CA0505D XXT
Abstract: No abstract text available
Text: ATTENUATOR CVD DIAMOND CHIP 20 WATTS DATA SHEET FEATURES EN 13-3904 Revision - SHEET 1 OF 2 Dwg 1013105 PART SERIES: CA0505D XXT APPLICATIONS CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Thin Film Resistors
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CA0505D
423F121
2Y194
CA0505D XXT
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Diamond Chip Attenuator
Abstract: CA0505D XX
Text: ATTENUATOR CVD DIAMOND CHIP 20 WATTS DATA SHEET FEATURES EN 13-3904 Revision - SHEET 1 OF 2 Dwg 1013085 PART SERIES: CA0505D XX APPLICATIONS CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Thin Film Resistors
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CA0505D
423F121
2Y194
Diamond Chip Attenuator
CA0505D XX
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A-1297
Abstract: No abstract text available
Text: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through 10Ghz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional
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10Ghz.
MSA3G-01dB-BU.
A-1297
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CR0402D
Abstract: Diamond Chip Resistor
Text: RESISTOR CVD DIAMOND CHIP 20 WATTS DATA SHEET PART SERIES: CR0402D FEATURES SHEET 1 OF 2 Dwg 1011115 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0402D
423F124
2Y194
CR0402D
Diamond Chip Resistor
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CR1010D
Abstract: Diamond Chip Resistor
Text: RESISTOR CVD DIAMOND CHIP 125 WATTS DATA SHEET PART SERIES: CR1010D FEATURES SHEET 1 OF 2 Dwg 1010785 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR1010D
423F124
2Y194
CR1010D
Diamond Chip Resistor
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Untitled
Abstract: No abstract text available
Text: RESISTOR CVD DIAMOND CHIP 20 WATTS, WRAPPED DATA SHEET PART SERIES: CR0505DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013125 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0505DX5W2
423F124
2Y194
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CR0505D
Abstract: Diamond Chip Resistor
Text: RESISTOR CVD DIAMOND CHIP 50 WATT DATA SHEET PART SERIES: CR0505D X, 5 FEATURES SHEET 1 OF 2 Dwg 1010775 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0505D
423F124
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Diamond Chip Resistor
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CR0603D
Abstract: Diamond Chip Resistor
Text: RESISTOR CVD DIAMOND CHIP 80 WATTS DATA SHEET PART SERIES: CR0603D X, 5 FEATURES SHEET 1 OF 2 Dwg 1011545 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0603D
423F124
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Diamond Chip Resistor
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Untitled
Abstract: No abstract text available
Text: RESISTOR CVD DIAMOND CHIP 25 WATTS, WRAPPED DATA SHEET PART SERIES: CR0603DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013145 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0603DX5W2
423F124
2Y194
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CR0402DX5W2
Abstract: No abstract text available
Text: RESISTOR CVD DIAMOND CHIP 10 WATTS WRAPPED DATA SHEET PART SERIES: CR0402DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013115 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CR0402DX5W2
423F124
2Y194
CR0402DX5W2
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power combiner broadband transformers
Abstract: 4 port circulator high power duplexer HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint X-band Gan Hemt resistor parasitic capacitance DIAMOND TECHNOLOGIES DUAL JUNCTION CIRCULATOR CT1310D RFTM 9926 transistor
Text: Diamond Rf Resistives: The Answer to High Power and Low Capacitance | Novembe. Page 1 of 6 November 2011 issue: Technical Feature Diamond Rf™ Resistives: The Answer to High Power and Low Capacitance A single 0402 resistor, manufactured on a CVD diamond substrate, can dissipate 20 W of continuous
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CT0505D
Abstract: CT1310D CR0505D SN95 solder diamond circuit flange RF resistor 50
Text: CVD Diamond High Power Resistors and Terminations Application Note 0022 General Description: There are many applications in RF design where it is necessary to absorb large amounts of RF power. In order to effectively absorb large amounts of power, resistors and terminations
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CT1310D
CT0505D
CR0505D
SN95 solder
diamond circuit
flange RF resistor 50
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2y194
Abstract: Fixed Attenuators Surface Mount 30dB M17/113-RG316 MIL-C-17 RG316 RF florida lab florida rf stripline directional couplers 2y194 cable kapton film
Text: CABLE ASSEMBLIES RF COMPONENTS RESISTORS I TERMINATIONS I ATTENUATORS I CABLE ASSEMBLIES surface mount I flange mount I coaxial Authorized Distributors TERMINATIONS TEMpERATURE VARIABLE ATTENUATORS – THERMOpAD LAB FLEx® CABLE ASSEMBLIES We offer a full line of high power terminations including tab & cover, flange
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2Y194
2y194
Fixed Attenuators Surface Mount 30dB
M17/113-RG316
MIL-C-17
RG316
RF florida lab
florida rf
stripline directional couplers
2y194 cable
kapton film
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MTVA0300N07
Abstract: MTVA0300
Text: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV
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Untitled
Abstract: No abstract text available
Text: MachXO2 Breakout Board Evaluation Kit User’s Guide January 2014 Revision: EB68_02.2 MachXO2 Breakout Board Evaluation Kit User’s Guide Introduction Thank you for choosing the Lattice Semiconductor MachXO2 Breakout Board Evaluation Kit! This user’s guide describes how to start using the MachXO2 Breakout Board, an easy-to-use platform for evaluating and designing with the MachXO2 ultra-low density FPGA. Along with the board and accessories, this kit
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MachXO2-7000HE
MachXO2-12R16,
RC0603JR-070RL
CRCW06031R00JNEAHP
RC0603FR-07100RL
RC0402FR-071KL
FT2232HL
93LC56C-I/SN
LCMXO2-7000HE-4TG144C
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QFP lead pitch 0.3mm
Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration
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Sep2009
ISO9001
50x50mm
QFP lead pitch 0.3mm
BGA and QFP Package mounting
QFP 0.3mm pitch
particle
0.3mm pitch BGA
bga socket
material for chip resistors
8 soic pcb footprint
qfp 100 SOCKET
BGA and QFP Package
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MX25Lxx
Abstract: M25PXX LVCMOS33 ISPVM embedded
Text: LatticeECP2/M sysCONFIG Usage Guide June 2010 Technical Note TN1108 Introduction The configuration memory in the LatticeECP2 and LatticeECP2M™ FPGAs is built using volatile SRAM; therefore, an external non-volatile configuration memory is required to maintain the configuration data when the power is
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TN1108
MX25Lxx
M25PXX
LVCMOS33
ISPVM embedded
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Untitled
Abstract: No abstract text available
Text: RESISTOR CHIP 5 WATT DATA SHEET PART SERIES: 81-3001B-X-X FEATURES SHEET 1 OF 2 Dwg 81-3001B EN 13-3508 Revision- APPLICATIONS Wide Band Operation High Power Direct Attached Low Capacitance Easy Installation Wide Resistance Range Broadcast High Power Filters
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81-3001B-X-X
81-3001B
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423F106
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lattice ECP3 Pinouts files
Abstract: No abstract text available
Text: DDR & DDR2 SDRAM Controller IP Cores User’s Guide February 2012 ipug35_05.0 Table of Contents Chapter 1. Introduction . 5 Quick Facts . 5
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ipug35
LFSC3GA25E-6F900C
lattice ECP3 Pinouts files
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Untitled
Abstract: No abstract text available
Text: RESISTOR CHIP 50 WATT DATA SHEET PART SERIES: 81A7028XXF FEATURES SHEET 1 OF 2 Dwg 81A7028F EN 13-3509 Revision- APPLICATIONS Wide Band Operation High Power Direct Attached Low Capacitance Easy Installation Wide Resistance Range Broadcast High Power Filters
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81A7028XXF
81A7028F
81A7028X
2007028XXF
2Y194
423F106
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Untitled
Abstract: No abstract text available
Text: Construction of MSI Precision Chip Resistors 4. Bondability All resistors are fabricated with the resistor film sandwiched between a bottom conductor and a top conductor termination. This construction exposes the maximum bond pad area for multiple wire bonds,
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Untitled
Abstract: No abstract text available
Text: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through lOGhz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional
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MSA3G-01dB-BU.
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RF MESFET S parameters
Abstract: No abstract text available
Text: MwT-A8 ÛÊVt M ic r o w a v e 16 GHz High Power GaAs FET techno lo g y H 0.6 WATT POWER OUTPUT AT 12 GHz +40 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METALVGOLD GATE 1200 MICRON GATE WIDTH DIAMOND-UKE CARBON PASSIVATION CHOICE OF CHIP AND ONE
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transistor MWTA 06
Abstract: mwta 06
Text: MwT-A11 14 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y • • • • • • 1 WATT POWER OUTPUT AT 12 GHz HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAUGOLD GATE 2400 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION CHOICE OF CHIP AND ONE
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MwT-A11
MwT-A11
syste80
000Gb23
transistor MWTA 06
mwta 06
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