DIP8
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS DIP8 UNIT : mm Ver.2010-11-26
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DIP8
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS DIP8 MUSES UNIT : mm Ver.2009-05-20
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lpc901
Abstract: DIP8 and so Package measurement of power using 8051 microcontroller P89lpc901 LPC2000
Text: DB-DIP8-LPC901 USB-Dongle and Derivative Boards The DB-DIP8-LPC901 is the Derivative Board for the P89LPC901 microcontroller in an 8 pin DIP package. The DB-DIP8-LPC901 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-DIP8-LPC901 allow quick and easy ICP
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DB-DIP8-LPC901
DB-DIP8-LPC901
P89LPC901
P89LPC901.
LPC901
622-1009-ND
1-800-DIGI-KEY
DIP8 and so Package
measurement of power using 8051 microcontroller
P89lpc901
LPC2000
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Untitled
Abstract: No abstract text available
Text: DB-DIP8-LPC901 USB-Dongle and Derivative Boards The DB-DIP8-LPC901 is the Derivative Board for the P89LPC901 microcontroller in an 8 pin DIP package. The DB-DIP8-LPC901 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-DIP8-LPC901 allow quick and easy ICP
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DB-DIP8-LPC901
DB-DIP8-LPC901
P89LPC901
P89LPC901.
LPC901
622-1009-ND
1-800-DIGI-KEY
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LPC901
Abstract: P89LPC901 LPC2000 measurement of power using 8051 microcontroller DB-DIP8-LPC901
Text: DB-DIP8-LPC901 USB-Dongle and Derivative Boards The DB-DIP8-LPC901 is the Derivative Board for the P89LPC901 microcontroller in an 8 pin DIP package. The DB-DIP8-LPC901 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-DIP8-LPC901 allow quick and easy ICP
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DB-DIP8-LPC901
DB-DIP8-LPC901
P89LPC901
P89LPC901.
LPC901
P89LPC901
LPC2000
measurement of power using 8051 microcontroller
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DIP18
Abstract: DIP20 DIP28 DIP40
Text: DIP–Packages Package DIP8–20 Dimensions in mm 7.82 7.42 ”L” 4.8 max 0.5 min 6.4 max 0.39 max 9.75 8.15 3.3 0.58 0.48 1.64 1.44 2.54 ”X” Alternative technical drawings according to DIN specifications Package min DIP8 9.5 ”L” ”X” max 7.62
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DIP14
DIP16
DIP18
DIP20
DIP24
DIP24
DIP28
DIP40
DIP18
DIP20
DIP28
DIP40
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TDA8199
Abstract: tda819
Text: TDA8199 STEREO AMPLIFIER AND DC VOLUME CONTROL FOR TV • ■ ■ STEREO CIRCUIT DC VOLUME CONTROL 12dB MAXIMUM GAIN DIP8 Plastic Package DESCRIPTION ORDER CODE : TDA8199 The TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications.
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TDA8199
TDA8199
tda819
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TDA8199
Abstract: No abstract text available
Text: TDA8199 STEREO AMPLIFIER AND DC VOLUME CONTROL FOR TV • ■ ■ STEREO CIRCUIT DC VOLUME CONTROL 12dB MAXIMUM GAIN DIP8 Plastic Package DESCRIPTION ORDER CODE : TDA8199 The TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications.
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TDA8199
TDA8199
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tda8196
Abstract: "Volume Control" DIN45405
Text: TDA8196 AUDIO SWITCH AND DC VOLUME CONTROL FOR TV . . TWO AUDIO INPUTS WITH SWITCHING FACILITIES FULLY COMPATIBLE WITH THE SCART EUROPEAN NORM EN 50049 DC VOLUME CONTROL DIP8 Plastic Package DESCRIPTION The TDA8196 is a monolithic integrated circuit in DIP8 package intended for TV applications.
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TDA8196
TDA8196
"Volume Control"
DIN45405
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TDA8196
Abstract: SW DIP8
Text: TDA8196 AUDIO SWITCH AND DC VOLUME CONTROL FOR TV . . TWO AUDIO INPUTS WITH SWITCHING FACILITIES FULLY COMPATIBLE WITH THE SCART EUROPEAN NORM EN 50049 DC VOLUME CONTROL DIP8 Plastic Package DESCRIPTION The TDA8196 is a monolithic integrated circuit in DIP8 package intended for TV applications.
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TDA8196
TDA8196
SW DIP8
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pmfp
Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Text: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
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OT97-1
DIP16
OT38-1
OT144-1
OT96-1
OT96-2
OT158-2
pmfp
SO8 package
MS-012AA
VSO40
SOT176-1
075E03
SOT144-1
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DIP40
Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Text: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)
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OT97-1
DIP14
OT27-1
DIP16
OT38-1
DIP20
OT146-1
DIP24
OT101-1
DIP28
DIP40
LQFP100
LQFP128
LQFP64
QFP44
DIP20
DIP28
015ad
ZE 004-1
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DIP8 Package
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 2.54 0.46±0.1 2.8MIN 1.0±0.2 0.51MIN 0.74MAX 4.7MAX 1.5±0.2 +0.15 0.25 -0.05 0 ~ 15º UNIT : mm
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51MIN
74MAX
DIP8 Package
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MC1458
Abstract: mc1458 equivalent ua741 MC1558 MC1458 to99 mc1458 equivalent MC1458 a 1458I gyration MC1458H MC1458I
Text: MC1458 MC1558 DUAL OPERATIONAL AMPLIFIERS LOW POWER CONSUMPTION LARGE INPUT VOLTAGE RANGE NO LATCH-UP HIGH GAIN SHORT-CIRCUIT PROTECTION NO FREQUENCY COMPENSATION REQUIRED D SO8 Plastic Micropackage N DIP8 (Plastic Package) J CERDIP8 (Cerdip Package) DESCRIPTION
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MC1458
MC1558
MC1458
mc1458 equivalent ua741
MC1558
MC1458 to99
mc1458 equivalent
MC1458 a
1458I
gyration
MC1458H
MC1458I
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DIP16F
Abstract: LB1660N LB1661 LB1664N 3054A-DIP16F hall 1665
Text: Ordering number: EN2551C Monolithic Digital IC LB1660N, 1661, 1664N, 1665 2-Phase Unipolar Brushless Motor Drivers Applications Package Dimensions . 2-phase unipolar brushless motor ex. DC brushless fan unit : mm motor drivers 3001B-DIP8 [LB1661N, 1661]
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EN2551C
LB1660N,
1664N,
3001B-DIP8
LB1661N,
1664N
LB1661,
054A-DIP16F
LB1664N,
DIP16F
LB1660N
LB1661
LB1664N
3054A-DIP16F
hall 1665
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LB1660N
Abstract: DIP16F LB1660 LB1661 LB1664N transistor CR
Text: Ordering number: EN2551C Monolithic Digital IC LB1660N, 1661, 1664N, 1665 2-Phase Unipolar Brushless Motor Drivers Applications . 2-phase unipolar brushless motor ex. DC brushless fan motor drivers Package Dimensions unit : mm 3001B-DIP8 [LB1660N, 1661]
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EN2551C
LB1660N,
1664N,
3001B-DIP8
1664N
LB1661,
054A-DIP16F
LB1664N,
LB1660N
DIP16F
LB1660
LB1661
LB1664N
transistor CR
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AN 27701
Abstract: LA5692D LA5692M LA5692S ic LA*92
Text: Ordering number : EN2770B Monolithic Linear IC LA5692D, 5692S, 5692M Voltage Regulator Driver with Watchdog Timer Overview Package Dimensions The LA5692 is a single-chip voltage regulator for unit: mm microcomputer system monitor use that performs the 3001B-DIP8
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EN2770B
LA5692D,
5692S,
5692M
LA5692
3001B-DIP8
LA5692D]
AN 27701
LA5692D
LA5692M
LA5692S
ic LA*92
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Untitled
Abstract: No abstract text available
Text: Ordering number : EN2769B Monolithic Linear IC LA5693D, 5693S, 5693M Voltage Regulator Driver with Watchdog Timer Overview Package Dimensions The LA5693 is a single-chip voltage regulator for unit: mm microcomputer system monitor use that performs the 3001B-DIP8
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EN2769B
LA5693D,
5693S,
5693M
LA5693
3001B-DIP8
LA5693D]
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resistors SIP9
Abstract: 5693S LA5693D LA5693M LA5693S
Text: Ordering number : EN2769B Monolithic Linear IC LA5693D, 5693S, 5693M Voltage Regulator Driver with Watchdog Timer Overview Package Dimensions The LA5693 is a single-chip voltage regulator for unit: mm microcomputer system monitor use that performs the 3001B-DIP8
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EN2769B
LA5693D,
5693S,
5693M
LA5693
3001B-DIP8
LA5693D]
resistors SIP9
5693S
LA5693D
LA5693M
LA5693S
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DIP18
Abstract: DIP20 DIP28 DIP40 LQFP100 LQFP128 LQFP32 LQFP64 ZE 004-1
Text: PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)
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OT97-1
DIP14
OT27-1
DIP16
OT38-1
OT38-4
OT38-9
DIP18
DIP18
DIP20
DIP28
DIP40
LQFP100
LQFP128
LQFP32
LQFP64
ZE 004-1
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SOL16-P
Abstract: HQFP64-P SOL18 package SOL20 package PACKAGE DIMENSIONS SOP14 HSOP16 HSON-6P HZIP25-P QFP48 package
Text: [ 7 ] IC/LSI Package Dimensions [ 7 ] IC/LSI Package Dimensions Unit: mm DIP8-P-300-2.54 DIP14-P-300-2.54 DIP16-P-300-2.54A DIP18-P-300-2.54D 1271 [ 7 ] IC/LSI Package Dimensions Unit: mm DIP20-P-300-2.54A DIP42-P-600-2.54 HQFP64-P-1010-0.50 HSON6-P-0303-0.95
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
DIP20-P-300-2
DIP42-P-600-2
HQFP64-P-1010-0
HSON6-P-0303-0
HSOP16-P-300-1
HSOP20-P-450-1
SOL16-P
HQFP64-P
SOL18 package
SOL20 package
PACKAGE DIMENSIONS
SOP14
HSOP16
HSON-6P
HZIP25-P
QFP48 package
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10393 sop8
Abstract: BA10393F BA10393 A10393
Text: Dual comparators B A 10393 B A 10 3 9 3 F BA10393N The BA10393, BA10393F, and BA10393N each consist of two comparators in the same package. The open-collector output allows wired OR connection. Dimensions U n its : mm BA10393 (DIP8) Features available in DIP8, SOP8, and SIP8
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BA10393N
BA10393,
BA10393F,
BA10393N
BA10393
BA10393F
10393 sop8
BA10393F
BA10393
A10393
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lead frame QFP
Abstract: OKI Package code
Text: E2D5007-16-50 O K I Sem ♦ PACKAGE OUTLINES AND DIMENSIONS : mm 8-Pin Plastic DIP DIP8-P-30Q-2.54
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E2D5007-16-50
DIP8-P-30Q-2
18-Pin
DIP18-P-300-2
lead frame QFP
OKI Package code
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sot267
Abstract: No abstract text available
Text: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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DIP16
DIP20
DIP24
DIP28
DIP40
OT97-1
OT38-1
OT146-1
OT101-1;
OT101B
sot267
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