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L177HDDG78SOL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 78 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
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L177HDDG78SOL2RM5
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 78 Socket, 0.38um (15u\\) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L177HDDG78S
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 78 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock |
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74AC11086D
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Texas Instruments
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Quadruple 2-Input Exclusive-OR Gates 16-SOIC -40 to 85 |
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74AC11244DW
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Texas Instruments
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Octal Buffers/Drivers 24-SOIC -40 to 85 |
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