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    CORNER RELIEF CARRIER TAPE Search Results

    CORNER RELIEF CARRIER TAPE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    9513APC-G Rochester Electronics LLC 9513A - Rochester Manufactured 9513, System Timing Controller, 44 PLCC Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    LMX2325TMX-G Rochester Electronics LLC LMX2325 - RoHS - T/R, PLL Freq Synthesizer Visit Rochester Electronics LLC Buy
    HC55185AIMZ96 Renesas Electronics Corporation VoIP Ringing SLIC, PLCC, /Reel Visit Renesas Electronics Corporation
    HC55185BIMZ96 Renesas Electronics Corporation VoIP Ringing SLIC, PLCC, /Reel Visit Renesas Electronics Corporation
    CD22M3494MQAZ96 Renesas Electronics Corporation 16x8x1 BiMOS-E Crosspoint Switch, PLCC, /Reel Visit Renesas Electronics Corporation

    CORNER RELIEF CARRIER TAPE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste PDF

    408-1379

    Abstract: AMP catalog 82003 komax 433 nas 7103 KOMAX 333 operating instructions komax 200277-2 201355-1 201692-4 21393
    Text: RoHS Ready M Series Pin and Socket Connectors AMP M Series Pin and Socket Connectors NOTE: All part numbers are RoHS Compliant M Series Connectors Product Facts • Most connectors intermateable with connectors made to MIL-C-28748 requirements Standard Housings


    Original     		MIL-C-28748 wire42 408-1379 AMP catalog 82003 komax 433 nas 7103 KOMAX 333 operating instructions komax 200277-2 201355-1 201692-4 21393 PDF

    Untitled

    Abstract: No abstract text available
    Text: AXR 7 ULTRA LOW-PROFILE RECEPTACLE OF 2.9 mm I/O CONNECTORS FOR PORTABLE EQUIPMENT FEATURES 1. Ultra low-profile receptacle of 2.9 mm 2. Plug construction which accepts any direction (topside up or upside down) for mounting receptacles onto the boards Since the lock is released in the sideways


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    AXR61154

    Abstract: No abstract text available
    Text: AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. PC CARD, PDA etc. Contact The bellows type contacts are fabricated


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    134 kHz RFID

    Abstract: db9f connector M513 MASY-007028-000100 MASY-007028-0001TB MASY-007028-0001TR MASY-007028-SW01TB
    Text: MASY-007028-000100 Synthesizer, SMT for RFID Covering all UHF Bands Rev. V2 Features • • • • • • • • • Description Fully Integrated VCO, PLL, Loop Filter Includes TCXO with <10 PPM Stability Low Phase Noise High Performance, Low Cost Covers US, European and Japanese RFID Bands


    Original     		MASY-007028-000100 134 kHz RFID db9f connector M513 MASY-007028-000100 MASY-007028-0001TB MASY-007028-0001TR MASY-007028-SW01TB PDF

    Untitled

    Abstract: No abstract text available
    Text: AXR6.fm 87 ページ ２００３年１２月２２日 月曜日 午後１２時２分 AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating


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    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    JIS C 0806

    Abstract: CONNECTOR BACK SHELL AXR61154 AXR62151 AXR62156 HP4338B
    Text: AXR 6 I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer


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    Untitled

    Abstract: No abstract text available
    Text: Discontinued products I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer


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    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition PDF

    Ablebond 8380

    Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
    Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that


    Original     		CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping PDF

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


    Original     		IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING PDF

    Ablebond 8380

    Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
    Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These


    Original     		PDF

    axc8

    Abstract: sharp EIA 577 sharp color tv schematic diagram AXP 209 IC 945 mercury MOTHERBOARD CIRCUIT diagram 13001 s 8d semiconductors cross index schematic WELDER semiconductors cross reference axa dvd SMD MARKING CODE p4S
    Text: Group Catalog Connectors 2008-2009 Narrow-pitch connectors I/O connectors Interface connectors Sockets for memory card Connectors for industrial equipment IC sockets Group Catalog Connectors 2008-2009 These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based soybean oil ink.


    Original     		AKCT1B91E 200709-8YT axc8 sharp EIA 577 sharp color tv schematic diagram AXP 209 IC 945 mercury MOTHERBOARD CIRCUIT diagram 13001 s 8d semiconductors cross index schematic WELDER semiconductors cross reference axa dvd SMD MARKING CODE p4S PDF

    30f 124 equivalent

    Abstract: MC14513 C04-026 binary bcd conversion logic diagram CAZ MARKING C04022 R1C390
    Text: TC7135 4-1/2 Digit A/D Converter Features General Description • • • • • • • • The TC7135 4-1/2 digit A/D Converter ADC offers 50 ppm (1 part in 20,000) resolution with a maximum nonlinearity error of 1 count. An auto-zero cycle reduces zero error to below 10 µV and zero drift to


    Original     		TC7135 TC7135 D-85737 NL-5152 DS21460C-page 30f 124 equivalent MC14513 C04-026 binary bcd conversion logic diagram CAZ MARKING C04022 R1C390 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Power Resistive Products Resistors and Terminations: Engineering Guidelines DESIGN, MEASUREMENT AND PERFORMANCE As the wireless revolution extends component requirements upward in frequency, higher in operating power, and smaller in size, performance demands on resistive devices grow ever


    Original     		MTT-33, PDF

    fr108

    Abstract: Ever Ohms chip resistor
    Text: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S ATC Resistors and Terminations: Engineering Guidelines Design, Measurement and Performance Structures, Implementations, and Configurations . . . . . . . . . . . . . . . . . . . . .36 Specs and Specmanship . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37


    Original     		84-WA/HT-110. MTT-33, fr108 Ever Ohms chip resistor PDF

    LEMO fvb.00

    Abstract: lemo HEG 0K FGG.2K lemo fgg.2k CONNECTOR series 742 792 71 monitor EHT MIL-C-22520/7-01 hep 154 datasheet CONNECTOR BNC L-Type LEMO
    Text: Unipole & Multipole Connectors Dear Customers, For more than 50 years the LEMO Group has been dedicated to bringing technical excellence to connection technology. Our range of models, numbering more than 55’000, are used in a multitude of applications. From medical devices to satellites, from oil exploration to precision measurement, engineers turn to LEMO to solve their most demanding connection needs. This catalogue documents a multitude of different product references… but the most important thing about LEMO is not printed on the


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    SOT89 transistor marking MK

    Abstract: Marking mk SOT89 LB 122 transistor To-92 marking code 336 transistor sot-23 marking code mp SOT-89 corner relief carrier tape MK SOT23-3 equivalent transistor TT 3034
    Text: MCP111/112 Micropower Voltage Detector Package Types • Ultra-low supply current: 1.75 µA max. • Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V, 4.38V and 4.63V • Resets microcontroller in a power-loss event • Active-low VOUT pin:


    Original     		MCP111/112 MCP111 MCP112 OT23-3, SC-70 OT-89-3 MCP1XX-195) MCP1XX-195 OT23-3/SC-70 MCP111/112 SOT89 transistor marking MK Marking mk SOT89 LB 122 transistor To-92 marking code 336 transistor sot-23 marking code mp SOT-89 corner relief carrier tape MK SOT23-3 equivalent transistor TT 3034 PDF

    Marking mk SOT89

    Abstract: equivalent transistor TT 3034 marking code 604 SOT23 MCP102 MCP103 MCP111 MCP112 MCP121 MARKING KV SOT-89 DS91087
    Text: MCP111/112 Micropower Voltage Detector Package Types • Ultra-low supply current: 1.75 µA max. • Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V, 4.38V and 4.63V • Resets microcontroller in a power-loss event • Active-low VOUT pin:


    Original     		MCP111/112 MCP111 MCP112 OT23-3, SC-70 OT-89-3 MCP1XX-195) MCP1XX-195 OT23-3/SC-70 OT-89 Marking mk SOT89 equivalent transistor TT 3034 marking code 604 SOT23 MCP102 MCP103 MCP121 MARKING KV SOT-89 DS91087 PDF

    LEMO FFA 1S

    Abstract: ffa 2e 675 cta LEMO fvb.00 LEMO EGG.2B LEMO LEMO FGG.1B LEMO FGG.2B flat gasket viton Amphenol HV STYCAST 2850
    Text: LEMO’s B and S Series Connectors B Series - Mechanical Keying S Series - Hermaphroditic Keying 2003 Expect Success. Spec LEMO. A Global Leader Since its beginning in Switzerland in 1946, LEMO® has evolved into a worldwide leader in the design and manufacture of circular connectors, with products sold


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    HUGHES mcw 550

    Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
    Text: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex­ tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all


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