Untitled
Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 1/30/06 A1 7455 JM 1 0 -1 8 -0 7 A2 8264 TRM B .275 [6.99] MAX. OF OPENING NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR "REFLOW” TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
|
OCR Scan
|
PDF
|
PR022-01.
CT640193
|
ic 7455
Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 1/30/06 A1 7455 JM 10 -1 8 -0 7 A2 8264 TRM B B OF OPENING NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR "REFLOW" TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
|
OCR Scan
|
PDF
|
PR022-01.
CT640193
ic 7455
|
Untitled
Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 1/30/06 A1 7455 JM B SUGGESTED PANEL OPENING NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA — I * .40D [10.16] I—
|
OCR Scan
|
PDF
|
PR022-Q1.
Z35-7512
CT640193
|