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    CPD07 Search Results

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    CPD07 Price and Stock

    TE Connectivity 2MM-RCP-D07-BX

    AMPMODU 2 MM, CRIMP RECEPTACLE,
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    DigiKey 2MM-RCP-D07-BX Box 3,569 1
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    Mouser Electronics 2MM-RCP-D07-BX 3,559
    • 1 $1.09
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    Newark 2MM-RCP-D07-BX Bulk 3,550 10
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    Master Electronics 2MM-RCP-D07-BX
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    Maple Systems Inc PC1317CP-D07M12D

    17.0" Intel i7 32GB/512GB Win11
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    DigiKey PC1317CP-D07M12D 1
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    RS PC1317CP-D07M12D Bulk 1 Weeks 1
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    Maple Systems Inc PC1312CP-D07M12D

    12.1" Intel i7 32GB/512GB Win11
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    DigiKey PC1312CP-D07M12D 1
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    RS PC1312CP-D07M12D Bulk 1 Weeks 1
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    Maple Systems Inc PC1310CP-D07M12D

    10.4" Intel i7 32GB/512GB Win11
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    DigiKey PC1310CP-D07M12D 1
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    RS PC1310CP-D07M12D Bulk 1 Weeks 1
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    Maple Systems Inc PC1315CP-D07M12D

    15.0" Intel i7 32GB/512GB Win11
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    DigiKey PC1315CP-D07M12D 1
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    RS PC1315CP-D07M12D Bulk 1 Weeks 1
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    CPD07 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CPD07 Central Semiconductor Chip Form: RECTIFIER CHIP Original PDF

    CPD07 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: CPD07 Rectifier Die 6.0 Amp, 600 Volt w w w. c e n t r a l s e m i . c o m The CPD07 is a silicon 6.0 Amp, 600 Volt rectifier ideal for use in industrial, consumer, medical, and power supply applications. APPLICATIONS: • Input rectification • Reverse polarity protection


    Original
    PDF CPD07 CPD07 20-August

    Untitled

    Abstract: No abstract text available
    Text: PROCESS CPD07 General Purpose Rectifier 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 100 x 100 MILS Die Thickness 10.2 MILS Anode Bonding Pad Area 82 x 82 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization


    Original
    PDF CPD07 29-April

    CPD07

    Abstract: No abstract text available
    Text: PROCESS CPD07 Central General Purpose Rectifier TM Semiconductor Corp. 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 10.4 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization


    Original
    PDF CPD07 16-September CPD07

    vt8233a

    Abstract: vt1631 VT8233 VT1621 CLE266 RX6C pro266t CLE266 cd PRO266 via apollo
    Text: Data Sheet CLE266 Version CD/CE North Bridge Revision 2.06 December 1, 2004 VIA TECHNOLOGIES, INC. Copyright Notice: Copyright 2002-2004 VIA Technologies Incorporated. All Rights Reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical,


    Original
    PDF CLE266 27x27x2 MS-034 548-Pin 27x27mm vt8233a vt1631 VT8233 VT1621 CLE266 RX6C pro266t CLE266 cd PRO266 via apollo

    BF244 datasheet

    Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
    Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216


    Original
    PDF 1N456 CPD64 1N456A. 1N457 1N457A. 1N458 BF244 datasheet 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910

    UJT 2n3904

    Abstract: transistor 2N4033 ujt 2N6027 2n4209 datasheet mj15003 equivalent transistor 2N5401 mj15004 2N4393 MJ15003 MJ15004 BAV45
    Text: Selection Guide Page Small Signal Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bipolar Power Transistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Programmable UJT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24


    Original
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