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    CSP40 Price and Stock

    Essentra Components CSP4-01

    COLLAR SPACER PIN .295"
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CSP4-01 Bulk 7,504 1
    • 1 $0.31
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    • 100 $0.183
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    Mouser Electronics CSP4-01 75
    • 1 $0.26
    • 10 $0.192
    • 100 $0.163
    • 1000 $0.149
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    RS CSP4-01 Bulk 4 Weeks 1,000
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    DB Roberts CSP4-01
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    Espros Photonics EPC300-CSP4-001

    SENSOR PHOTODIODE 850NM 4XFBGA
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    DigiKey EPC300-CSP4-001 Reel 500
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    IDEC Corporation CSP40K4

    Capacitive Touch Sensors Capacitive Sensor
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    Mouser Electronics CSP40K4
    • 1 $120.56
    • 10 $100.47
    • 100 $93.77
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    Sager CSP40K4
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    Thomas & Betts CSP40

    Cu Tp Splice Short Brl 4/0Str Pur |Abb Thomas & Betts CSP40
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    Newark CSP40 Bulk 10
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    • 100 $12.97
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    Onlinecomponents.com CSP40
    • 1 -
    • 10 $9.44
    • 100 $7.32
    • 1000 $6.52
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    Master Electronics CSP40
    • 1 -
    • 10 $9.44
    • 100 $7.32
    • 1000 $6.52
    • 10000 $6.29
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    Electrolube ECSP400D

    Electronic Cleaning Solvent Plus, 400Ml; Cleaner Type:General Purpose; Cleaner Applications:Computers, Electrical; Dispensing Method:Can; Volume:400Ml; Weight:-; Product Range:Ecsp Series Rohs Compliant: Yes |Electrolube ECSP400D (Alternate Part Number: 5028356100279
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    Newark ECSP400D Bulk 12
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    Find more CSP40 price and stock on Findchips.com

    CSP40 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CSP4-01 Richco Accessories, Hardware, Fasteners, Accessories, COLLAR SPACER PIN .295" Original PDF

    CSP40 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: T&B Catalog Number: UPC Number: Description: CSP40 Status: Active 78378613211 Copper Splice - Short Barrel - max 35KV, 4/0 Str. Wire, Tin Plated, Purple Features - Made of high-conductivity seamless copper tubing. Tin plated for c - Specifically chamfered barrel for ease of installation.


    Original     		PDF CSP40 3B-50

    AD8015 Circuits

    Abstract: ADN2926 AD8066 adn2927 tunable ROSA AD5390 AD5390-3 AD8015 ADN8831 AD7665
    Text: Optical and High Speed Networking CONTINUOUS RATE CDR AND SERDES • BEST JTOL, JGEN, JTRAN OF ANY CDR • 12.5 Mbps to 2.7 Gbps and 10 Gbps BACKPLANE SWITCHES • 3.2 Gbps SWITCH FOR REDUNDANCY OPTICAL TRANSCEIVER PIN TIA LIMITING AMP LASER LDD CDR EYE OPENER


    Original     		PDF ADN2815 ADN2816 B05369-50-2/05 AD8015 Circuits ADN2926 AD8066 adn2927 tunable ROSA AD5390 AD5390-3 AD8015 ADN8831 AD7665

    Untitled

    Abstract: No abstract text available
    Text: 401036.03BB 3/11/02 3:40 PM Page 141 Colour-Coded Compression Connectors COMPRESSION ® Type CSP — Copper Splices, Short Barrel Copper Compression Connectors • For use with copper conductor: AWG stranded, flexible cable, welding cable and portable cord


    Original     		PDF BlackburCSP30 CSP40 CSP250 CSP300 CSP350 CSP400 CSP500 CSP600 CSP750 CSP1000

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    CSP-4

    Abstract: CSR6-224-01 RMS 01 CSR8 CSR6-295-01 CSP6-01 csp8-01 csr8-394-01
    Text: PART NO. CSP4-01 CSP6-01 CSP8-01 "B" DIA. ±.010 [±0.25] .295 [7.5] .394 [10.0] .436 [11.0] "C" DIA. "D" REF. "E" REF. -.29 [7.3] .33 [8.3] -.12 [3.0] .14 [3.6] .10 [2.5] .20 [5.0] .22 [5.5] "B" "C" MOUNTING HOLE DIA. ±.003 [±0.08] RECOMMENDED SCREW SIZE


    Original     		PDF CSP4-01 CSP6-01 CSP8-01 CSR4-224-01 CSR4-295-01 CSR4-394-01 CSR4-591-01 CSR4-787-01 CSR6-224-01 CSR6-295-01 CSP-4 CSR6-224-01 RMS 01 CSR8 CSR6-295-01 CSP6-01 csp8-01 csr8-394-01

    KL SN 102 94v0

    Abstract: ASTM d4066 ms3367 RBS 6601 Installation guide for RBS 6000 SHK 55-65 Scanbe ejector kit rbs 6501 cr40 steel 11633-1 SCANBE KL SN 102 94v
    Text: RI-55006 cat cover for pdf 8/5/02 9:48 AM Page 2 2002 NEW PRODUCTS DISTRIBUTOR LOCATIONS WORLDWIDE RICHCO USA Please call Customer Service 773 539-4060, Samples (800) 621-1892, or visit www.richcoinc.com for your nearest distributor location. EUROPE Alldistri Handelsges. m.b.H.


    Original     		PDF RI-55006 3000-Rupea-Brasov SR-3230 OFS90 WIT-30AR PPR-10 KL SN 102 94v0 ASTM d4066 ms3367 RBS 6601 Installation guide for RBS 6000 SHK 55-65 Scanbe ejector kit rbs 6501 cr40 steel 11633-1 SCANBE KL SN 102 94v

    Thomas Betts blackburn

    Abstract: burndy compression die index csa 26 WR1010 ATL500 B76AH rs808 burndy compression clamp crimping die ATL30-12 B72AH B74AH
    Text: CONNECTORS Compression H-Tap Connectors Compression Connectors Type WR – Wide Range Aluminum Tap Connectors type WR • For combinations of aluminum-aluminum and aluminum-copper conductors • Pass the requirements of ANSI C119.4 • Standard compression tools and dies install


    Original     		PDF PG-BB-0806 Thomas Betts blackburn burndy compression die index csa 26 WR1010 ATL500 B76AH rs808 burndy compression clamp crimping die ATL30-12 B72AH B74AH

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    BGA-3000

    Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
    Text: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.


    Original     		PDF BGA-3000 241mm) Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3

    Untitled

    Abstract: No abstract text available
    Text: CENTRAL TECHNOLOGIES Manufacturer of Passive Components Catalog Page Table of Contents . . . . . . . . . . . . . . . . . . . . .i-v RF Magnetics . . . . . . . . . . . . . . . . . . . . .1-16 Power Magnetics . . . . . . . . . . . . . . . . .17-65 Transformers . . . . . . . . . . . . . . . . . . . . .67-77


    Original     		PDF

    CAPACITOR TANTALUM 686D

    Abstract: CTLQ1812NF military resistors catalog tv line transformer 22-35L smd zener diode color band LCD inverter 94v 0 TV flyback transformer pinout 9400MHz filter smd inductors 4.7uH 20A
    Text: CENTRAL TECHNOLOGIES Manufacturer of Passive Components Catalog Page Table of Contents . . . . . . . . . . . . . . . . . . . . .i-v RF Magnetics . . . . . . . . . . . . . . . . . . . . .1-14 Power Magnetics . . . . . . . . . . . . . . . . .15-52 Transformers . . . . . . . . . . . . . . . . . . . . .53-64


    Original     		PDF

    AD8015 Circuits

    Abstract: SFF-8074 LFCSP-24 ADN2870 AD8015 AD8066 ADN8830 ADN8831 LFCSP24 LFCSP32
    Text: Fiber Optics Communications T H E February 2004 IN THIS ISSUE SFP/SFF-8472 Compliant LDDs . . . . 2 New Amplifiers for SFF/SFP/GBIC Fiber Optic Modules . . . . . . . . . . . . . . . . . . 3 New Optimized Transimpedance Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4


    Original     		PDF SFP/SFF-8472 AD7621--The 16-Bit PTIC-FEB-2004 SB04580-77 F-92182 AD8015 Circuits SFF-8074 LFCSP-24 ADN2870 AD8015 AD8066 ADN8830 ADN8831 LFCSP24 LFCSP32

    AMI Semiconductor DSP

    Abstract: wola
    Text: AMI Semiconductor BelaSigna 200 - Single-Chip Audio Processing System Feature Sheet BelaSigna 200 Single-Chip Audio Processing System Key Features • Up to 200 peak MIPS at 33MHz operating frequency • Ultra-low power consumption: down to 0.05mW/MIPS


    Original     		PDF 33MHz 05mW/MIPS 16-bit 12-Kwords 60kHz M-20340-004 AMI Semiconductor DSP wola

    BPW22A

    Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
    Text: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey


    OCR Scan     		PDF BS9000, D3007 HE4000B 80RIBUTION BS9000 BPW22A cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8