DAEWON TRAY ALTERA Search Results

DAEWON TRAY ALTERA Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
ADC1213D080WO-DB		Renesas Electronics Corporation	ADC1213D080WO demoboard; compliant with Lattice, Altera, Xilinx FPGA boards through specific connectors
ADC1413D065WO-DB		Renesas Electronics Corporation	ADC1413D065W0 demoboard; compliant with Lattice, Altera, Xilinx FPGA boards through specific connectors
ADC1443D200WO-DB		Renesas Electronics Corporation	ADC1443D200W0 demo board; compliant with Altera, Xilinx FPGA boards through specific connectors
ADC1443D125WO-DB		Renesas Electronics Corporation	ADC1443D125W0 demo board; compliant with Altera, Xilinx FPGA boards through specific connectors
ADC1453D250WO-DB		Renesas Electronics Corporation	ADC1453D250WO demo board; compliant with Altera, Xilinx FPGA boards through specific connectors

DAEWON TRAY ALTERA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ADV0505 Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The	Original	ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7	PDF
daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga	PDF
FC-BGA Abstract: T0812012 daewon tray Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.	Original	AN-659-1 FC-BGA T0812012 daewon tray	PDF
KS-886H Abstract: Kostat tray Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive	Original	AN-657-1 KS-886H Kostat tray	PDF