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    CP324X Search Results

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    CP324X Price and Stock

    Central Semiconductor Corp CP324X-H2N7002A-CM

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: CP324X-H2N7002A-CM)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas CP324X-H2N7002A-CM Waffle Pack 22 Weeks 800
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    CP324X Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

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    Abstract: No abstract text available
    Text: PROCESS CP324X Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.6 x 21.6 MILS Die Thickness 5.9 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS


    Original     		CP324X 2N7002 30-August PDF