2012size
Abstract: No abstract text available
Text: PSF www.vishay.com Vishay Dale Metal Film Resistors, High Precision, High Stability, Surface Mount FEATURES • Extremely low temperature coefficient of resistance • Molded encapsulation • Wraparound compliant terminations eliminate the risk of solder fillet cracking
|
Original
|
PDF
|
PSF2012
PSF4527
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
2012size
|
Untitled
Abstract: No abstract text available
Text: Multilayer Ceramic Chip Capacitors FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE 16V TO 5KV • HIGH CAPACITANCE (UP TO 10 F) • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* NMC-P Series RoHS Compliant
|
Original
|
PDF
|
180pF
30ppm/Â
16Vdc,
25Vdc,
50Vdc,
150pF
|
Open Mode Capacitors
Abstract: No abstract text available
Text: X7R Open Mode and Tandem MLCC Capacitors Open Mode Range Open Mode capacitors have been designed specifically for use in applications where mechanical cracking is a severe problem and short circuits due to cracking are unacceptable. Open Mode capacitors use inset electrode margins, which prevent any mechanical cracks
|
Original
|
PDF
|
39quantities
P107474)
Open Mode Capacitors
|
Untitled
Abstract: No abstract text available
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: MULTILAYER VARISTORS Reliability and Test Conditions ITEM 0402 Operating temp. Range Storage temp. & humidity Requirements 0603 0805 Test Condition 1206 -55 ~ +125°C - 40°C max, 70% RH max. Packed Condition Resistance to solder heat 1. No damage such as cracks should be visible in chip element.
|
Original
|
PDF
|
tempera30
|
mch 210
Abstract: No abstract text available
Text: Types MCH and MCHN Multilayer RF Capacitors 2500 Volt RF Capacitors for Medical Imaging Coils, Plasma Generators, Transmitters and Antenna Tuning with Nonmagnetic Option Mica’s natural rugged flexibility and high tempera ture threshold eliminates cracking and permits wave
|
Original
|
PDF
|
|
code 8r2
Abstract: No abstract text available
Text: Multilayer Ceramic Capacitors OP Series OPEN-MODE DESIGN MERITEK FEATURES • • • Minimize the short curcuit probability due to flex cracks High current applications Input side filtering PART NUMBER SYSTEM OP 0805 XR 101 K 500 Meritek Series Size Dielectric
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Multilayer Ceramic Chip Capacitors FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE 16V TO 5KV • HIGH CAPACITANCE (UP TO 10 F) • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* NMC-P Series RoHS Compliant
|
Original
|
PDF
|
180pF
30ppm/
16Vdc,
25Vdc,
50Vdc,
100Vdc,
200Vdc,
250Vdc,
500Vdc,
630Vdc,
|
1210 ceramic capacitor .22uf 10 250V
Abstract: capacitor 560 pF 500V 0.018uf NMCP1206X7R
Text: Multilayer Ceramic Chip Capacitors NMC-P Series FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • X7R DIELECTRIC, HIGH VOLTAGE 50V TO 1KV • WIDE VALUE RANGE (180pF ~ 2.2µF) includes all homogeneous materials • RoHS COMPLIANT
|
Original
|
PDF
|
180pF
50Vdc,
100Vdc,
200Vdc,
250Vdc,
500Vdc,
630Vdc
000Megohm
500Megohm/
1210 ceramic capacitor .22uf 10 250V
capacitor 560 pF 500V
0.018uf
NMCP1206X7R
|
Untitled
Abstract: No abstract text available
Text: application brief AB13 Soldering SuperFlux LEDs SuperFlux LEDs HPWx xxxx Standard Part Numbers Caution is recommended with the preheat conditions to ensure that the LED lamps are not damaged due to prestressing. Prestress damage can result in cracks and/or delamination of structures within the device.
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: MIOCONNECTOR Board-to-wire HIT Features ●Low profile AIT Using the short length female terminal, low profile is realized. HCM ●Solder crack prevention configuration Pin configuration of PC board side connector is designed for solder crack prevention. MIO
|
Original
|
PDF
|
SHCM-A03T-P025
MK/SHCM-A03-025
MK/SHCM-A04-025
SHCM-A03-025
SHCM-A04-025
SHCM-A04T-P025
|
SHCM-A03T-P025
Abstract: SHCM-A04T-P025
Text: MIOCONNECTOR Board-to-wire Features ●Low profile Using the short length female terminal, low profile is realized. ●Solder crack prevention configuration Pin configuration of PC board side connector is designed for solder crack prevention. ●Reliability
|
Original
|
PDF
|
SHCM-A03T-P025
SHCM-A04T-P025
MK/SHCM-A03-025
MK/SHCM-A04-025
SHCM-A03-025
SHCM-A04-025
|
Maruwa chip capacitor
Abstract: kc40 VC70 Maruwa chip capacitor datasheet RC40 RC70 RC80 Maruwa capacitor
Text: MARUWA GENERAL CATALOG HANDLING PRECAUTIONS a Mounting 1. Chip mounting 1 While mounting, if the bottom dead point of the suction nozzle is too low, the force on the chip may be great enough to cause breaking or cracking. Adjust the distance of the botton dead point of the nozzle from the top surface of the chip, after resetting
|
Original
|
PDF
|
300gf
Maruwa chip capacitor
kc40
VC70
Maruwa chip capacitor datasheet
RC40
RC70
RC80
Maruwa capacitor
|
PSF20
Abstract: No abstract text available
Text: PSF www.vishay.com Vishay Dale Metal Film Resistors, High Precision, High Stability, Surface Mount FEATURES • Extremely low temperature coefficient of resistance • Molded encapsulation • Wraparound compliant terminations eliminate the risk of solder fillet cracking
|
Original
|
PDF
|
PSF2012
PSF4527
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
PSF20
|
|
array resistor
Abstract: MORY mechanical engineering ESD process MEMORY MODULE
Text: Memory Module Handling Guide Since 2005 Module Module Process Process Engineering Engineering Group Group 1 11 Overview Recently memory module failure related with TSOP, FBGA or 4 array resistor crack has increased. Main root causes are mechanical damage caused by wrong handling
|
Original
|
PDF
|
|
EK 110
Abstract: WSF2012 WSF201 WSF4527 WSF25
Text: WSF Vishay Dale Metal Film Resistors, Power, Surface Mount FEATURES • Molded encapsulation • Wraparound Compliant Terminations eliminate risk of solder fillet cracking Pb-free Available e3 • Solderable terminations • Excellent stability at different environmental
|
Original
|
PDF
|
WSF2012
WSF2515
WSF4527
18-Jul-08
EK 110
WSF2012
WSF201
WSF4527
WSF25
|
DC varistor
Abstract: 14D220K VCR-14D220K vcr14d vcr14 VCR-14D 14D220 2003UL
Text: 規 格 承 認 書 SPECIFICATION SPECIFICATION PART NO. NO. PAGE 1 OF 2 VCR-14D220K DATE: 07 Augest, 2003 UL CSA 1. Machenical Requirements 1.1 1.2 APPEARANCE WITHOUT ANY CRACK, MARKING SHOULD BE CLEAR DIMENSIONS DIMENSIONS mm w 2.ELECTRICAL PARAMETER 2.1
|
Original
|
PDF
|
VCR-14D220K
DC varistor
14D220K
VCR-14D220K
vcr14d
vcr14
VCR-14D
14D220
2003UL
|
Untitled
Abstract: No abstract text available
Text: Crimp 2.5mm XAD CONNECTOR Disconnectable Crimp style connectors .098" pitch Features ––––––––––––––––––––––– • Solder crack prevention The header wafer is manufactured using glass-filled PA66 nylon, as a prevention against solder crack.
|
Original
|
PDF
|
UL94V-0
|
MC18
Abstract: 1210 case 8290 Cornell Dubilier MC08CA010D-F MC08CA020D-F MC08CA030D-F MC08CA070D-F MC08CA080D-F MC08CA090D-F
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural mica
|
Original
|
PDF
|
|
100812
Abstract: H63A
Text: Ferrite Chip EMI Suppressors ACB Series RELIABILITY AND TEST CONDITIONS Item Performance Operating temperature range -2 5 to +85°C Test conditions Storage temperature and humidity ranges 40°C max., 70%RH max. Soldering heat resistance The chip must have no cracks.
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: 7 PART NUMBER AWG DIM B DIM C 5 6 DIM E DIM F 5D-82024-*«01 TYPE OF FORM 4 3 2 CODE A STRIP C 5D-82024-««02 LOOSE PIECE C 1. MA X BURR .005/.002 : NO CRACK5. 5L1VER5 OR ORANGE PEEL 5D-82024— 03 5TRIP A 2. MA X CAMBER 3.175/. 125 IN 610/24 5D-82024—
|
OCR Scan
|
PDF
|
5D-82024-*
5D-82024-Â
5D-82024â
SD-82024â
|
din 74234
Abstract: din 73378 TUBE din 73378 74234 BS5409 High pressure polyurethane TUBE din 74234 T50Y0007
Text: Non-Return Valves T50 Series In Line Push-ln Non-Return Valves 4, 6, 8 , 1 0 , 12m m 0 D M etric tube 5/32m, W , 5/i6 M, 3/8m, 1/ 2 mInch tube • A llow free flo w in one direction only • S im ple reliable design • Low w eight • Low cracking pressure
|
OCR Scan
|
PDF
|
T50P0010
C/520
din 74234
din 73378
TUBE din 73378
74234
BS5409
High pressure polyurethane
TUBE din 74234
T50Y0007
|
E107536
Abstract: No abstract text available
Text: Date 02/17/12 03/09/12 SYM A B REVISION RECORD AUTH DR. CK. Updated Specification Updated UL Rating T.B. B.S. T.B. B.S. 25.40 [1.00] i 2.59 [0.10] 1 ~ SPECIFICATIONS: * Material- Polypropylene, High environment stress crack resistance, Color Clear Flammability rating: UL94-HB, file no. E107536
|
OCR Scan
|
PDF
|
UL94-HB,
E107536
BHSD-2032
BHSD-2032-CDVER
E107536
|
Untitled
Abstract: No abstract text available
Text: N D T E S iU n le s s o th e r w is e s p e c ifie d , IMMATERIAL: FLUOROPOLYMER, THERMOPLASTIC. COLOR BLACK. 2. PARTS SHALL BE FREE OF FLASH, VOIDS, SINKS, SHORTS, AND CRACKS. A | B INITIAL RELEASE |ADDED TABLE TO THE DRAWING. 0 .0 7 2 T_ J 4 9B 7/20/92 524
|
OCR Scan
|
PDF
|
1X20-011B-I
|