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    CPD66X Price and Stock

    Central Semiconductor Corp CPD66X-CLL459A-CT

    Diode Switching 200V 200mA Low Leakage Singulated Die Tray - Waffle Pack (Alt: CPD66X-CLL459A-CT)
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    Avnet Americas CPD66X-CLL459A-CT Waffle Pack 400
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    CPD66X Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: PROCESS CPD66X Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Die Size 17.5 x 17.5 MILS Die Thickness 5.9 MILS Anode Bonding Pad Area 7.9 MILS DIAMETER Top Side Metalization Al - 30,000Å Back Side Metalization Au-As - 13,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER


    Original     		PDF CPD66X CMOD3003 CMLD3003DOG CMPD3003A CMPD3003C CMPD3003S 19-July

    CPD64

    Abstract: 1N3595 1n457a equivalent
    Text: PCN # 110 Notification Date: 21 April 2009 mailto:processchange@centralsemi.com http://www.centralsemi.com/processchange Process Change Notice Parts Affected: Chip process CPD64, Low Leakage Diode discrete semiconductors, wafers, and die in chip form. Extent of Change:


    Original     		PDF CPD64, CPD64-CLL459A-CT CPD64-CMPD3003-CT CPD64-CMPD3003-WN CPD64-1N3595-CT CPD64-1N3595-WN CPD64-1N3595-WR CPD64-1N457A-CT CPD64-1N485B-CT CMDD3003 CPD64 1N3595 1n457a equivalent