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    DMV30W-1811 Search Results

    DMV30W-1811 Result Highlights (5)

    Part
    ECAD Model
    Manufacturer
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    131-8118-11D
    3D Model
    Amphenol Communications Solutions Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. Visit Amphenol Communications Solutions
    131-8118-11H
    3D Model
    Amphenol Communications Solutions Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. Visit Amphenol Communications Solutions
    10131318-18111G0LF
    3D Model
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing. Visit Amphenol Communications Solutions
    68418-112HLF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail Visit Amphenol Communications Solutions
    77315-118-11LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle Visit Amphenol Communications Solutions