Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CPGA LARGE CAVITY Search Results

    CPGA LARGE CAVITY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NFMJMPC156R0G3D Murata Manufacturing Co Ltd Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMI Filter) for General Purpose Visit Murata Manufacturing Co Ltd
    NFM31PC276D0E3L Murata Manufacturing Co Ltd Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMI Filter) for General Purpose Visit Murata Manufacturing Co Ltd
    NFMJMPL226R0G5D Murata Manufacturing Co Ltd Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMI Filter) for General Purpose Visit Murata Manufacturing Co Ltd
    MG80C186-12/BZC Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MC68040RC33A Rochester Electronics LLC Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 179 CPGA Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy

    CPGA LARGE CAVITY Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    CPGA large cavity

    Abstract: S-CPGA-P14
    Text: MECHANICAL DATA MCPG006A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P14 X 14 CERAMIC PIN GRID ARRAY A or A1 SQ 1.300 (33,02) TYP P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DIM MIN MAX Notes Large Outline Small Outline Cavity


    Original     		MCPG006A S-CPGA-P14 40401WITHIN MIL-STD-1835 CMGA18-PN, MO-067AF MO-066AF, CPGA large cavity PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG006A – JANUARY 1997 GA-GB S-CPGA-P14 X 14 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.300 (33,02) TYP P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DIM MIN MAX Notes Large Outline Small Outline Cavity Up Cavity Down Cavity


    Original     		MCPG006A S-CPGA-P14 PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		MCPG004A S-CPGA-P12 PDF

    CPGA large cavity

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004 – OCTOBER 1994 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		MCPG004 S-CPGA-P12 CPGA large cavity PDF

    P15 Package

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG007A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P15 X 15 CERAMIC PIN GRID ARRAY A or A1 SQ 1.400 (35,56) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DIM MIN MAX A 1.540 (39,12) 1.590 (40,38) Large


    Original     		MCPG007A S-CPGA-P15 MIL-STD-1835 CMGA19-PN, MO-067AG MO-066AG, P15 Package PDF

    MO-067-AJ

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG009A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline


    Original     		MCPG009A S-CPGA-P17 MIL-STD-1835 CMGA21-PN, MO-067AJ MO-066AJ, MO-067-AJ PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG007A – SEPTEMBER 1996 GA-GB S-CPGA-P15 X 15 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.400 (35,56) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DIM MIN MAX A 1.540 (39,12) 1.590 (40,38) Large Outline A1 1.480 (37,59)


    Original     		MCPG007A S-CPGA-P15 40ocal PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG009A – JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline Small Outline


    Original     		MCPG009A S-CPGA-P17 404011ocal PDF

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    RC5000

    Abstract: pipeline in core i3
    Text: MULTI-ISSUE 64-BIT MICROPROCESSOR IDT RC5000 Integrate d Device Technology, Inc. FEATURES • • Dual issue super-scalar execution core, executing at high-frequency - 250 MHz frequency - Dual issue floating-point ALU operations with other instruction classes


    Original     		64-BIT RC5000 500mflops 223-pin 272-pin IDT79RV5000 200MHz RC5000 pipeline in core i3 PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    AA19

    Abstract: IDT79RV5000 R4640 R4650 R4700 R5000
    Text: IDT79RV5000 MULTI-ISSUE ORION 64-BIT MICROPROCESSOR Integrated Device Technology, Inc. FEATURES • Dual issue super-scalar execution core, executing at high-frequency - 200 MHz frequency - Dual issue floating-point ALU operations with other instruction classes


    Original     		IDT79RV5000TM 64-BIT SPECint95 SPECfp95 IDT79 223-pin 272-pin IDT79RV5000 AA19 R4640 R4650 R4700 R5000 PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    "64-Bit Microprocessor" features

    Abstract: 79RC5000 RC32364 RC4640 RC4650 RC64474 RC64475
    Text: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR Features Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis


    Original     		79RC5000 64-BIT 125MHz 223-ball BS272 272-ball IDT79RV5000 200MHz "64-Bit Microprocessor" features 79RC5000 RC32364 RC4640 RC4650 RC64474 RC64475 PDF

    "64-Bit Microprocessor"

    Abstract: 600MF
    Text: MULTI-ISSUE 64-BIT MICROPROCESSOR Features 79RC5000 ◆ Large, efficient on-chip caches 32KB Instruction Cache, 32KB Data Cache 2-set associative in each cach Virtually indexed and physically tagged to minimize cache flushes Write-back and write-through selectable on a per page


    Original     		64-BIT 79RC5000 600mflops 223-ball 272-ball IDT79RV5000 200MHz "64-Bit Microprocessor" 600MF PDF

    Untitled

    Abstract: No abstract text available
    Text: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXU WXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis


    Original     		64-BIT 79RC5000 500mflops 223-ball BS272 272-ball IDT79RV5000 PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    STR A 6169

    Abstract: RC64474 RC64475 79RC5000 RC32364 RC4640 RC4650
    Text: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis


    Original     		79RC5000 64-BIT 125MHz 223-ball BS272 272-ball IDT79RV5000 200MHz STR A 6169 RC64474 RC64475 79RC5000 RC32364 RC4640 RC4650 PDF

    TDS-701

    Abstract: dhrystone
    Text: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXU WXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis


    Original     		79RC5000 64-BIT 125MHz 223-ball BS272 272-ball IDT79RV5000 200MHz TDS-701 dhrystone PDF

    Untitled

    Abstract: No abstract text available
    Text: FEATURES - - High-performance memory system - Large primary caches integrated on-chip - Secondary cache control interface on-chip - High-frequency 64-bit bus interface runs up to 100MHz - Aggregate bandwidth of on-chip caches, system interface of 5GB/s - High-performance write protocols for graphics and


    OCR Scan     		64-bit 100MHz 223-pin 272-pin IDT79RV5000 200MHz 250MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: MULTI-ISSUE 64-BIT MICROPROCESSOR I I IDT FEATURES IDT RC5000 High-performance memory system - Large primary caches integrated on-chip - Secondary cache control interface on-chip - High-frequency 64-bit bus interface runs up to 100MHz - Aggregate bandwidth of on-chip caches, system


    OCR Scan     		64-BIT RC5000 500mf IDT79 223-pin 272-pin IDT79RV5000 200MHz PDF