4032 k460 epcos
Abstract: 4032 k460 VARISTOR k460 k150 varistor k40 4032 CU 4032 K 275 G2 smd k460 K40 varistor EPCOS SIOV-S10K385 4032 k150
Text: SIOV Metal Oxide Varistors SMD Varistors, Monolithic Automotive Series, CU Automotive Construction • Cylindrical varistor element, encapsulated ■ Encapsulation: thermoplast, flame-retardant to UL 94 V-0 ■ Termination: tinned copper alloy Features ■
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16-mm
4032 k460 epcos
4032 k460
VARISTOR k460
k150 varistor
k40 4032
CU 4032 K 275 G2
smd k460
K40 varistor
EPCOS SIOV-S10K385
4032 k150
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CU4032K460
Abstract: cu3225K275 4032 k460 CU3225K175 Varistor 4032 4032 k150 4032 k460 epcos CU3225K275G k460 4032 CU4032K140G
Text: SIOV Metal Oxide Varistors SMD Varistors, Monolithic Standard Series Monolithic (CU) Standard Construction • Cylindrical varistor element, encapsulated ■ Encapsulation: thermoplast, flame-retardant to UL 94 V-0 ■ Termination: tinned copper alloy Features
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SIOV-S05/S07
16-mm
CU4032K460
cu3225K275
4032 k460
CU3225K175
Varistor 4032
4032 k150
4032 k460 epcos
CU3225K275G
k460 4032
CU4032K140G
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hgm ieh
Abstract: No abstract text available
Text: HGM SERIES MATERIALS: Pin Contacts: Pin Diameter: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: Pin Shields: FINISHES: Pin Contacts: SPECIFICATIONS PhBr per ASTM B139, BeCu per ASTM B196 or B197, or Cu alloy
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MIL-M-24519,
GST-40F
D5948
5052-H32
QQ-A-250/8
MIL-DTL-55302tion
hgm ieh
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PDF
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B197
Abstract: TC-240-NMH AMS 2418 LMR-240-FR TC-240-NMH-D TC-240-NMH-RA-D EZ-240-TM LOCTITE L 428 TC-240-NMC TC-240-NF-BH
Text: HRM SERIES SPECIFICATIONS MATERIALS: Pin Contacts: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: FINISHES: Pin Contacts: PhBr per ASTM B139, BeCu per ASTM B196 or B197, or CU alloy BeCu per ASTM B196, or B197
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MIL-M-24519,
GST-40F
MIL-DTL-55302
MIL-C-55302
B197
TC-240-NMH
AMS 2418
LMR-240-FR
TC-240-NMH-D
TC-240-NMH-RA-D
EZ-240-TM
LOCTITE L 428
TC-240-NMC
TC-240-NF-BH
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PDF
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AMS 2418
Abstract: EIA-364-31 method iv MIL-STD-55302 ASTM b734 ASTM b196 ams YEAR DATE CODE B-197 LOCTITE 454 EIA-364-28 EIA-364-06
Text: HRM SERIES SPECIFICATIONS MATERIALS: Pin Contacts: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: FINISHES: Pin Contacts: PhBr per ASTM B139, BeCu per ASTM B196 or B197, or CU alloy BeCu per ASTM B196, or B197
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MIL-M-24519,
GST-40F
MIL-DTL-55302
MIL-C-55302
AMS 2418
EIA-364-31 method iv
MIL-STD-55302
ASTM b734
ASTM b196
ams YEAR DATE CODE
B-197
LOCTITE 454
EIA-364-28
EIA-364-06
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PDF
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FGG676
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for Spartan -3/-3A FGG676 Cu Wire Package PK530 (v1.3) March 19, 2012 Average Weight: 2.9810 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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FGG676
PK530
FGG676
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PDF
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spartan 3e
Abstract: 40378
Text: 100% Material Declaration Data Sheet for Spartan -3E/-3A FG400 Cu Wire Package PK518 (v1.1) March 19, 2012 Average Weight: 1.9857 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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FG400
PK518
spartan 3e
40378
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PDF
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FGG484
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for Spartan -3E/-3A FGG484 Cu Wire Package PK504 (v1.1) March 19, 2012 Average Weight: 2.292 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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FGG484
PK504
FGG484
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PDF
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cas number
Abstract: spartan 3e FT256
Text: 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FT256 Cu Wire PK520 (v1.1) December 27, 2011 Average Weight: 0.7690g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00
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FT256
PK520
7690g
cas number
spartan 3e
FT256
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PDF
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PK500
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for Spartan -3 FG900 Cu Wire Package PK500 (v1.1) March 19, 2012 Average Weight: 3.949 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3
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FG900
PK500
PK500
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PDF
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cas number
Abstract: FTG256 PK522 FTG256
Text: 100% Material Declaration Data Sheet for Spartan -3/-3E FTG256 Cu Wire PK522 (v1.2) March 19, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Die Attach
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FTG256
PK522
7530g
cas number
FTG256 PK522
FTG256
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PDF
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Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for Spartan -3 FGG900 Cu Wire Package PK492 (v1.2) July 11, 2012 Average Weight: 3.9490 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight
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FGG900
PK492
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FGG400
Abstract: PK516
Text: 100% Material Declaration Data Sheet for Spartan -3E/-3A FGG400 Cu Wire Package PK516 (v1.1) March 19, 2012 Average Weight: 1.9400 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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FGG400
PK516
FGG400
PK516
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PDF
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Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FGG1156 Cu Wire Package PK538 (v1.1) January 11, 2011 Average Weight: 5.600 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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PK538
FGG1156
90tial
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PDF
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Untitled
Abstract: No abstract text available
Text: PK540 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FG456 (Cu Wire) Package Average Weight: 2.3521 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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PK540
FG456
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PDF
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icl 2822
Abstract: 1004CL 0398C BW002 CCGA 472 device dimensional details diode marking B4Z 0844C 4046 PLL Designers Guide AOI2222 2-bit comparator
Text: Preliminary ASIC Cu-11 Databook Notices: Before using this information and the product it supports, be sure to read the general information on the back cover of this book. Trademarks: The following are trademarks or registered trademarks of International Business Machines
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Cu-11
SA14-2449-00
icl 2822
1004CL
0398C
BW002
CCGA 472 device dimensional details
diode marking B4Z
0844C
4046 PLL Designers Guide
AOI2222
2-bit comparator
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PDF
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Untitled
Abstract: No abstract text available
Text: PK542 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FGG456 (Cu Wire) Package Average Weight: 2.3000 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
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PK542
FGG456
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lb 1622
Abstract: No abstract text available
Text: QwikConnect SERIES 103 Aircraft Utilization Analysis Comparison of ArmorLite Composite to standard A-A-59569 Ni/Cu Braid Length and Weight of NiCu Braid in Typical Commercial Carrier Diameter in Weight (Lb/ft) Length (in) weight (Lb) 0 - 0.25 0.02
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FG484
Abstract: PK512
Text: 100% Material Declaration Data Sheet for Spartan -3E/-3A FG484 Cu Wire Package PK512 (v1.1) March 19, 2012 Average Weight: 2.347 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3
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FG484
PK512
97linx
FG484
PK512
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PDF
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Untitled
Abstract: No abstract text available
Text: QwikConnect SERIES 103 Aircraft Utilization Analysis Comparison of AmberStrand Composite to 36 AWG A-A-59569 Ni/Cu Braid Length and Weight of NiCu Braid in Typical Commercial Carrier Diameter in Weight (Lb/ft) Length (in) Weight (Lb) 0 - 0.25 0.02 12564.8
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QP-10T
Abstract: No abstract text available
Text: Features General Description • H ig h slew rate — 3000 V /ju s T h e E L 2 0 0 9 is a p aten ted h ig h speed b ip o lar m o n olith ic b u ffer am p lifier designed to provide cu rren ts over 1 am p a t high fre quencies, w hile d raw ing 40 m A o f q u iescen t supply cu rren t. T h e
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OCR Scan
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EL2009C
EL2009C
EL2009.
EL2009
QP-10T
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PDF
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dlop 06
Abstract: 80ET 314905
Text: Red Laser Diode DL-3149-057/-257 Features • • • • Tolerance : ± 0 .2 Unit : mm Package Short wavelength : 670 nm Typ. Low threshold cu rren t: Ith = 25 mA (Typ.) High operating temperature : 5mW at 60°C Small package : 0 5.6mm Applications • Laser beam printer
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OCR Scan
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DL-3149-057/-257
-057ce
Tc425Â
dlop 06
80ET
314905
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PDF
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SAE-AS31971
Abstract: No abstract text available
Text: Specifications "F" Series. 100" £ Material and Finish Molded Insulator: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Contacts: Terminal: Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302.
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OCR Scan
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MIL-DTL-55302
MIL-DTL-55302.
ASTM-A581
orA582.
SAE-AMS-2700
ASTM-B196
SAE-AS31971
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PDF
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EIA-364-26
Abstract: MS3197 EIA364-26 SAE-AS31971
Text: Specifications "F" Series .075" <£ Material and Finish Molded Insulator: Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302, Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Contacts: Terminal: Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302.
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OCR Scan
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MIL-DTL-55302,
MIL-DTL-55302.
MIL-DTL-55302
ASTM-A581
SAE-AMS-2700
ASTM-B196
orB197.
EIA-364-26
MS3197
EIA364-26
SAE-AS31971
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PDF
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