S10357-01
Abstract: S10356-01
Text: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.
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S10356-01
S10357-01
S10356-01
S10357-01
SE-171
KSPD1075E08
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Untitled
Abstract: No abstract text available
Text: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.
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S10356-01
S10357-01
S10356-01
S10357-01
SE-171
KSPD1075E07
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Untitled
Abstract: No abstract text available
Text: Si photodiodes S10355-01 S10356-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.
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S10355-01
S10356-01
S10356-01
S10357-01
KSPD1075E09
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Untitled
Abstract: No abstract text available
Text: Si photodiodes S10355-01 S10356-01 Back-illuminated type photodiodes employing CSP structure The S10355-01 and S10356-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.
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S10355-01
S10356-01
S10355-01
S10356-01
B1201,
KSPD1075E09
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dycostrate
Abstract: CH-2074 without underfill
Text: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP
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CH-2074
D-13355
dycostrate
without underfill
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Untitled
Abstract: No abstract text available
Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and
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48-PIN
Abstract: FBGA048-P-0808 LH28F800BGH-L LH28F800BG-L TSOP048-P-1220
Text: LH28F800BG-L/BGH-L FOR TSOP, CSP LH28F800BG-L/BGH-L (FOR TSOP, CSP) 8 M-bit (512 kB x 16) SmartVoltage Flash Memories DESCRIPTION The LH28F800BG-L/BGH-L flash memories with SmartVoltage technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide
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LH28F800BG-L/BGH-L
LH28F800BG-L/BGH-L
LH28F800BGXX-XL85
LH28F800BGXX-XL12
TSOP048-P-1220)
FBGA048-P-0808)
48-PIN
FBGA048-P-0808
LH28F800BGH-L
LH28F800BG-L
TSOP048-P-1220
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LH28F800SG
Abstract: 48-PIN FBGA048-P-0808 LH28F800SGH-L LH28F800SG-L TSOP048-P-1220
Text: LH28F800SG-L/SGH-L FOR TSOP, CSP LH28F800SG-L/SGH-L (FOR TSOP, CSP) 8 M-bit (512 kB x 16) SmartVoltage Flash Memories DESCRIPTION The LH28F800SG-L/SGH-L flash memories with SmartVoltage technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide
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LH28F800SG-L/SGH-L
LH28F800SG-L/SGH-L
LH28F800SGXX-L70
LH28F800SGXX-L10
TSOP048-P-1220)
FBGA048-P-0808)
LH28F800SG
48-PIN
FBGA048-P-0808
LH28F800SGH-L
LH28F800SG-L
TSOP048-P-1220
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sharp LRS1360
Abstract: LRS1B03 LRS1B04 LRS1B05 LRS1B06 LRS1B07 sram 3.3 16bit
Text: NEW PRODUCT INFORMATION LRS1B05 4-chip Stacked CSP Combination Memory * Under development < Outline > LRS1B05, consisting of a 64-Mbit flash memory , a 12-Mbit SRAM and a 16-Mbit RAM, is a composite memory chip that is being developed by applying stacked CSP technology to integrate the constituent memories into a large-capacity,
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LRS1B05
LRS1B05,
64-Mbit
12-Mbit
16-Mbit
64-Mbit
12-Mbit
16-Mbit
IC-E088
sharp LRS1360
LRS1B03
LRS1B04
LRS1B05
LRS1B06
LRS1B07
sram 3.3 16bit
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8 bit memory ic
Abstract: flash memory IC-032 SRAM LCD PANEL 32"
Text: NEW PRODUCT INFORMATION LR-S1366/67 32 M Flash Memory + 8 M SRAM Stacked CSP Combination Memory LR-S1368/69 32 M Flash Memory + 12 M SRAM Stacked CSP Combination Memory Outline Under Development LR-S1366/67 and LR-S1368/69 are combination memories that realize great capacity on single chips using Sharp’s
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LR-S1366/67
LR-S1368/69
LR-S1366/67
LR-S1368/69
LR-S1366/67)
IC-032
8 bit memory ic
flash memory
IC-032
SRAM
LCD PANEL 32"
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RJ63YC100
Abstract: LR36B15 LR36b03 LR38627 RJ2321 LR388H3 IR2E67M pq1cx41h2zpq RJ2341 sharp RJ63YC100
Text: CONTENTS Sharp Efforts Towards a Green Society . 2 Developing Devices with High Environmental Performance. 4 Raising the Level of Environmental Performance in Factories . 5 TFT LCD 6 LSI REG PACKAGES 32 CSP Chip Size Package .
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JQA-AU0212)
ISO/TS16949:
HT9A17E
RJ63YC100
LR36B15
LR36b03
LR38627
RJ2321
LR388H3
IR2E67M
pq1cx41h2zpq
RJ2341
sharp RJ63YC100
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transistor b 1238
Abstract: 15 ball CSP thermal analysis on pcb uBGA device MARKing intel air conditioning bumper 28F008SC IR 126 D 24
Text: 7.0 QUALITY AND RELIABLITY ENGINEERING PACKAGE CERTIFICATION 7.1 Introduction The µBGA package is a chip-scale package CSP , which utilizes a polyimide tape with eutectic solder balls. The µBGA package offers an application in smaller form factors with
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28F6408J3
Abstract: 28F6408J3A Intel SCSP
Text: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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28F6408J3
64-Mbit
64-Kword
128-bit
AP-663
AP-660
AP-646
28F6408J3
28F6408J3A
Intel SCSP
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Untitled
Abstract: No abstract text available
Text: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •
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TPS62650
TPS62651
SLVS808B
800-mA,
TPS62650,
TPS6265x
800mA
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Untitled
Abstract: No abstract text available
Text: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •
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TPS62650
TPS62651
SLVS808B
800-mA,
TPS62650,
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MO-195
Abstract: Intel BGA Solder BGA PACKAGE OUTLINE flash memory databook World transistors databook 28F008B3 28F016B3 28F016S3 28F160B3 28F160S3
Text: 1.0 THE µBGA* PACKAGE: INTEL’S LATEST FLASH MEMORY PACKAGE 1.1 Introduction During the last several years, Intel’s Flash Memory Components Division has conducted research on next-generation Chip-Size Packaging CSP for flash memory. Intel’s customers in
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Untitled
Abstract: No abstract text available
Text: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •
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TPS62650
TPS62651
SLVS808B
800-mA,
TPS62650,
TPS6265x
800mA
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252633
Abstract: INTEL STRATAFLASH 1.8V
Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash
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256-Mbit
L18/L30)
48F3300L0YDQ0
48F3300L0ZDQ0
128-Mbit
48F3300L0YDQ0
48F3300L0ZDQ0
252633
INTEL STRATAFLASH 1.8V
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JESD22-B117
Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
Text: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP
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Si8902EDB
25-Apr-08
JESD22-B117
MICRO SWITCH PRESSURE PCB
JEDEC JESD22-B117
JESD22-A104-A
smd marking 2x5
micro pitch BGA
Lead Free reflow soldering profile BGA
PCB design for very fine pitch csp package
JESD22-A108-A
JESD22-A110
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l18scsp
Abstract: 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH
Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash
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256-Mbit
L18/L30)
48F3300L0YDQ0
48F3300L0ZDQ0
128-Mbit
l18scsp
128L18
48F3300L0YDQ0
48F3300L0ZDQ0
28F128L18
28F128L30
251902
RD48F3300L0YDQ0
INTEL STRATAFLASH
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SAC266
Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.
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J-STD-012
SAC266
SAC405
IPC-6012
BGA Solder Ball compressive force
WLCSP stencil design
IPC-6012A
LATTICE SEMICONDUCTOR Tape and Reel Specification
IPC-4101
IPC-7525
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LRS1816
Abstract: LRS1B03 LRS1B04 LRS1B06 LRS1B07 sharp page buffer
Text: NEW PRODUCT INFORMATION LRS1B03/04/06/07 4-chip Stacked CSP Combination Memory < Outline > A multitude of multimedia services, including the distribution of information, electronic settlements of accounts and even TV-phones, are predicted thanks to improved baud rates in next generation cellular phones.
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LRS1B03/04/06/07
200-Mbits
LRS1B07)
IC-E078
LRS1816
LRS1B03
LRS1B04
LRS1B06
LRS1B07
sharp page buffer
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Untitled
Abstract: No abstract text available
Text: CSP-9 TPS62650-Q1 www.ti.com SLVSB62A – MARCH 2012 – REVISED MARCH 2012 800-mA, 6-MHz High-Efficiency Step-Down Converter With I2C Compatible Interface in Chip-Scale Packaging Check for Samples: TPS62650-Q1 FEATURES • • • APPLICATIONS 1 23 •
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TPS62650-Q1
SLVSB62A
800-mA,
AEC-Q100
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TOKO coil
Abstract: lqm21p
Text: CSP-9 TPS62650-Q1 www.ti.com SLVSB62A – MARCH 2012 – REVISED MARCH 2012 800-mA, 6-MHz High-Efficiency Step-Down Converter With I2C Compatible Interface in Chip-Scale Packaging Check for Samples: TPS62650-Q1 FEATURES • • • APPLICATIONS 1 23 •
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TPS62650-Q1
SLVSB62A
800-mA,
AEC-Q100
TOKO coil
lqm21p
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PDF
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