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R7F7010414AFP
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Renesas Electronics Corporation
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High-end In-vehicle Microcomputers for Body Applications |
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R7F7010413AFP
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Renesas Electronics Corporation
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High-end In-vehicle Microcomputers for Body Applications |
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76350-104-16LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch |
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98426-S01-04-105LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 8 Positions, 2.00mm (0.079in) Pitch. |
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ME1014010201041
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Amphenol Communications Solutions
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EDSFF, OCP 3.0, Mini Cool Edge 0.60mm, Gen 5, 140 signal pins, SMT, Right angle ,Seating height 4.05mm. |
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