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    DALE 100MB Search Results

    DALE 100MB Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    DS100MB201SQE/NOPB Texas Instruments Dual Lane 2:1/1:2 Mux/Buffer with Equalization 54-WQFN -40 to 85 Visit Texas Instruments Buy
    DS100MB201SQ/NOPB Texas Instruments Dual Lane 2:1/1:2 Mux/Buffer with Equalization 54-WQFN -40 to 85 Visit Texas Instruments Buy
    DS100MB203SQE/NOPB Texas Instruments 10.3-Gbps dual-port mux & fanout buffer 54-WQFN -40 to 85 Visit Texas Instruments Buy
    DS100MB203SQ/NOPB Texas Instruments 10.3-Gbps dual-port mux & fanout buffer 54-WQFN -40 to 85 Visit Texas Instruments Buy

    DALE 100MB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ASJ CR21

    Abstract: Diode GEP 53A 93c46m8 D1275 ASJ PTE CR21 ASJ em 483 epson 93c46-m8 Diode GEP 23A D12301
    Text: June 1997 Application Note 65 ML6698 and DEC 21143 Adapter Implementation OVERVIEW The interface between the DEC 21143 and the ML6698 is a mix of digital and analog signals. The DEC 21143’s 5-bit interface connects to the ML6698’s 5-bit interface for 100BASE-TX operation. The ML6698 100BASE-TX


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    PDF ML6698 100BASE-TX 100BASE-TX ASJ CR21 Diode GEP 53A 93c46m8 D1275 ASJ PTE CR21 ASJ em 483 epson 93c46-m8 Diode GEP 23A D12301

    OTS-38

    Abstract: No abstract text available
    Text: User's Guide SBOU053 – September 2007 BUF22821EVM Evaluation Board and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF22821EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects


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    PDF SBOU053 BUF22821EVM BUF22821EVM. OTS-38

    Untitled

    Abstract: No abstract text available
    Text: User's Guide SBOU057 – February 2008 BUF16821EVM Evaluation Board and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF16821EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects


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    PDF SBOU057 BUF16821EVM BUF16821EVM.

    Untitled

    Abstract: No abstract text available
    Text: User's Guide SBOU066 – September 2008 BUF08821EVM Evaluation Board and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF08821EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects


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    PDF SBOU066 BUF08821EVM BUF08821EVM.

    eeprom programmer schematic 24c08

    Abstract: motorola TP230 eeprom programmer schematic 24c02 transistor C458 C458 datasheet GMC21X7R104K50NT philips c399 RM10F1000CT IC 24c08 transistor c331
    Text: Preliminary ThunderSWITCH 8/3 Schematics Description and Schematics Reference Guide: SPWA023 Networking Business Unit Revision 0.2 April 1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or


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    PDF SPWA023 1000PF DS0026-001 eeprom programmer schematic 24c08 motorola TP230 eeprom programmer schematic 24c02 transistor C458 C458 datasheet GMC21X7R104K50NT philips c399 RM10F1000CT IC 24c08 transistor c331

    48LC2M32B2

    Abstract: smd transistor j31c 16b2 zener diode zener 15B2 J32C motorola ZENER 15B1 VF0 Panasonic inverter 6a3 diode zener 10b2 zener diode zener 12B2
    Text: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. MPC885ADSUG 6/2004 Rev. 1 MPC885ADS PowerQUICC Application Development System User’s Guide For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Freescale Semiconductor, Inc.


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    PDF MPC885ADSUG MPC885ADS 48LC2M32B2 smd transistor j31c 16b2 zener diode zener 15B2 J32C motorola ZENER 15B1 VF0 Panasonic inverter 6a3 diode zener 10b2 zener diode zener 12B2

    transistor C458

    Abstract: C458 datasheet motorola TP230 tp394 transistor c331 TP182 C337 W 61 transistor C368 L934EB/2GD CC0805HX7R104K
    Text: Preliminary ThunderSWITCH 12/3 Schematics Description and Schematics REFERENCE GUIDE: SPWA021 Networking Business Unit Revision 0.2 April 1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or


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    PDF SPWA021 1000PF DS0026-001 transistor C458 C458 datasheet motorola TP230 tp394 transistor c331 TP182 C337 W 61 transistor C368 L934EB/2GD CC0805HX7R104K

    transistor C458

    Abstract: C458 datasheet CONN PCB 17x2 TCSCN KM416S4030A motorola TP230 6-pin supply ic tp35 TP147 MC74HCT164 C458
    Text: Preliminary ThunderSWITCH 16/3 Schematic Description and Schematics REFERENCE GUIDE: SPWA022 Networking Business Unit Revision 0.2 Schematics April 1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or


    Original
    PDF SPWA022 1000PF DS0026-001 transistor C458 C458 datasheet CONN PCB 17x2 TCSCN KM416S4030A motorola TP230 6-pin supply ic tp35 TP147 MC74HCT164 C458

    transistor C458

    Abstract: MC74HCT164 tp394 motorola TP230 74hc164 C458 datasheet diode c341 RCVN18 RJ45 jack 1X4 IC 24c08 data sheet
    Text: Preliminary ThunderSWITCH 24/3 Schematic Description and Schematics REFERENCE GUIDE: SPWA019 Networking Business Unit Revision 0.61 March1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or


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    PDF SPWA019 March1998 1000PF DS0026-001 transistor C458 MC74HCT164 tp394 motorola TP230 74hc164 C458 datasheet diode c341 RCVN18 RJ45 jack 1X4 IC 24c08 data sheet

    sd 4841 p

    Abstract: sd 4841
    Text: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled


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    PDF LPE-4841 EIA-481 sd 4841 p sd 4841

    Untitled

    Abstract: No abstract text available
    Text: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available


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    PDF LPE-5047 EIA-481

    Untitled

    Abstract: No abstract text available
    Text: MODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times


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    PDF LPE-4841 EIA-481

    Untitled

    Abstract: No abstract text available
    Text: M O DEL L P E -6562 In d u c to rs S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled


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    PDF EIA-481 LPE-6562

    o 103na

    Abstract: No abstract text available
    Text: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C


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    PDF EIA-481 EIA-481 LPE-5047 o 103na

    cl 6562

    Abstract: o 103na DALE ELECTRONICS 154NA
    Text: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available


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    PDF EIA-481 LPE-6562 cl 6562 o 103na DALE ELECTRONICS 154NA

    Untitled

    Abstract: No abstract text available
    Text: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints


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    PDF EIA-481 LPE-5047

    Untitled

    Abstract: No abstract text available
    Text: M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped F E A TU R ES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available


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    PDF EIA-481 LPE-3325-102NA

    Untitled

    Abstract: No abstract text available
    Text: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available


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    PDF LPE-6855 EIA-481

    LPE-3325

    Abstract: No abstract text available
    Text: A COMPANY OF M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost


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    PDF EIA-481 LPE-3325 LPE-3325

    Untitled

    Abstract: No abstract text available
    Text: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints


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    PDF LPE-6855 EIA-481

    o 103na

    Abstract: PENI Ci HP 2200
    Text: A COMPANY MODEL LPE-6855 Inductors . O A L E OF , Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C


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    PDF LPE-6855 EIA-481 EIA-481 LPE-6855 o 103na PENI Ci HP 2200

    Untitled

    Abstract: No abstract text available
    Text: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available


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    PDF LPE-6562 EIA-481

    Untitled

    Abstract: No abstract text available
    Text: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped j m i O FEATURES • • • • • • • • • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost


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    PDF LPE-5047 EIA-481

    102MB

    Abstract: No abstract text available
    Text: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost


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    PDF LPE-4841 EIA-481 102MB