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    CPU SHIPPING TRAYS Search Results

    CPU SHIPPING TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    P87C51FB-4B Rochester Electronics LLC P87C51 - Microcontroller, 8-Bit, 80C51 CPU Visit Rochester Electronics LLC Buy
    ELANSC300-33KC-G Rochester Electronics LLC ELANSC300 - Microcontroller, 32-Bit CPU Visit Rochester Electronics LLC Buy
    MC68HC711E9FNE3-G Rochester Electronics LLC MC68HC711 - Microcontroller, 8-Bit, UVPROM, 6800 CPU, 3MHz, CMOS Visit Rochester Electronics LLC Buy
    P8044AH-G-RC0117 Rochester Electronics LLC P8044 - Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS Visit Rochester Electronics LLC Buy
    TP8044AH-RC0117 Rochester Electronics P8044 - Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS Visit Rochester Electronics Buy

    CPU SHIPPING TRAYS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    motherboard with multimeter

    Abstract: cpu fan "AMD Processor" AMD Processor Power and Thermal
    Text: Visual/Mechanical, Packing, Shipping, Storage & Handling Guidelines for AMD Distributors & Resellers Microprocessor returns that are Out-of-Warranty or have any of the following types of severe visual-mechanical damage may not be returned. These include: 1. Chips or Cracks in the Package or Die


    Original     		PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    L358

    Abstract: Q739 OLGA L357 marking code S C transistor Q739 80523PY400512PE INTEL confidential pentium 80523PY450512PE intel top mark
    Text: Product Change Notification Product Change Notification Change Notification #: 723, Revision 2 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of


    Original     		PDF 80523KX400512 L358 Q739 OLGA L357 marking code S C transistor Q739 80523PY400512PE INTEL confidential pentium 80523PY450512PE intel top mark

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    L358

    Abstract: 80523PY400512PE L357 q738
    Text: Product Change Notification Please respond your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth


    Original     		PDF 50-Unit L358 80523PY400512PE L357 q738

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1

    AAEC-2000

    Abstract: CO-029 circuit diagram of gsm smart switch aaec
    Text: Preliminary Information Agilent AAEC-2000 Information Appliance Processor Mobile Information Appliance Platform Data Sheet Description The Agilent AAEC-2000 is a high-performance, low power, super-integrated system chip designed to be the heart of a Personal Multimedia Digital Assistant. Its


    Original     		PDF AAEC-2000 ARM920TTM ARM920T 16Kbytes 40Kbytes CO-029 circuit diagram of gsm smart switch aaec

    compact flash controller with apb interface

    Abstract: AAEC-2000 ARM920T rom digital lcd frame video player PCMCIA SRAM Card AC97 ARM920T CO-029
    Text: Preliminary Information Agilent AAEC-2000 Information Appliance Processor Mobile Information Appliance Platform Data Sheet Description The Agilent AAEC-2000 is a high-performance, low power, super-integrated system chip designed to be the heart of a Personal Multimedia Digital Assistant. Its


    Original     		PDF AAEC-2000 AAEC-2000 ARM920TTM ARM920T compact flash controller with apb interface ARM920T rom digital lcd frame video player PCMCIA SRAM Card AC97 CO-029

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET 8300 Series Dual-Personality 16Gb Fibre Channel/10GbE to PCIe Converged Network Controllers Overview The 8300 Series Controllers are QLogic’s fourth generation of Converged Network Controllers. They boast industry-leading native Fibre Channel performance—achieving dual-port, line-rate, 16-gigabit Fibre Channel throughput—at extremely low CPU utilization with full


    Original     		PDF Channel/10GbE 16-gigabit 10Gbps

    MPXY8600

    Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
    Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.


    Original     		PDF SG187Q42009 MPC5668G S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 MPC5553 MPXY8600 MPC5674 MPC5603 MPC56xx MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E

    Amkor SBGA

    Abstract: JEDEC Matrix Tray outlines MO-192 copper bond wire amkor CO-029 jedec bga tray MO192 192 BGA PACKAGE thermal resistance
    Text: LAMINATE data sheet SuperBGA Features: SuperBGA® SBGA Packages: The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated,


    Original     		PDF

    CKMNG

    Abstract: CK-MNG 9FGP202AKLFT StR 40000 DOT96MHZ
    Text: ICS9FGP202A Integrated Circuit Systems, Inc. Frequency Timing Generator for Peripherals • OE_RMIIA RMII3 40 39 38 37 36 35 34 33 32 31 GND VDD96 DOT96SST DOT96SSC OE_96 OE_CPU CPUCLKT0 CPUCLKC0 VDDCPU GNDCPU 1 2 3 4 5 6 7 8 9 10 30 29 28 27 26 25 24 23 22


    Original     		PDF ICS9FGP202A 50MHz 96MHz 33MHz 768KHz 25MHz VDD96 DOT96SST DOT96SSC VDD32K CKMNG CK-MNG 9FGP202AKLFT StR 40000 DOT96MHZ

    Untitled

    Abstract: No abstract text available
    Text: DATASHEET Fre que ncy T im ing Ge ne rat or for Pe riphe ra ls 9 FGP2 0 4 VDDRMII RMII1 RMII0 VDDRGMII GNDRGMII RGMII1 RGMII0 SMBCLK VttPwr_GD/PD# Output Features: • 1 - 0.7V current-mode differential CPU pair • 6 - 50MHz RMII outputs • 2 - 125MHz RGMII outputs


    Original     		PDF 50MHz 125MHz 96MHz 33MHz 768KHz 25MHz VDD96 DOT96SST DOT96SSC 33MHz

    ICS9FGP204

    Abstract: DOT96 XTAL 50MHZ
    Text: DATASHEET Frequency Timing Generator for Peripherals 9FGP204 VDDRMII RMII1 RMII0 VDDRGMII GNDRGMII RGMII1 RGMII0 SMBCLK VttPwr_GD/PD# Output Features: • 1 - 0.7V current-mode differential CPU pair • 6 - 50MHz RMII outputs • 2 - 125MHz RGMII outputs •


    Original     		PDF 50MHz 125MHz 96MHz 33MHz 768KHz 25MHz 100ppm ICS9FGP204 DOT96 XTAL 50MHZ

    9FGP202AKLFT

    Abstract: StR 40000 9FGP202AKLF
    Text: DATASHEET 9FGP202A FREQUENCY TIMING GENERATOR FOR PERIPHERALS General Description Features/Benefits The 9FGP202A is a peripheral clock for Intel Server. It is driven with a 25MHz crystal and generates CPU outputs up to 400MHz. An SMBus interface allows full control of the


    Original     		PDF 9FGP202A 9FGP202A 25MHz 400MHz. 96MHz 96MHz 50MHz 33MHz 768KHz 9FGP202AKLFT StR 40000 9FGP202AKLF

    r61503

    Abstract: em6420 minolta LS100 R61503U fluorescen LM3570 LS100 "DATA VISION" 16 X 2 LCD MODULE DATA VISION LCD MODULE capactive touch panel SPECIFICATION
    Text: EM MICROELECTRONIC - MARIN SA 365340.CP37 / A EM2.2P TFT MODULE With optional digial capactive touch TABLE OF CONTENTS 1. 2. PURPOSE .2


    Original     		PDF CH-2074 Center/03 r61503 em6420 minolta LS100 R61503U fluorescen LM3570 LS100 "DATA VISION" 16 X 2 LCD MODULE DATA VISION LCD MODULE capactive touch panel SPECIFICATION

    NM10 Express Chipset

    Abstract: 9lprs436 nm10 n450 pin configuration intel atom 9lprs4 INTEL application notes oscillator 2010 9LPRS43
    Text: DATASHEET Low Power Clock for Intel Atom -Based Systems ICS9LPRS436C Key Specifications: • CPU outputs cycle-cycle jitter < 85ps • PCIEX outputs cycle-cycle jitter < 125ps • SATA outputs cycle-cycle jitter < 125ps • PCI outputs cycle-cycle jitter < 500ps


    Original     		PDF N450/D410/D510 SATA75 DOT96 33MHz) 48MHz 12/48MHz 25MHz 318MHz 288MHz NM10 Express Chipset 9lprs436 nm10 n450 pin configuration intel atom 9lprs4 INTEL application notes oscillator 2010 9LPRS43

    MPXY8300A6U

    Abstract: mpx6115 MPL115A1 how to connect pressure to MPX2102 MPX2202 Series MPXY8320A MPXV7002DP MPXY8300B6T1 LFSTBEB7660 lga 115
    Text: Sensors Quarter 3, 2009 SG1010Q32009 Rev 0 ACCELERATION SENSORS Low g Digital Output Consumer Acceleration Sensors Product Sensing Range ±g Sensing Axis High Sensitivity (LSB/g) IDD ( A) Sleep Mode Response Time (Typ) (ms) Start Up Response Time (Typ) (ms)


    Original     		PDF SG1010Q32009 MMA7660FC MMA7456L MMA7455L MPXY8300A6U mpx6115 MPL115A1 how to connect pressure to MPX2102 MPX2202 Series MPXY8320A MPXV7002DP MPXY8300B6T1 LFSTBEB7660 lga 115

    932S421

    Abstract: pin configuration intel atom 9LPRS43 9lprs 8087-2 9lprs4 pcie-3
    Text: DATASHEET Low Power Clock for Intel Atom -Based Systems 9LPRS436C Key Specifications: • CPU outputs cycle-cycle jitter < 85ps • PCIEX outputs cycle-cycle jitter < 125ps • SATA outputs cycle-cycle jitter < 125ps • PCI outputs cycle-cycle jitter < 500ps


    Original     		PDF N450/D410/D510 SATA75 DOT96 33MHz) 48MHz 12/48MHz 25MHz 318MHz 288MHz 932S421 pin configuration intel atom 9LPRS43 9lprs 8087-2 9lprs4 pcie-3