32-PIN
Abstract: PD-03 745 diode dimensions PD05 32 PIN
Text: Package Diagram DIP Modules 32-Pin DIP Module PD02 1.590 1.610 0.600 0.620 0.590 0.610 0.007 0.013 0.315 0.335 0.100 TYP 0.015 0.025 0.125 0.175 0.050 TYP 32-Pin DIP Module PD03 1 DIMENSIONSININCHES MIN. MAX. Package Diagram 32-Pin DIP Module PD05 1.745 1.755
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32-Pin
60-Pin
600TYP.
PD-03
745 diode
dimensions
PD05
32 PIN
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PA32-32-DP
Abstract: PA32-32-DP-PP 3232DPSM
Text: PA32-32-DP -PP Data Sheet 32 pin DIP socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction The PA32-32-DP adapter accepts 32 pin DIP devices and plugs into 32 pin PLCC production sockets. This allows DIP devices, or emulators with DIP plugs, to be used during development of
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PA32-32-DP
socket/32
PA32-32-DP-PP
27C010
27C020
27C040
27C080
3232DPSM
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Untitled
Abstract: No abstract text available
Text: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during
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PA28-32-20-Dx-QF
AT90S2333,
AT90LS4433,
AT90S4433,
AT90LS4433
32QFP
PA28-32-20-DZ-QF
PA28-32-20DxQF
283220DQ
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Untitled
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE 32 PIN PLASTIC DIP-32P-M02 EIAJ code : ∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-32P-M02 32-pin plastic SK-DIP (DIP-32P-M02) +0.20 39.98 –0.30 +.008 1.574 –.012
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DIP-32P-M02
DIP032-P-0300-1
100mil
300mil
32-pin
DIP-32P-M02)
D32009S-1C-3
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DIP032-P-0600-1
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 32 PIN PLASTIC DIP-32P-M01 EIAJ code : ∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP (DIP-32P-M01) +0.20 40.44 –0.30 +.008 1.592 –.012 INDEX-1
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DIP-32P-M01
DIP032-P-0600-1
100mil
600mil
32-pin
DIP-32P-M01)
D32007S-1C-3
DIP032-P-0600-1
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d-3200
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC DIP-32P-M02 EIAJ code :∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-32P-M02 32-pin plastic SK-DIP (DIP-32P-M02)
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DIP-32P-M02
DIP032-P-0300-1
32-pin
DIP-32P-M02)
D32009S-1C-3
d-3200
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32 PIN
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 32 PIN CERAMIC DIP-32C-A02 EIAJ code : ∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-32C-A02 32-pin ceramic SL-DIP (DIP-32C-A02) 40.13±0.43 (1.580±.017) R1.27(.050)
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DIP-32C-A02
DIP032-C-0400-1
100mil
400mil
32-pin
DIP-32C-A02)
D32011SC-1-3
32 PIN
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DIP032-P-0600-1
Abstract: DIP-32P-M01
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP (DIP-32P-M01) +0.20 40.44 –0.30
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DIP-32P-M01
DIP032-P-0600-1
32-pin
DIP-32P-M01)
D32007S-1C-3
DIP032-P-0600-1
DIP-32P-M01
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC DIP-32C-A02 EIAJ code :∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-32C-A02 32-pin ceramic SL-DIP (DIP-32C-A02) 40.13±0.43
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DIP-32C-A02
DIP032-C-0400-1
32-pin
DIP-32C-A02)
D32011SC-1-3
subj050)
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PA28-32-DP
Abstract: PA28-32-DP-PP 2832DPSM 27x512
Text: PA28-32-DP -PP Data Sheet 28 pin DIP socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-32-DP adapter accepts 28 pin DIP devices and plugs into 32 pin PLCC production sockets. This allows DIP devices, or emulators with DIP plugs, to be used during development of
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PA28-32-DP
socket/32
27x64
27x128
27x256
27x512
PA28-32-DP-PP
2832DPSM
27x512
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DIP032-P-0600-1
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP
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DIP-32P-M01
DIP032-P-0600-1
32-pin
DIP-32P-M01)
D32007S-1C-3
DIP032-P-0600-1
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PA32TS14-OT
Abstract: 32TS14
Text: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.
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PA32TS14-OT
socket/32
E28F010
32TS14
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29f512
Abstract: pinout socket 7 PA32TS20-OT 29F010
Text: PA32TS20-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS20-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM
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PA32TS20-OT
socket/32
E28F010
E28F020
29F259
29F512
29F010
F28F010
F28F020
29f512
pinout socket 7
29F010
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Untitled
Abstract: No abstract text available
Text: PA32QFN-32 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFN devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via
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PA32QFN-32
socket/32
PA32QFN-32
32QNG-7070
32QN65T17070
32QFN
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PA32-32
Abstract: PA32-32Z 32-32ZR lcc 20 test socket clcc 32 socket lcc 28 socket 32 pin plcc socket J-Lead, plcc clcc 28 socket footprint plcc 32
Text: PA32-32 Z Data Sheet 32 pin PLCC socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin PLCC, CLCC and LCC devices in their 32 pin DIP footprint. The adapter is made up of 2 sub-assemblies. They assemble via
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PA32-32
socket/32
PA32-32Z
27x010,
27x020,
27x040,
27x080,
27x101,
27x201,
27x401,
32-32ZR
lcc 20 test socket
clcc 32 socket
lcc 28 socket
32 pin plcc socket
J-Lead, plcc
clcc 28 socket
footprint plcc 32
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W9759
Abstract: MBM29F010 29C101T15 intel 28F020 intel 28F010 28F010T AM29F010 28F020T 28F001BX-B 28F001BX-T
Text: Created in DoubleCAD XT, www.DoubleCAD.com 17.78 mm 6.42 mm 32 pin TSOP to 32 pin DIP 22.04 mm Part Number W9759 Product Group Programmer Adapters Top Package TSOP Top Pitch 0.5mm Bottom Package DIP Bottom Pitch 0.6" Top Pins 32 Bottom Pins 32 15.24 mm 2.54 mm
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W9759
AM29F010/040
28F010T
28F020T
MBM29F010/40
29C101T15
28F001BX-B
28F001BX-T
28F010
28F020
MBM29F010
intel 28F020
intel 28F010
AM29F010
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PA32Q1498
Abstract: 32QF1498
Text: PA32Q1498 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via
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PA32Q1498
socket/32
PA32Q1498
32Q-1498
IC51-0324-1498
32QF1498
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PA32Q-1498-1
Abstract: 32QF1498-1
Text: PA32Q-1498-1 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via
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PA32Q-1498-1
socket/32
IC51-0324-1498
PA32Q-1498-1
32QF1498-1
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index DIP-32C-A02 EIAJ code :∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-32C-A02
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DIP-32C-A02
DIP032-C-0400-1
32-pin
DIP-32C-A02)
D32011SC-1-3
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32-pin
Abstract: fujitsu
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M02 EIAJ code :∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-32P-M02
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DIP-32P-M02
DIP032-P-0300-1
32-pin
DIP-32P-M02)
D32009S-1C-3
fujitsu
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3224P
Abstract: No abstract text available
Text: PA32-24-wP Z d Data Sheet 32 pin PLCC socket/24 pin DIP 0.3” or 0.6” plug Introduction Adapter Construction This data sheet describes several adapters. They are all similar in that they have 32 pin PLCC test sockets and 24 pin DIP plugs. They differ in the dimensions of the DIP plug and the wiring from
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PA32-24-wP
socket/24
PA32-24-wPZ6
3224P
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PA40SO1-OT
Abstract: XXSO1-OT test socket 32 pin Enplas Enplas OTS 36 32 pin test socket footprint dip 40 Enplas 14 pin footprint dip 16 Enplas 28 pin
Text: PAxxSO1-OT Data Sheet xx pin SO Socket/xx pin DIP 0.6" plug Supported Device/Footprints Adapter Dimensions Using this adapter, the 32 and 40 pin SO EPROM packages can be programmed on DIP programmers. Device Device 32 pin 40 pin Mfgr Many " Package SO " Footprint
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PA40SO1-OT
OTS-40-1
40SD-01
32SO-01
40SO-01
PA40SO1
XXSO1-OT
test socket 32 pin
Enplas
Enplas OTS 36
32 pin test socket
footprint dip 40
Enplas 14 pin
footprint dip 16
Enplas 28 pin
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Untitled
Abstract: No abstract text available
Text: PA34-32-1SP6 Data Sheet 34 pin SO 0.040” pitch socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This PA34-32-1SP6 adapter allows programming of an STMicro ST7263 in a 34 pin SOIC package in its 32 pin DIP footprint. The adapter is made up of 2 sub-assemblies. They assemble via
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PA34-32-1SP6
socket/32
ST7263
34SL-P
P2034SO
34321SP6
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Enplas drawings
Abstract: TSOP 54 PIN Enplas OTS 0,047 63 DIP 32 DIMENSION enplas TSOP 40 socket F28F010 F28F020
Text: CIC-32TS-32D-A6-ENP-R 32-Lead TSOP to a 32-Pin DIP 3/98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: F28F010 F28F020 SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
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CIC-32TS-32D-A6-ENP-R
32-Lead
32-Pin
F28F010
F28F020
NC/A17
OTS-32-0
Enplas drawings
TSOP 54 PIN
Enplas OTS
0,047 63
DIP 32 DIMENSION
enplas
TSOP 40 socket
F28F010
F28F020
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