CA0505D
Abstract: ca0505
Text: ATTENUATOR, TABBED CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XXT FEATURES DC – 18 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film Unaffected By Moisture
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CA0505D
ca0505
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CA0505D
Abstract: No abstract text available
Text: ATTENUATOR, FLANGE MOUNT CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XXFT FEATURES DC – 18 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film Unaffected By Moisture
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CA0505D
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Abstract: No abstract text available
Text: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 12-1966 11/05/2012 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film
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CA0505D
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waffle
Abstract: CA0505D
Text: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 12-0442 04/23/2012 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film
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CA0505D
waffle
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Untitled
Abstract: No abstract text available
Text: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 13-0252 1/29/2013 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film
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CA0505D
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A-1297
Abstract: No abstract text available
Text: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through 10Ghz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional
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10Ghz.
MSA3G-01dB-BU.
A-1297
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CT0402D
Abstract: Diamond Chip Termination
Text: TERMINATION CVD DIAMOND CHIP 10 WATT DATA SHEET SHEET 1 OF 2 Dwg 1011105 PART SERIES: CT0402D FEATURES EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CT0402D
423F125
2Y194
CT0402D
Diamond Chip Termination
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CT1310D
Abstract: Diamond Chip Termination
Text: TERMINATION CVD DIAMOND CHIP 125 WATTS DATA SHEET PART SERIES: CT1310D FEATURES SHEET 1 OF 2 Dwg 1010545 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CT1310D
423F125
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Diamond Chip Termination
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CT0603D
Abstract: Diamond Chip Termination
Text: TERMINATION CVD DIAMOND CHIP 50 WATTS DATA SHEET PART SERIES: CT0603D FEATURES SHEET 1 OF 2 Dwg 1011535 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CT0603D
423F125
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Diamond Chip Termination
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CT0505D
Abstract: Diamond Chip Termination
Text: TERMINATION CVD DIAMOND CHIP 50 WATTS DATA SHEET PART SERIES: CT0505D FEATURES SHEET 1 OF 2 Dwg 1010525 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film
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CT0505D
require25
423F125
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CT0505D
Diamond Chip Termination
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CT0505D
Abstract: CT1310D CR0505D SN95 solder diamond circuit flange RF resistor 50
Text: CVD Diamond High Power Resistors and Terminations Application Note 0022 General Description: There are many applications in RF design where it is necessary to absorb large amounts of RF power. In order to effectively absorb large amounts of power, resistors and terminations
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CT1310D
CT0505D
CR0505D
SN95 solder
diamond circuit
flange RF resistor 50
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CT1310D
Abstract: No abstract text available
Text: CVD DIAMOND FLANGE TERMINATION RoHS COMPLIANT D AT A S H E E T PART NUMBER: CT1310D HT FEATURES SHEET 1 OF 1 06/02/2011 APPLICATIONS DC – 20 GHz 125 Watts 50 Ohms Nominal CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability
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CT1310D
E595-93
MIL-STD-454
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power combiner broadband transformers
Abstract: 4 port circulator high power duplexer HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint X-band Gan Hemt resistor parasitic capacitance DIAMOND TECHNOLOGIES DUAL JUNCTION CIRCULATOR CT1310D RFTM 9926 transistor
Text: Diamond Rf Resistives: The Answer to High Power and Low Capacitance | Novembe. Page 1 of 6 November 2011 issue: Technical Feature Diamond Rf™ Resistives: The Answer to High Power and Low Capacitance A single 0402 resistor, manufactured on a CVD diamond substrate, can dissipate 20 W of continuous
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2y194
Abstract: Fixed Attenuators Surface Mount 30dB M17/113-RG316 MIL-C-17 RG316 RF florida lab florida rf stripline directional couplers 2y194 cable kapton film
Text: CABLE ASSEMBLIES RF COMPONENTS RESISTORS I TERMINATIONS I ATTENUATORS I CABLE ASSEMBLIES surface mount I flange mount I coaxial Authorized Distributors TERMINATIONS TEMpERATURE VARIABLE ATTENUATORS – THERMOpAD LAB FLEx® CABLE ASSEMBLIES We offer a full line of high power terminations including tab & cover, flange
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Fixed Attenuators Surface Mount 30dB
M17/113-RG316
MIL-C-17
RG316
RF florida lab
florida rf
stripline directional couplers
2y194 cable
kapton film
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MTVA0300N07
Abstract: MTVA0300
Text: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV
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trm a55
Abstract: No abstract text available
Text: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV
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CT2335TALNF
Abstract: 1010765
Text: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALNF FEATURES SHEET 1 OF 2 Dwg 1010765 EN 14-0941 Revision A APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators
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CT2335TALNF
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CT2335TALN
Abstract: 1010515
Text: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALN FEATURES SHEET 1 OF 2 Dwg 1010515 EN 14-0941 Revision A APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators
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CT2335TALN
423F103
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1010515
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82A3031F
Abstract: No abstract text available
Text: TERMINATION CHIP 150 WATT DATA SHEET PART SERIES: 82A3031F FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82A3031F APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators
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423F103
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82-7027
Abstract: No abstract text available
Text: TERMINATION CHIP 100 WATT DATA SHEET PART SERIES: 82-7027 FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82-7027 APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators
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423F103
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Vitramon
Abstract: Fabrication process steps PERMITTIVITY BOX BUILD FABRICATION PROCESS dryer types front of fabrication process
Text: High Volume Manufacturing of Ceramic Chip Capacitors Wet vs Dry Fabrication V I S H A Y By Patrick M. Gormally, Product Marketing Manager At first glance, all ceramic chip capacitors appear identical. Side by side comparisons of various manufacturers, E.I.A. 1206 size
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600mm]
Vitramon
Fabrication process steps
PERMITTIVITY
BOX BUILD FABRICATION PROCESS
dryer types
front of fabrication process
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Untitled
Abstract: No abstract text available
Text: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALNF FEATURES SHEET 1 OF 2 Dwg 1010765 EN 14-0409 Revision - APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators
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82-8001
Abstract: No abstract text available
Text: TERMINATION CHIP 5 WATT DATA SHEET PART SERIES: 82-8001 FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82-8001 APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators
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423F103
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Untitled
Abstract: No abstract text available
Text: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through lOGhz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional
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OCR Scan
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MSA3G-01dB-BU.
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