Untitled
Abstract: No abstract text available
Text: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip
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M36P0R9070E0
Abstract: M58PR512J M69KB128AB
Text: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory – 1 die of 128Mbit (8Mb x16) PSRAM
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M36P0R9070E0
128Mbit
TFBGA107
108MHz,
66MHz
M36P0R9070E0
M58PR512J
M69KB128AB
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23LIST
Abstract: No abstract text available
Text: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory – 1 die of 128Mbit (8Mb x16) PSRAM
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M36P0R9070E0
128Mbit
TFBGA107
M36P0R9070E0ZAQF
M36P0R9070E0
23LIST
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M36P0R9070E0
Abstract: M58PR512J M69KB128AB
Text: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory – 1 die of 128Mbit (8Mb x16) PSRAM
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M36P0R9070E0
128Mbit
TFBGA107
108MHz,
66MHz
M36P0R9070E0
M58PR512J
M69KB128AB
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cfi commands
Abstract: A0-A21 J-STD-020B M36W0R6030B0 M36W0R6030T0
Text: M36W0R6030T0 M36W0R6030B0 64 Mbit 4Mb x16, Multiple Bank, Burst Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 8 Mbit SRAM • SUPPLY VOLTAGE – VDDF = VDDQ = VDDS = 1.7 to 1.95V
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M36W0R6030T0
M36W0R6030B0
512Kb
8810h
8811h
cfi commands
A0-A21
J-STD-020B
M36W0R6030B0
M36W0R6030T0
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infineon c167 bare die
Abstract: C167CR-LC AN10 AN11 AN12 C166 C167CR SAK-C167CR-LC c167 bare die 4536 timer circuits
Text: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-LC, Bare Die, Step FA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-LC Step FA C167CR-LC Revision History: (Bare Die Delivery) 1999-11, Step FA Previous Versions: 10.97
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16-Bit
C167CR-LC,
C167CR-LC
C167CR
infineon c167 bare die
C167CR-LC
AN10
AN11
AN12
C166
SAK-C167CR-LC
c167 bare die
4536 timer circuits
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ZU 107
Abstract: 10BaseS visteon zu107
Text: high-tech vom feinsten High-Tech vom Feinsten system-on-a-chip: klein aber oho die herausforderung die position von infineon Früher wurden die verschiedensten Kommunikations- und Rechenvorgänge meist von mehreren Halbleiter-Bauelementen parallel ausgeführt. Mittlerweile werden
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infineon c167 bare die
Abstract: ba 4614 4614 Ba 4164 ram bosch ac drive AN10 AN11 C166 C167CR SAK-C167CR-4RC
Text: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-xC, Bare Die, Step GA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-xC Step GA C167CR-xC Revision History: (Bare Die Delivery) 1999-11, Step GA Previous Versions: 1999-11
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16-Bit
C167CR-xC,
C167CR-xC
C167CR
infineon c167 bare die
ba 4614
4614 Ba
4164 ram
bosch ac drive
AN10
AN11
C166
SAK-C167CR-4RC
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actel package mechanical drawing
Abstract: CC256 antifuse programming technology AC193 CERAMIC QUAD FLATPACK CQFP antifuse CQ208 CQFP 256 PIN actel
Text: Application Note AC193 Ceramic Chip Carrier Land Grid CC256 Package Handling Introduction Die-level solutions allow for the integration of differing technologies or products from multiple companies, all on the same board or multi-chip module. Die that can be tritemp tested or screened, also
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AC193
CC256)
CC256
actel package mechanical drawing
antifuse programming technology
AC193
CERAMIC QUAD FLATPACK CQFP
antifuse
CQ208
CQFP 256 PIN actel
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me 4946
Abstract: SAK-C167CR-LC c167 bare die 7313 28 pin integrated circuit BOSCH bosch ac drive AN10 AN11 C167CR-LC
Text: Microcomputer Components 16-Bit CMOS Single-Chip Microcontroller Bare Die, Step BA C167CR/C167SR-LC Data Sheet 05.97 Bare Die Delivery C167CR-LC/C167SR-LC Revision History: (Bare Die Delivery) Original Version 05.97 Previous Releases: - Page Subjects Controller Area Network (CAN): License of Robert Bosch GmbH
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16-Bit
C167CR/C167SR-LC
C167CR-LC/C167SR-LC
D-81541
C167xR-LC
07May97
me 4946
SAK-C167CR-LC
c167 bare die
7313 28 pin
integrated circuit BOSCH
bosch ac drive
AN10
AN11
C167CR-LC
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SAMSUNG MCP
Abstract: MCP NAND
Text: Preliminary MCP MEMORY K5P2881BCM Document Title Multi-Chip Package MEMORY 128M Bit 16Mx8 Nand Flash Memory / 8M Bit (512Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft. - 128M NAND Flash C-die - 8M SRAM B-die
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K5P2881BCM
16Mx8)
512Kx16)
69-Ball
SAMSUNG MCP
MCP NAND
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Silicon Microstructures
Abstract: MEDICAL PRESSURE die SM5102 OEM PRESSURE SILICON DIE
Text: SM5102 SILICON MICROSTRUCTURES INCORPORATED • OEM Silicon Pressure Die OEM SILICON PRESSURE SENSOR DIE DESCRIPTION Compensated The SM5102 is a silicon micro-machined, piezoresistive pressure-sensing chip. These devices are available in full-scale ranges
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SM5102
SM5102
Silicon Microstructures
MEDICAL PRESSURE die
OEM PRESSURE SILICON DIE
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IRF540
Abstract: IRF540CHIP
Text: SGS-THOMSON itl ¥»HD S IRF540 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 170x170 mils METALLIZATION: Top Al Back Au/C r/N i/A u BACKSIDE THICKNESS: 6100 A DIE THICKNESS: 16 ± 2 mils PASSIVATION: P-Vapox BONDING PAD SIZE:
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IRF540
170x170
15x18
MC-0075
IRF540CHIP
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low PRESSURE die
Abstract: No abstract text available
Text: OEM Pressure Silicon Die Model 5102 Description The 5102 is a silicon micro machined, piezoresistive pressure sensing chip. These devices are available in full-scale ranges from 5 to 300 PSI and are ideal for OEM and high volume applications. Provided in die form, these sensors
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BSW68
Abstract: AG TRANSISTOR BUY49S CP349 chip die npn transistor
Text: PROCESS CP349 Power Transistor NPN- High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 51 x 51 MILS Die Thickness 9.1 MILS Base Bonding Pad Area 7.9 x 15.7 MILS Emitter Bonding Pad Area 7.9 x 15.7 MILS Top Side Metalization Al - 30,000Å
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CP349
BUY49S
BSW68
BSW68
AG TRANSISTOR
BUY49S
CP349
chip die npn transistor
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CPD24
Abstract: datasheet 1N4937 1N4933 1N4937 1N4942 1N4948 1N5615 1N5623 CMR1F-02M DIE CHIP 51
Text: PROCESS CPD24 Fast Recovery Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 51 x 51 MILS Die Thickness 11 MILS Anode Bonding Pad Area 35 x 35 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization
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CPD24
1N4933
1N4937
1N4942
1N4948
1N5615
1N5623
CMR1F-02M
29-April
CPD24
datasheet 1N4937
1N4937
1N4948
1N5623
DIE CHIP 51
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CMR1U-01M
Abstract: UF4007 CMR1U-01 CPD16 UES1001 UES1003
Text: PROCESS CPD16 Ultra Fast Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 51 x 51 MILS Die Thickness 14 MILS Anode Bonding Pad Area 34 x 34 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization
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CPD16
UES1001
UES1003
UF4001
UF4007
CMR1U-01
CMR1U-01M
22-March
UF4007
CPD16
UES1003
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PT 2102 ic
Abstract: HXTR-41Q1 HXTR-4101TXV 2N6679 HPAC-70GT HXTR-2101 HXTR-4101 hxtr-6105 6105tx BV EI 302 2003
Text: H E W L E T T - P A C K A R D n CMPNTS EOE D £3 44475Û4 m General Purpose Transistors HXTR-2001 Chip Technical Data Features ^ k laert ; LJ Generic Chip HXTR-2001 Recommended Die Attach and Bonding Procedures Eutectic Die Attach at a stage temperature of 410 ± 10°C under
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HXTR-2001
2N6679,
HXTR-2101,
HXTR-2102,
HXTR-4101,
HXTR-6105,
HXTR-6106,
HXTR-6106
MIL-S-19500,
PT 2102 ic
HXTR-41Q1
HXTR-4101TXV
2N6679
HPAC-70GT
HXTR-2101
HXTR-4101
hxtr-6105
6105tx
BV EI 302 2003
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80C166
Abstract: SAB80C166
Text: EVA16A Application Note SAB80C166 Speichererweiterung durch MemoryBanking Seit Jahren ist der Siemens Mikrocontroller SAB80C166 auf dem Markt verfügbar. Durch die extrem schnelle CPU und die zahlreichen on-chip verfügbaren Peripheriefunktionen eignet sich der SAB80C166 hervorragend für fast alle
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EVA16A
SAB80C166
256KByte.
80C166
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Silicon Microstructures
Abstract: SM5106 tire pressure sensor low PRESSURE die
Text: SM5106 SILICON MICROSTRUCTURES INCORPORATED • Low Cost OEM Pressure Die Small, Low Cost OEM Pressure Die DESCRIPTION The SM5106 is a very small 1.56mm x 1.56mm silicon micromachined piezoresistive pressure sensing chip that has been optimized to provide the highest
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SM5106
SM5106
Silicon Microstructures
tire pressure sensor
low PRESSURE die
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nor flash 1.8V
Abstract: PSRAM M36P0R9060E0 M58PR512J
Text: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • ■ Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory
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M36P0R9060E0
TFBGA107
108MHz,
66MHz
nor flash 1.8V
PSRAM
M36P0R9060E0
M58PR512J
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Untitled
Abstract: No abstract text available
Text: BRIDGELUX BLUE POWER DIE BXFE 45 x 45 PRODUCT DATA SHEET DS-C18 The Bridgelux family of blue power die enables high performance and cost effective solutions to serve solid state lighting market. This next generation chip technology delivers improved efficiency and
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DS-C18
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BL51
Abstract: G100 P89C660 P89C668
Text: phyCORE-P89C668 QuickStart Instructions Using PHYTEC FlashToolsOCF for on-chip Flash and the µVision2 Software Evaluation Development Tool Chain Note: The PHYTEC Spectrum CD includes the electronic version of the phyCORE-P89C66x English Hardware Manual Hinweis: Die PHYTEC Spectrum CD beinhaltet die elektronische
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phyCORE-P89C668
phyCORE-P89C66x
phyCORE-P89C668
L-562e
D-55135
BL51
G100
P89C660
P89C668
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PSRAM
Abstract: M36P0R9060E0 M58PR512J M69KB096AM M58PRxxxJ
Text: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • ■ Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory
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M36P0R9060E0
TFBGA107
108MHz,
66MHz
PSRAM
M36P0R9060E0
M58PR512J
M69KB096AM
M58PRxxxJ
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