
copper bond wire motorola Abstract: No abstract text available Text: MOTOROLA Order Number: AN1545/D SEMICONDUCTOR TECHNICAL DATA Rev 1, 08/2001 AN1545 Thermal Data for MPC Clock Drivers Prepared by: Todd Pearson Applications Engineering 9 INTRODUCTION This application note provides general information on thermal and related reliability issues with respect to the MPC family of	Original	AN1545/D AN1545 100MHz 200lfpm) copper bond wire motorola	PDF
Calculating Power Dissipation Abstract: No abstract text available Text: MOTOROLA Order Number: AN1545/D SEMICONDUCTOR TECHNICAL DATA Rev 1, 08/2001 AN1545 Thermal Data for MPC Clock Drivers Prepared by: Todd Pearson Applications Engineering 8 INTRODUCTION This application note provides general information on thermal and related reliability issues with respect to the MPC family of	Original	AN1545/D AN1545 100MHz 200lfpm) Calculating Power Dissipation	PDF
AN1545 Abstract: LVE111 MC100LVE111 MPC951 Text: MOTOROLA Freescale Semiconductor, Inc. Order Number: AN1545/D SEMICONDUCTOR TECHNICAL DATA Rev 1, 08/2001 AN1545 Thermal Data for MPC Clock Drivers Freescale Semiconductor, Inc. Prepared by: Todd Pearson Applications Engineering INTRODUCTION This application note provides general information on	Original	AN1545/D AN1545 AN1545 LVE111 MC100LVE111 MPC951	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor, Inc. Order number: AN1545 Rev 1, 08/2001 APPLICATION NOTE AN1545 Thermal Data for MPC Clock Drivers By: Todd Pearson Applications Engineering INTRODUCTION This application note provides general information on thermal and related reliability issues with respect to the MPC family of	Original	AN1545	PDF
AN1741 Abstract: IC AN1741 pin configuration 20-PIN HC05 motorola application note Nippon capacitors 23/M68HC05PFB Text: 1 Order this document by AN1741/D Motorola Semiconductor Application Note AN1741 In-Circuit and Emulation Considerations for MC68HC05JJ/JP Series Microcontrollers By Mark L. Shaw Member, Technical Staff, Sensor Products Division Transportation Systems Group	Original	AN1741/D AN1741 MC68HC05JJ/JP AN1741 IC AN1741 pin configuration 20-PIN HC05 motorola application note Nippon capacitors 23/M68HC05PFB	PDF
AN1545 Abstract: copper bond wire motorola MC100LVE111 DL140 LVE111 MPC951 Calculating Power Dissipation AN-1545 Text: AN1545 Application Note Thermal Data for MPC Clock Drivers Prepared by Todd Pearson Applications Engineering This application note provides general information on thermal and related reliability issues with respect to the MPC family of clock driver products. In addition,	Original	AN1545 MC10E/D* MC10E/D DL140 AN1545 copper bond wire motorola MC100LVE111 LVE111 MPC951 Calculating Power Dissipation AN-1545	PDF
IC AN1741 pin configuration Abstract: 20-PIN AN1741 HC05 issd Nippon capacitors Text: Freescale Semiconductor, Inc. 1 Order this document by AN1741/D Motorola Semiconductor Application Note Freescale Semiconductor, Inc. AN1741 In-Circuit and Emulation Considerations for MC68HC05JJ/JP Series Microcontrollers By Mark L. Shaw Member, Technical Staff, Sensor Products Division	Original	AN1741/D AN1741 MC68HC05JJ/JP IC AN1741 pin configuration 20-PIN AN1741 HC05 issd Nippon capacitors	PDF
Amkor Technology 1999 Abstract: JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb Text: Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested	Original	HFAN-08 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, Amkor Technology 1999 JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb	PDF
JESD51-1 Abstract: "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2 Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested	Original	HFAN-08 4hfan081 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, JESD51-1 "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2	PDF
QFN PACKAGE Junction to PCB thermal resistance Abstract: AN569 Motorola Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested	Original	HFAN-08 4hfan081 JESD51-5: JESD51-6: JESD51-7: JESD51-8: JESD51-9: JESD51-10: QFN PACKAGE Junction to PCB thermal resistance AN569 Motorola	PDF
Theta JB Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480 Text: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)	Original	MPC8260 29x29 MPC8240 26x26 Theta JB 2330B 100C MPC8240 PEAK tray drawing TBGA 214226-ICB TBGA480	PDF
EMCO 3115 Abstract: 3106 emco 3115 Horn antenna NARDA 8719 lisn emco emco ghz Text: MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1622 EMC Considerations for Automotive Sensors Prepared by: Dragan Mladenovic, Rajan Verma, and Randy Frank Motorola Semiconductor Products Sector integrated signal conditioning have been qualified for automotive usage. A block diagram of a micromachined	Original	AN1622 EMCO 3115 3106 emco 3115 Horn antenna NARDA 8719 lisn emco emco ghz	PDF
bf244 Abstract: MV211 BF256 BC237 2N2222A TO-92 MPS6568 bc547 equivalent BC308 bf246 motorola JFET 2N3819 Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET High Frequency Amplifier N–Channel — Depletion J304 1 DRAIN 3 GATE 2 SOURCE 1 2 3 CASE 29–04, STYLE 5 TO–92 TO–226AA MAXIMUM RATINGS Rating Symbol Value Unit Drain – Gate Voltage VDG – 30 Vdc Gate–Source Voltage	Original	226AA) MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 MV1640 MV1642 MV1644 bf244 MV211 BF256 BC237 2N2222A TO-92 MPS6568 bc547 equivalent BC308 bf246 motorola JFET 2N3819	PDF

BC237 Abstract: No abstract text available Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET Switching N–Channel — Depletion 2N5555 1 DRAIN 3 GATE 2 SOURCE MAXIMUM RATINGS Rating Symbol Value Unit Drain – Source Voltage VDS 25 Vdc Drain – Gate Voltage VDG 25 Vdc Gate – Source Voltage VGS 25 Vdc	Original	2N5555 226AA) MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 MV1640 MV1642 BC237	PDF
TO-226-AE Abstract: BC108 characteristic JFET BF245 BC237 Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET VHF/UHF Amplifiers N–Channel — Depletion 2N5484 1 DRAIN 2N5486 3 GATE 2 SOURCE MAXIMUM RATINGS Rating Drain – Gate Voltage Reverse Gate – Source Voltage Drain Current Forward Gate Current Total Device Dissipation @ TC = 25°C	Original	2N5484 2N5486 226AA) V218A MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 TO-226-AE BC108 characteristic JFET BF245 BC237	PDF
MPF102 equivalent transistor Abstract: mpf102 replacement BC237 MPF102 model MPF102 Transistor 2N1893 equivalent replacement of MPF102 JFET 2N3019 and applications BSS89 APPLICATION mpf102 application note Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET VHF Amplifier N–Channel — Depletion MPF102 1 DRAIN 3 GATE 2 SOURCE MAXIMUM RATINGS Symbol Value Unit Drain – Source Voltage Rating VDS 25 Vdc Drain – Gate Voltage VDG 25 Vdc Gate – Source Voltage VGS – 25	Original	MPF102 226AA) MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 MV1640 MV1642 MPF102 equivalent transistor mpf102 replacement BC237 MPF102 model MPF102 Transistor 2N1893 equivalent replacement of MPF102 JFET 2N3019 and applications BSS89 APPLICATION mpf102 application note	PDF
WT transistor Abstract: BC237 S11S 2n441 BF244B 2N3799 JFET BF245 C4 SOT-323 2N3819 MOTOROLA Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET Transistor N–Channel 2 SOURCE MMBF5484LT1 Motorola Preferred Device 3 GATE 1 DRAIN 3 MAXIMUM RATINGS Rating Drain–Gate Voltage Reverse Gate–Source Voltage Forward Gate Current 1 Symbol Value Unit VDG 25 Vdc	Original	MMBF5484LT1 236AB) C218A MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 MV1640 WT transistor BC237 S11S 2n441 BF244B 2N3799 JFET BF245 C4 SOT-323 2N3819 MOTOROLA	PDF
BC237 Abstract: S11S C4 SOT-323 Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA JFET MMBF4416LT1 VHF/UHF Amplifier Transistor N–Channel Motorola Preferred Device 2 SOURCE 3 GATE 3 1 DRAIN 1 MAXIMUM RATINGS 2 Rating Symbol Value Unit Drain–Source Voltage VDS 30 Vdc Drain–Gate Voltage VDG 30 Vdc	Original	MMBF4416LT1 236AB) Cha218A MSC1621T1 MSC2404 MSD1819A MV1620 MV1624 MV1636 BC237 S11S C4 SOT-323	PDF
map sensor Abstract: motorola ECu microprocessor air mass flow sensor MAF ECU ford focus ford ka ecu "Pressure Transducer" KA SENSORS signal conditioning circuits of map sensor NOx sensor Ford Common Rail Fuel injector maf ford Text: MOTOROLA Order this document by AN1620/D SEMICONDUCTOR APPLICATION NOTE AN1620 A Monolithic Integrated Solution for MAP Applications ABSTRACT A monolithic sensing solution for manifold absolute pressure MAP is presented. This work includes examination of design, fabrication, temperature compensation, packaging	Original	AN1620/D AN1620 map sensor motorola ECu microprocessor air mass flow sensor MAF ECU ford focus ford ka ecu "Pressure Transducer" KA SENSORS signal conditioning circuits of map sensor NOx sensor Ford Common Rail Fuel injector maf ford	PDF
Sumitomo CRM 1033B Abstract: sumitomo 1033B CRM1033B MOTOROLA POWER TRANSISTOR lc 945 sumitomo crm-1033B 8361J Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Reliability Information Motorola Reliability and Quality Assurance Reliability Motorola has a long standing reputation for manufacturing products of excellent Quality and Reliability since the introduction of the first car	OCR Scan	BR1339 Sumitomo CRM 1033B sumitomo 1033B CRM1033B MOTOROLA POWER TRANSISTOR lc 945 sumitomo crm-1033B 8361J	PDF
copper bond wire motorola Abstract: smd CAw Text: AN 1545 Application Note Therm al D ata for MPC C lock Drivers Prepared by Todd Pearson Applications Engineering This application note provides general information on thermal and related reliability issues with respect to the M P C fa m ily o f clo ck d riv e r products. In ad dition,	OCR Scan	BR1333 copper bond wire motorola smd CAw	PDF
motorola transistor dpak marking Abstract: motorola power transistor to-126 to220 transistor marking MOTOROLA SOT TO-126 mounting Text: AR319/D DPAK: A SURFACE MOUNT PACKAGE FOR DISCRETE POWER DEVICES Prepared By Dave Hollander Motorola Semiconductor Products Inc. Phoenix, Az. Reprinted by permission from the March 1988 issue of Hybrid Circuit Technology. Copyright 1988, Lake Publishing Corp., Box 159, 17730 W . Peterson Road, Libertyville, IL	OCR Scan	AR319/D motorola transistor dpak marking motorola power transistor to-126 to220 transistor marking MOTOROLA SOT TO-126 mounting	PDF
MPM3002 Abstract: K4004 DIODE MOTOROLA B34 Case 806-05 AN569 Active resistance 362 MOSFET DMS-100 temperature sensefet Text: MOTOROLA SC XSTRS/R F ME D • b3b7254 DGTÔ454 3D1 ■ PIOTb MOTOROLA ■ SEMICONDUCTOR TECHNICAL DATA Advance Information TMOS ICePAK Power Module P-Channel Power M O SFET and N-Channel SEN SEFET Product in a Full H-Bridge Configuration The MPM3002 is a H-Bridge power circuit with lossless current sensing capability. The	OCR Scan	MPM3002 MPM3002 K4004 DIODE MOTOROLA B34 Case 806-05 AN569 Active resistance 362 MOSFET DMS-100 temperature sensefet	PDF

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COPPER BOND WIRE MOTOROLA Search Results

COPPER BOND WIRE MOTOROLA Result Highlights (5)

COPPER BOND WIRE MOTOROLA Datasheets Context Search

Untitled

copper bond wire motorola

Calculating Power Dissipation

AN1545

Untitled

AN1741

AN1545

IC AN1741 pin configuration

Amkor Technology 1999

JESD51-1

QFN PACKAGE Junction to PCB thermal resistance

Theta JB

EMCO 3115

bf244

BC237

TO-226-AE

MPF102 equivalent transistor

WT transistor

BC237

map sensor

Sumitomo CRM 1033B

copper bond wire motorola

motorola transistor dpak marking

MPM3002