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Catalog Datasheet	MFG & Type	Document Tags	PDF
AZD076 Abstract: PEDOT Text: IQ Switch ProxSense® Series AZD076 - How to design touch electrodes for nonuniform and curved surfaces: 3D touchpads Abstract Over the last few years, touchpads have become a standard input method for next-generation user interfaces for everyday applications, from white goods to smart phones, computer peripherals, and	Original	AZD076 PEDOT	PDF
AN2292 Capacitance Sensing Abstract: AN2292 touchpad sensor pcb CYPRESS an2233a 467MP 200MP 467MP 200MP AN2318 AN2403 capacitive touch sensor pcb guideline Text: Capacitance Sensing—Layout Guidelines for PSoC CapSense AN2292 Authors: Mark Lee Associated Project: No Associated Part Family: CY8C21x34, CY8C24794 GET FREE SAMPLES HERE Software Version: None Associated Application Notes: AN2233a, AN2277, AN2318, AN2403	Original	AN2292 CY8C21x34, CY8C24794 AN2233a, AN2277, AN2318, AN2403 AN2292 Capacitance Sensing AN2292 touchpad sensor pcb CYPRESS an2233a 467MP 200MP 467MP 200MP AN2318 AN2403 capacitive touch sensor pcb guideline	PDF
radox 155 Abstract: radox 125 EF316D rg403 RG224 SX04172 MIL-C-17G RG142 Hytrel insulated wire MIL-C-17 RG-63 M17/94-RG179 Text: RF cables Edition 2008/2009 Excellence in Connectivity Solutions Standard RF coax cables Standard Coax 50: Standard Coax 75: - POLYETHYLENE dielectric PE based on MIL-C-17 - RG_6 . RG_214 Low Loss 50: Low Loss 75: Low Phase 50: Low loss RF coax cables	Original	MIL-C-17 radox 155 radox 125 EF316D rg403 RG224 SX04172 MIL-C-17G RG142 Hytrel insulated wire MIL-C-17 RG-63 M17/94-RG179	PDF
radox 155 Abstract: coaxial cable RG224 radox 125 RADOX elastomer s RG-63 cable RG142 velocity factor RG303 power Hytrel insulated wire f connector rg6 coax IC LM 393 N Text: RF CABLES GENERAL CATALOGUE Edition 2008 HUBER+SUHNER Excellence in Connectivity Solutions FURTHER RELATED CATALOGUES RF coaxial connectors general catalogue item no. 644802 Microwave cables and assemblies in english only item no. 23012500 Test+Measurement	Original	MIL-C-17 CH-9100 radox 155 coaxial cable RG224 radox 125 RADOX elastomer s RG-63 cable RG142 velocity factor RG303 power Hytrel insulated wire f connector rg6 coax IC LM 393 N	PDF
C-Band Power GaAs FET HEMT Chips Abstract: CMC 707 7 transistor solid state x-band s-parameter transistor RF TRANSISTOR 1.5 GHZ dual gate microwave fet IC MMIC X-band amplifier HEMT MMIC POWER AMPLIFIER Three MMIC Solution for an X-band RF Front End multilayer lithography ic fabrication GaAs FET HEMT Chips Text: KU-BAND MMIC POWER AMPLIFIERS DEVELOPED USING MSAG MESFET TECHNOLOGY T his article presents the design approach and test results of 1, 1.5, 2 and 5 W, Kuband MMIC power amplifiers developed using the high performance MSAG MESFET technology. Both single-ended and	Original		PDF
circuit diagram for split air conditioner Abstract: circuit diagram of split air conditioner schematic diagram for split air conditioner cross reference guide circuit diagram for split air conditioner control Split System Air Conditioner PN9000 RF Filters FM TRANSMITTER CIRCUIT DIAGRAM circuit diagram of general split air conditioner Text: Clock Conditioner Owner’s Manual 4Q 2006 Chapters: Introduction to Precision Clock Conditioners . 1 Phase Noise and Jitter .2 Phase-Locked Loop PLL Fundamentals . 3 Data Converter	Original		PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
SCHEMATIC DIAGRAM OF WIFI RF POWER TRANSISTOR Abstract: SCHEMATIC DIAGRAM OF 2.4 GHZ WIFI RF POWER wifi booster schematic simple fm transmitter mini project report for engineering students Wifi Booster Circuit Diagram wifi signal booster schematic smd-transistor DATA BOOK 2.4 ghz FM wifi RECEIVER CIRCUIT DIAGRAM fm transistor radio mini project 2.4 ghz 2 WATTS POWER AMPLIFIER SCHEMATIC DIAGRAM Text: APRIL2008 ALSO PUBLISHED ONLINE: www.highfrequencyelectronics.com NEW SYNTHESIZED SIGNAL GENERATOR OFFERS LOW COST, HIGH VALUE INSIDE THIS ISSUE: Transmission Lines on Ion-Implanted Silicon Wafers Spatial Combining of Microwave Noise Radiators Tutorial—Performance Capabilities of Antenna Arrays	Original	APRIL2008 CD-1242-183-10S CD-1242-183-20S CD-1242-183-30S CD-402-802-10S CD-402-802-20S CD-402-802-30S CD-102-103-10S CD-102-103-20S CD-102-103-30S SCHEMATIC DIAGRAM OF WIFI RF POWER TRANSISTOR SCHEMATIC DIAGRAM OF 2.4 GHZ WIFI RF POWER wifi booster schematic simple fm transmitter mini project report for engineering students Wifi Booster Circuit Diagram wifi signal booster schematic smd-transistor DATA BOOK 2.4 ghz FM wifi RECEIVER CIRCUIT DIAGRAM fm transistor radio mini project 2.4 ghz 2 WATTS POWER AMPLIFIER SCHEMATIC DIAGRAM	PDF
RK618 Abstract: LOCTITE 3623 S-CH00-0157-002 DBAS 970 25 35 PN 059 ANSI-MC-96 LOCTITE 3542 M27500A22 NES 1004 naval specification SP 107156 souriau 8611 Text: Wire and Cable, Harnessing and Protection Products Table of Contents Tyco Electronics Embraces the Most Valued Brand Names Worldwide ……………………………ii About Raychem Wire and Cable, Harnessing and Heat-Shrinkable Products ………………………iii	Original		PDF
IPC-T-50 Abstract: electrode oven calibration certificate formats JEDEC JESD22-B116 free laser guided door opener project report MIL-STD-883H Ultrasonic humidifier transducer NCSL Z540.3 Ultrasonic Atomizing Transducer laser diode spectra physics DIODE IN 4002 424 Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 September 2010. INCH - POUND MIL-STD-883H 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD	Original	MIL-STD-883H MIL-STD-883G STD883 IPC-T-50 electrode oven calibration certificate formats JEDEC JESD22-B116 free laser guided door opener project report MIL-STD-883H Ultrasonic humidifier transducer NCSL Z540.3 Ultrasonic Atomizing Transducer laser diode spectra physics DIODE IN 4002 424	PDF

SMD MARKING CODE 071 A01 Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods	Original	LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo	PDF
LGA 1155 Socket PIN diagram Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08 Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original		PDF
JD 1803 Abstract: philips diode PH 33D Schematics bosch AL 1450 DV bosch al 1450 dv JD 1803 52B jd 1803 IC jd 1803 data sheet quartz kds 9j shockley diode application Yokogawa yf 104 Text: High-Frequenty Analog Integrated Cirtuit Design Edited by R a v en d er G oyal W ILEY SERIES IN MICROWAVE AND OPTICAL ENGINEERING K a i Chang Series Editor , INSUME OF MICROELECTRONICSUBßARY High-Frequency Analog Integrated-Circuit Design W ILEY SERIES IN MICROWAVE AN D O PTICAL	OCR Scan		PDF