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    DIP14 PACKAGE Search Results

    DIP14 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC74HC14AP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Hex Inverter, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC4069UBP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Inverter, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC74HC04AP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Hex Inverter, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC4001BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, 2-Input/AND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC4013BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, D-Type Flip-Flop, DIP14 Visit Toshiba Electronic Devices & Storage Corporation

    DIP14 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DIP14 Package Unknown Scan PDF

    DIP14 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SOP20

    Abstract: SOL20 DIP20 DIP-20
    Text: BiCMOS Standard Logics TD74BC Series A4 Typo No. Package Function TD74BC00P Quad 2-Input NAND Gate DIP14 TD74BC08P Quad 2-Input AND Gate DIP14 TD74BC32P Quad 2-Input OR Gate DIP14 TD74BC230P/F/FW Octal Bus Butter/Inverting and Non-lnvertlng/3-state DIP20/SOP20/SOL20


    OCR Scan     		TD74BC TD74BC00P TD74BC08P TD74BC32P TD74BC230P/F/FW TD74BC231P/F/FW TD74BC240P/F/FW TD74BC241 TD74BC242P TD74BC243P SOP20 SOL20 DIP20 DIP-20 PDF

    DIP14

    Abstract: DIP-14
    Text: PACKAGE DIMENSIONS DIP14 UNIT : mm Ver.2010-11-26


    Original     		DIP14 DIP14 DIP-14 PDF

    BU4001B

    Abstract: No abstract text available
    Text: BU4001B BU4001BF Quad 2-input NOR gate The BU4001B and BU4001BF consist of four 2-input positive logic NOR gates for CMOS devices in a single structure. Dimensions Units : mm BU4001B (DIP14) Features • available in DIP14 and SOP14 packages • low power consumption


    OCR Scan     		BU4001B BU4001BF BU4001BF DIP14 BU4001B DIP14) BU4001B, BU4001 PDF

    ba10339fv

    Abstract: BA10339 BA10339F
    Text: BA10339 BA10339F BA10339FV Quad comparators The BA10339, BA10339F, and BA10339FV each consist of four comparators in a single package. The open-collector output allows a wired OR connection. Dimensions Units : mm BA10339 (DIP14) o Features available in DIP14, SOP14, and


    OCR Scan     		BA10339 BA10339F BA10339FV BA10339, BA10339F, BA10339FV DIP14, SSOP-B14 BA10339 DIP14) PDF

    4069UBF

    Abstract: 4069U 4069UB BU4069UB
    Text: BU4069UB BU4069UBF Hex inverter The BU4069UB and 4069UBF consist of 6 inverters in a single package. Dimensions Units : mm BU4069B (DIP14) They are suitable for use in CMOS circuits. 19.4± 0.3 Features • available in DIP14 and SOP14 packages • low power consumption


    OCR Scan     		BU4069UB BU4069UBF 4069UBF DIP14 BU4069B DIP14) BU4069BF BU4000B BU4069UB, 4069U 4069UB PDF

    Untitled

    Abstract: No abstract text available
    Text: BU4030B BU4070B BU4030BF BU4070BF The BU4030B/F and BU4070B/F consist of four exclusive OR gates in a single package. They are suitable for CMOS circuits. Quad exclusive-OR gate Dimensions Units : mm BU4030B and BU4070B (DIP14) Features O available in DIP14 and SOP14


    OCR Scan     		BU4030B BU4070B BU4030BF BU4070BF BU4030B/F BU4070B/F DIP14 BU4070B DIP14) PDF

    ba612

    Abstract: No abstract text available
    Text: BA612 Driver, 5-channel, high current The BA612 consists of an array of five Darlington-configured transistor pairs each of which has built-in input resistors. Dimensions Units : mm BA612 (DIP14) They are used as high current drivers. Features o available in a DIP14 package


    OCR Scan     		BA612 BA612 DIP14 DIP14) PDF

    QFP80

    Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32 PDF

    SOP18 EIAJ

    Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 SOP18 EIAJ QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ PDF

    DIP18

    Abstract: DIP20 DIP40
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40 PDF

    QFP80

    Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013 PDF

    DIP14

    Abstract: DIP-14 SOT27-1 MAR111
    Text: Philips Semiconductors Package outlines DIP14: plastic dual in-line package; 14 leads 300 mil 1995 Mar 11 1 SOT27-1


    Original     		DIP14: OT27-1 DIP14 DIP-14 SOT27-1 MAR111 PDF

    Untitled

    Abstract: No abstract text available
    Text: BA9700A BA9700AF Regulator, switching The BA9700A and BA9700AF ICs are switching regulators that use a pulse width modulated system for a very stable output. D im en sio n s U n its : m m BA9700A (DIP14) I9 ,4 ± 0 .3 Features • o available in DIP14 and SOP14


    OCR Scan     		BA9700A BA9700AF BA9700AF DIP14 BA9700A DIP14) A9700A, PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS DIP14 19.0±0.3 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51MIN 4.7MAX 2.03MAX +0.15 0.25 -0.05 0 ~ 15º UNIT : mm


    Original     		DIP14 51MIN 03MAX PDF

    LS404 equivalent

    Abstract: 067F
    Text: LS404 HIGH PERFORMANCE QUAD OPERATIONAL AMPLIFIERS . . . SINGLE OR SPLIT SUPPLY OPERATION LOW POWER CONSUMPTION SHORT CIRCUIT PROTECTION LOW DISTORTION, LOW NOISE HIGH GAIN-BANDWIDTH PRODUCT HIGH CHANNEL SEPARATION N DIP14 Plastic Package DESCRIPTION


    Original     		LS404 DIP14 LS404 PM-SO14 LS404 equivalent 067F PDF

    DIP14-P-300-2

    Abstract: No abstract text available
    Text: DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.93 TYP. 2/Dec. 11, 1996


    Original     		DIP14-P-300-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC7266AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HC7266AP DIP14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC164AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HC164AP DIP14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT74AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HCT74AP DIP14 PDF

    3119A

    Abstract: NDK 3119A US Crystal NDK 3119A-AQE70
    Text: SIMPLE PACKAGED CRYSTAL OSCILLATORS 3100 SERIES • Model 3119A ■ Main applications : Facsimilies, OA products ■ Features 8 Compactness and light weight in addition to the use of DIP14 pin compatible package. 8 High-reliability metal package grounded


    Original     		DIP14 AQA70 AQB70 AQE70 conditio19A 3119A NDK 3119A US Crystal NDK 3119A-AQE70 PDF

    PVAPOX

    Abstract: C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14
    Text: Q094XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 094X PRODUCT NAME : TS94X LINE DESCRIPTION : OUTPUT RAIL TO RAIL BiCMOS µPOWER OPAMP WAFER CODE : C0941AAH/C0942AAZ/C0944AAH PACKAGES : SOT23/SO8/SO14/TSSOP14/DIP8/DIP14


    Original     		Q094XS1 TS94X C0941AAH/C0942AAZ/C0944AAH OT23/SO8/SO14/TSSOP14/DIP8/DIP14 E917093XA TS942) TSSOP14, OT23-5, DIP14) PVAPOX C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC4024AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HC4024AP DIP14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC86AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HC86AP DIP14 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC14AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		TC74HC14AP DIP14 PDF