amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,
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Signetics
Abstract: 19X19 19X19MM
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This
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19x19MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
Signetics
19X19
19X19MM
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W2639A
Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.
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W2637A,
W2638A
W2639A
an120
5990-3892EN
W2639A
lpddr
W2638A-101
W3635A
N5425
9104a
Oscilloscope Probe to PC
E2678A
specification of Logic Analyzer
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gk 7031
Abstract: No abstract text available
Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.
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W2637A,
W2638A
W2639A
5990-3892EN
gk 7031
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E679
Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking
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nitto GE-100L
Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA
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PC Oscilloscope Probe
Abstract: N5426A Oscilloscope Probe to PC Probe Oscilloscope Connecting Oscilloscope Probe to PC W2631-97000 81204A AGILENT 1134A AGILENT TECHNOLOGIES DDR2 x32
Text: W2630A Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630A series DDR2
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W2630A
signal358
5989-5964EN
PC Oscilloscope Probe
N5426A
Oscilloscope Probe to PC
Probe Oscilloscope
Connecting Oscilloscope Probe to PC
W2631-97000
81204A
AGILENT 1134A
AGILENT TECHNOLOGIES
DDR2 x32
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Untitled
Abstract: No abstract text available
Text: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2
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signal69
5989-5964EN
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of
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DS820C
DS7409HGB
DS7409HG
FCCSP
DS-7409HG
HL832 nx-a
HL832
E700G
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N5426A
Abstract: W3630 TP28-TP30 W3635A W2633B TP40 N5451A Oscilloscope Probe to PC B4621A 5990-3179EN
Text: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2
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W2630
5989-5964EN
N5426A
W3630
TP28-TP30
W3635A
W2633B
TP40
N5451A
Oscilloscope Probe to PC
B4621A
5990-3179EN
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Untitled
Abstract: No abstract text available
Text: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The
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Abstract: No abstract text available
Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers
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W3630A
U4154A
5990-3179EN
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diode b6 k 450
Abstract: RT1300B6 RT2300B6 RT2300B6TR7 TR13 UCC561 LVD SCHEMATIC DIAGRAM CTS RESISTOR NETWORK CTS ARRAY
Text: LVD SCSI Terminator Technical Data Sheet RoHS Compliant Parts Available Description Features This LVD SCSI termination network is designed for high performance active termination of SCSI networks compliant to SPI-2 Ultra2 , SPI-3 (Ultra3) and beyond. Designed with a ceramic substrate and a ball grid array
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300B6
RT1300B6
RT2300B6
diode b6 k 450
RT1300B6
RT2300B6
RT2300B6TR7
TR13
UCC561
LVD SCHEMATIC DIAGRAM
CTS RESISTOR NETWORK
CTS ARRAY
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N5426A
Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and
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W3630A
5990-3179EN
N5426A
N5451A
PC Oscilloscope Probe
W3635A
DDR3 pin out
quaddie ddr3
B4621A
E2677A
W3630
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Untitled
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.
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BGA-48P-M06
48-pin
BGA-48P-M06)
MCM-M001-2-3
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Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.
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BGA-256P-M04
256-pin
BGA-256P-M04)
B256009SC-1-4
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272-PIN
Abstract: BGA-272P-M01
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) Note: The actual shape of corners may differ from the dimension.
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BGA-272P-M01
272-pin
BGA-272P-M01)
B272001SC-1-4
BGA-272P-M01
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led matrix circuits
Abstract: bga48 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.
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BGA-48P-M06
48-pin
BGA-48P-M06)
BGA48006SC-1-2
ar8P-M06)
led matrix circuits
bga48
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Untitled
Abstract: No abstract text available
Text: PA300PS-MA 300 mm Semi-Automatic Probe System DATA SHEET The PA300PS-MA is the world’s only analytical probe system for ine-pitch probing of pads down to 30 m x 30 μm, veriication of ball grid arrays and the most universal tool for wafer-level reliability WLR tests with 220 mm or 320 mm Celadon tiles. The semiautomatic probe system employs the powerful ProbeShield technology, enabling accurate low-noise measurements of atto amps
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PA300PS-MA
PA300PS-MA
PA300PS-MA-DS-1012
PA300PS-MA.
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Untitled
Abstract: No abstract text available
Text: Precision Ceramic Precision Ceramic Ball Grid Arrays Ball Grid Arrays Precision CHC-Precision SeriesCeramic HC-Precision Ball Grid Arrays tolerances to ±0.05% • RatioSeries atio tolerances to ±0.05% Absolute tolerances to ±0.1% bsolute tolerances to ±0.1%
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Abstract: No abstract text available
Text: Precision Ceramic Resistors Ball Grid Arrays Make Possible Precision Ceramic Precision Ceramic HC-Precision Series Ball Grid Arrays atio tolerances to ±0.05% Ball Grid Arrays bsolute tolerances to ±0.1% CHC-Precision Series oHS compliant terminations available
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Untitled
Abstract: No abstract text available
Text: Resistors Make Possible Ceramic Ball Grid Termination Arrays Ceramic Ball Grid Ceramic Ball Grid CHC Series Termination Arrays Superior TaNFilm resistors on ceramic substrate Termination Arrays High density networks on a reduced footprint High purity alumina
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Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays CHC Series Ceramic Ball Grid •Ceramic Superior TaNFilm resistors on ceramic substrate Ball Grid ·Termination High density networks on a reduced footprint Arrays ·Termination Excellent high frequency performance Arrays
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TeXAS53!
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Untitled
Abstract: No abstract text available
Text: BGA Products Aries has tooled and patented two ball grid array contact pins. The BallLock contact was designed for production applications, and has been incorporated into both a standard and a zero insertion force socket. The BallNest™ contact pin was designed to provide a four-fingered “nest” for each ball termination of the device to be socketed.
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