Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
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ARS50AL
ARS50JL
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
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AR50AL
AR50JL
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: VISHAY SILICONIX www.vishay.com Power MOSFETs Application Note AN917 Dual-Channel LITTLE FOOT 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance 175 °C Rated Part INTRODUCTION The new dual 6-pin SC-70 package with a copper leadframe
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AN917
SC-70
laySx15xxEEH
SC70-6
15-Apr-13
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AN816
Abstract: Dual N-Channel mosfet sot-363 SC70-6 sc-70 package pcb layout
Text: AN816 Vishay Siliconix Dual-Channel LITTLE FOOTR 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION 87 mil 26 (mil) The new dual 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced
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AN816
SC-70
Si19xxEDH
Si15xxEDH
12-Dec-03
SC70-6
AN816
Dual N-Channel mosfet sot-363
sc-70 package pcb layout
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diode sm4007 -MELF
Abstract: SMA Package diode schottky 1000V 2a TVS diode MELF FLYBACK CLAMPING DIODE Schottky melf diode sm4007 SM4007 Diode 3A 440V TVS Diode cross
Text: Application Note Comparison between Melf and SMA package Comparison between Melf and SMA package Melf package cross section SMA package (cross section) Build with massive copper plugs (Nickel Build in copper leadframe technology plated) * Superior thermal resistance due to massive * Leadframe technology has got higher thermal
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A/1000V
SM4007
10K/W
30K/W
SM2000
A/2000V
SM54xx
SK34SMA
diode sm4007 -MELF
SMA Package
diode schottky 1000V 2a
TVS diode MELF
FLYBACK CLAMPING DIODE
Schottky melf
diode sm4007
SM4007 Diode
3A 440V
TVS Diode cross
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Alloy 42
Abstract: AN815 sc-70 package pcb layout SC70-6 Si19xxEDH
Text: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION EVALUATION BOARDS Ċ SINGLE SC70-6 The new single 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced
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AN815
SC-70
SC70-6
Si14xxEDH
Si19xxEDH
Si15xxEDH
12-Dec-03
Alloy 42
AN815
sc-70 package pcb layout
SC70-6
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Untitled
Abstract: No abstract text available
Text: Thermal Data DPAK & PPAK 3 leads 5 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Thermal Resistance & Maximum Power Dissipation vs P.C.B. Copper Area
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Alloy 42
Abstract: 32MX16
Text: -Formerly Austin Semiconductor, Inc. Copper Lead Frame 54-Pin TSOPII SDRAM Products FEATURES BENEFITS • Clock frequency: up to 133 MHz • • Configurations: 32Mx16, 16Mx16, 8Mx16 & 4Mx16 Enhanced Long-term reliability with copper lead frames • Fully synchronous; all signals referenced to a
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54-Pin
32Mx16,
16Mx16,
8Mx16
4Mx16
clocks33MHz
AS4SD16M16
133MHz
AS4SD8M16
Alloy 42
32MX16
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Untitled
Abstract: No abstract text available
Text: Exclusive Technology Feature ISSUE: March 2012 Failure Analysis On Power MOSFETs With Copper Wire Bonds by Huixian Wu, Arthur Chiang, and David Le, Vishay Siliconix, Santa Clara, Calif. Copper wire bonds are being used increasingly in microelectronic components as a less expensive alternative to
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Abstract: No abstract text available
Text: WINSLOW ADAPTICs Data Sheet – Screw Machined I.C. Sockets W35500TRC - W35500T - W35500G - W35500TTRC The W35500 Series uses a screw machined half hard brass outer pin with a beryllium copper contact. The outer pin has 3 plating options; RoHS compliant Tin, Tin/Lead or Gold. The beryllium copper contact can be Gold or pure Tin.
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W35500TRC
W35500T
W35500G
W35500TTRC
W35500
1013ohms-CM
UL94V-0
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Untitled
Abstract: No abstract text available
Text: WINSLOW ADAPTICs Data Sheet – Screw Machined I.C. Sockets W35500TRC - W35500T - W35500G - W35500TTRC The W35500 Series uses a screw machined half hard brass outer pin with a beryllium copper contact. The outer pin has 3 plating options; RoHS compliant Tin, Tin/Lead or Gold. The beryllium copper contact can be Gold or pure Tin.
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W35500TRC
W35500T
W35500G
W35500TTRC
W35500
1013ohms-CM
UL94V-0
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MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
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16-pin
MF202
160P6)
152P6T)
135S8)
42Alloy)
leadframe materials
QFP PACKAGE thermal resistance
POWER QFP
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
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LA12
Abstract: No abstract text available
Text: FCL-P115XXWCCI Range Features: • Two dice - Single colour or Bi-Colour • Water clear epoxy • Low thermal resistance copper leadframe Electro / Optical Characteristics Lamp Package LED Part Number FCL-P115R078G03WCCI FCL-P115Y109B12WCCI FCL-P115R078R078WCCI
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FCL-P115XXWCCI
FCL-P115R078G03WCCI
FCL-P115Y109B12WCCI
FCL-P115R078R078WCCI
FCL-P115Y048Y048WCCI
FCL-P115G03G03WCCI
FCL-P115XXWCCI
LA12
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-277 Package Weight mg 90 Product Group Type No. TMS1045, TMS1045L, TMS1045U TMS10100 TMS10150 TMS1550L Component Die Doped Silicon* Die Attach Solder Alloy Leadframe Copper Alloy
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O-277
TMS1045,
TMS1045L,
TMS1045U
TMS10100
TMS10150
TMS1550L
7440-21ncentration
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DIL Package Weight mg 380 Product Group Type No. DF005 – DF10 DF150 – DF1510 DF200 – DF2010 Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance
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DF005
DF150
DF1510
DF200
DF2010
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MB-S Package Weight mg 120 Product Group Type No. B1S – B10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach
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2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TB-S Package Weight mg 100 Product Group Type No. TB1S – TB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach
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TB10S
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MBL-S Package Weight mg 100 Product Group Type No. LB1S – LB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach
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LB10S
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the operating conditions of the electronics application. With this in mind, ISSI recently added synchronous
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Alloy42
64Mbit
512Mbit.
16Mbit)
256Kbit)
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Untitled
Abstract: No abstract text available
Text: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the expected operating conditions of the electronics application. With this in mind, ISSI now includes
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Alloy42
64Mbit
512Mbit.
16Mbit.
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Copper Leadframe
Abstract: cte table ALLOY42
Text: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the expected operating conditions of the electronics application. With this in mind, ISSI now includes
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Alloy42
64Mbit
512Mbit.
16Mbit.
Copper Leadframe
cte table
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Untitled
Abstract: No abstract text available
Text: TTR-2C22/TTR-2C23 Connectorized VCSEL Light Source FEATURES: • Industry standard connector of metallic FC-type receptacle. • Pre-aligned for multi-mode fiber communication. • Copper leadframe, low dependence of thermal variation. • Suitable for 10/100 Mbps applications.
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TTR-2C22/TTR-2C23
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090204
Abstract: FCL-PH65R2110WCCI
Text: FCL-PH65XWCCI Range Features: 7.6 mm Square Domed High Performance LED Lamp • High intensity • Water clear epoxy • 4 leads with stand off as standard • Low thermal resistance copper leadframe Electro / Optical Characteristics IF = 20 mA Lamp Package
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FCL-PH65XWCCI
FCL-PH65R2110WCCI
FCL-PH65R2112WCCI
FCL-PH65O0810WCCI
FCL-PH65XWCCI
090204
FCL-PH65R2110WCCI
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Alloy 42
Abstract: No abstract text available
Text: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION pins as drain leads, which helps to reduce on-resistance and junction-to-ambient thermal resistance.
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AN815
SC-70
Si14xxEDH
Si19xxEDH
Si15xxEDH
15-Jan-01
Alloy 42
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