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    DPS MODULE Search Results

    DPS MODULE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DPS-DONGLE-EVM Texas Instruments DPS-DONGLE-EVM Interface Adapter Board for Repeaters, Retimers, and SDI Products Evaluation Module Visit Texas Instruments Buy
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4204F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4162F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4206F Toshiba Electronic Devices & Storage Corporation Intelligent power device 500V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
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    DPS MODULE Price and Stock

    L-com Inc DDX-CAM-DP

    DISPLAYPORT ACCESS MODULE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com DDX-CAM-DP
    • 1 $289
    • 10 $272.34
    • 100 $268.25
    • 1000 $268.25
    • 10000 $268.25
    		Buy Now

    Phoenix Contact FB-DP-RPTR

    PROFIBUS DP interface/repeater module
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FB-DP-RPTR
    • 1 $580.78
    • 10 $532.38
    • 100 $532.38
    • 1000 $532.38
    • 10000 $532.38
    		Buy Now

    Leviton Manufacturing Co 47605-DP

    AC Power Surge Protective Module (two duplex blue receptacles)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com 47605-DP
    • 1 $146.6
    • 10 $129.34
    • 100 $116.83
    • 1000 $116.83
    • 10000 $116.83
    		Buy Now

    Phoenix Contact FB-DP-RPTR/SC

    PROFIBUS DP interface/repeater module with oscilloscope functionality
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FB-DP-RPTR/SC
    • 1 $1588.46
    • 10 $1522.49
    • 100 $1522.49
    • 1000 $1522.49
    • 10000 $1522.49
    		Buy Now

    Phoenix Contact MINI MCR-2-V8-PB-DP

    Eight MINI Analog Pro signal conditioners and measuring transducers can be quickly and easily integrated into a PROFIBUS DP network via a communication adapter.
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com MINI MCR-2-V8-PB-DP
    • 1 $563.17
    • 10 $516.24
    • 100 $516.24
    • 1000 $516.24
    • 10000 $516.24
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    DPS MODULE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DP1000

    Abstract: No abstract text available
    Text: DPS Differential Pressure Sensor DESCRIPTION The powertrain control module in the vehicle supplies power to The DPS is a diesel particulate filter differential pressure the sensor where a pressure transducer measures the sensor with two pressure ports. The output is a differential


    Original     		PDF 008148-1-EN DP1000

    LYPR540AH

    Abstract: LYPR540AH DATASHEET LGA-28L gyroscope three axis application gyroscope 9 AXIS lga28l LYPR540AHTR LGA land pattern LGA28
    Text: LYPR540AH MEMS motion sensor: 3 axis analog output gyroscope Preliminary data Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range -40°C to 85°C ■ 3 indipendent angular rate channels ■ ±400 dps and ±1600 dps full-scale


    Original     		PDF LYPR540AH LGA-28L LYPR540AH LYPR540AH DATASHEET LGA-28L gyroscope three axis application gyroscope 9 AXIS lga28l LYPR540AHTR LGA land pattern LGA28

    LGA-28L

    Abstract: LYPR540AH LYPR LGA28L N1A3D
    Text: LYPR540AH MEMS motion sensor: 3 axis analog output gyroscope Preliminary data Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range -40°C to 85°C ■ 3 indipendent angular rate channels ■ ±400 dps and ±1600 dps full-scale


    Original     		PDF LYPR540AH LGA-28L LYPR540AH LGA-28L LYPR LGA28L N1A3D

    galvanized iron thermal conductivity

    Abstract: 122.04.02 dps 350 power supply schematic reliance thyristor 400V motor operated valves wiring diagrams reliance thyristor wiring diagram 135.12.02 automax dps 450 power supply schematic 1620a 17
    Text: AutoMax DPS DC Power Module Instruction Manual User Manual: 49 1335-e 06 Publication: AMXDPS-UM003D-EN TABLE OF CONTENTS GENERAL NOTES Chapter 1. Chapter 2. DESCRIPTION WITH SCHEMATIC DIAGRAM 1.5 Features .


    Original     		PDF 1335-e AMXDPS-UM003D-EN F-800S F-700L F-800L F-16S F-16XL F-14S F-14M F-14L galvanized iron thermal conductivity 122.04.02 dps 350 power supply schematic reliance thyristor 400V motor operated valves wiring diagrams reliance thyristor wiring diagram 135.12.02 automax dps 450 power supply schematic 1620a 17

    LGA-28

    Abstract: LSM030AL LGA-28L LSM030ALTR
    Text: LSM030AL Linear sensor module 3D gyroscope sensor Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range 40 °C to 85 °C ■ 3 indipendent angular rate channels ■ ±1500 dps full-scale ■ High shock survivability


    Original     		PDF LSM030AL LGA-28L LSM030AL LGA-28 LGA-28L LSM030ALTR

    Neuron Chip 3150 MIP application

    Abstract: Microprocessor Interface Program Neuron Chip 3150 CYPRESS SLTA-10 Neuron Chip 3150 mip 386
    Text: LONWORKS MIP/DPS Developer’s Kit Model 23210 Description The Microprocessor Interface Program MIP is firmware for the Neuron Chip that transforms the Neuron Chip into a communications coprocessor for an attached host processor. The MIP enables the attached host to implement LONWORKS applications


    Original     		PDF 03-0333-01A Neuron Chip 3150 MIP application Microprocessor Interface Program Neuron Chip 3150 CYPRESS SLTA-10 Neuron Chip 3150 mip 386

    DPS128X32CV3

    Abstract: 2CV3
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ


    OCR Scan     		PDF 128X3 DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 500mV 30A044-24 DPS128X32CV3 2CV3

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1 Megabit CM OS SRAM DPS128M8n3/DPS 128X8A3 DESCRIPTION: The DPS128M8nY & DPS 128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded,


    OCR Scan     		PDF DPS128M8n3/DPS 128X8A3 DPS128M8nY 128X8A3 50-pin 100ns 120ns 150ns California92841-1428 30A097-01

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit High Speed CMOS SRAM D EN SE-PA C DPS 128M8CnY/BnY, DPS128X8CA3/BA3 M I C R O S Y S T E M S DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF 128M8CnY/BnY, DPS128X8CA3/BA3 DPS128X8CA3/BA3 50-pin 30A097-31 27ST41S

    48-PIN

    Abstract: 50-PIN tl71 operational 128X8A3
    Text: 1 Megabit CMOS SRAM D E N S E - P A C M I C R O S Y S T E M DPS 128M8n3/DPS 128X8A3 S DESCRIPTION: The D P S 1 2 8 M 8 n Y & D P S 128X 8A 3S R A M devicesarea revolutionary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless C hip Carriers SLCC . Available in straight leaded,


    OCR Scan     		PDF 128M8n3/DPS 128X8A3 DPS128M8nY DPS128X8A3SRAMdevicesarea 50-pi -M25T 100ns 150ns California92841-1428 30A097-01 48-PIN 50-PIN tl71 operational 128X8A3

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS 128X32CV3/DPS12 8X32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC


    OCR Scan     		PDF DPS128X32CV3/DPS128X32BV3 128X32CV3/DPS12 8X32BV3 DPS128X32CV3/DPS128X32BV3 500mV 128X32C

    AL339

    Abstract: 50-PIN
    Text: DENSE-PAC MICROSYSTEMS 2 Megabit C M O S SRAM DPS 128X 16n 3 DESCRIPTION: The D PS128X16n3SRAM "ST A C K " modules are a revolutionary new memory subsystem using Dense-PacMicrosystems'ceramicStackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded


    OCR Scan     		PDF 28X16n3 128X16n3 50-pin DPS128X16n3 128Kx16 100ns 120ns 150ns -f125 California92841-1428 AL339

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM DPS12 8 X1 6 Cn3 /DPS12 8 X1 6 Bn3 MICROSYSTEMS DESCRIPTION: The DPS 128X16Cn3/DPS128X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF 28X16Cn3/DPS128X16Bn3 50-pin DPS128X16Cn3/DPS128X16Bn3 3QA097-32

    Untitled

    Abstract: No abstract text available
    Text: PENSE-PAC 1 Megabit CMOS SRAM DPS128M8n3/DPS 128X8 A3 MICROSYSTEMS DESCRIPTION: The DPS128M8nY & DPS128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded,


    OCR Scan     		PDF DPS128M8n3/DPS 128X8 DPS128M8nY DPS128X8A3 50-pin 100ns 120ns 150ns 30A097-01

    Untitled

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. DPS16X17 16K X 16 CM OS SRAM MODULE O D ESCRIPTIO N: The DPS16X17 is part of a new family of high speed static RAM modules developed by Dense-Pac Microsystems, Inc. The DPS 16X17 uses advanced packaging concepts which mount four LCC memory


    OCR Scan     		PDF DPS16X17 DPS16X17 16X17 DPS16X17-25 DPS16X17-35 DPS16X1 125-C

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit High Speed CM OS SRAM DPS128M8CnY/BnY, DPS 128X8CA3/BA3 MICROSYSTEMS DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .


    OCR Scan     		PDF DPS128M8CnY/BnY, 128X8CA3/BA3 DPS128X8CA3/BA3 50-pin 30A097-31

    Untitled

    Abstract: No abstract text available
    Text: DPS129 □PM Dense-Pac Microsystems, Inc. ^ 16K X 8 CMOS SRAM MODULE NOT RECOMENDED FOR NEW DESIGNS D E S C R IP T IO N : The DPS 129 is a 16K X 8 Static Random Access Memory SRAM module using 8 C M O S 16K X 1 SRAMs. The memory utilizes asynchronous circuitry


    OCR Scan     		PDF DPS129 DPS129 30A002-01

    Untitled

    Abstract: No abstract text available
    Text: DPS 1152 □PM Dense-Pac Microsystems. Inc. 64K X 18 CMOS SRAM MODULE DESCRIPTION: The DPS1152 is a high-speed, lo w -po w er static RAM m odule com prised o f eighteen 64K X 1 m on olith ic SRAM's, and decou pling capacitors surface m ounted on a co-fired ceram ic substrate.


    OCR Scan     		PDF DPS1152 S1152 30A00606

    Untitled

    Abstract: No abstract text available
    Text: 2 Megabit CMOS SRAM D E N S E - P A C M ICRO SYSTEM S DPS128X16n3 DESCRIPTION: The DPS 128X16n3 SRAM '"STACK'7modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC . Available in straight leaded, "j" leaded


    OCR Scan     		PDF DPS128X16n3 128X16n3 50-pin DPS128X16n3 128Kx 120ns 150ns 30A097-02

    Untitled

    Abstract: No abstract text available
    Text: < f v D P S16X 16 16K X 16 CMOS SRAM MODULE DESCRIPTION: The DPS 16X16 is part o f a new family of high speed S tatic RAM m odules d e ve lo p e d by Dense-Pac Microsystems, Inc. The DPS16X16 uses advanced packaging concepts which mount four LCC memory devices on a single multilayer ceramic substrate. The


    OCR Scan     		PDF 16X16 DPS16X16 30A017-00 DPS16X16 30A017-00

    Untitled

    Abstract: No abstract text available
    Text: n 7 THIS DRAWING IS UNPUBLISHED. JÊL COPYRIGHT 19 RELEASED FOR PUBLICATION BY AMP INCORPORATED. 4 5 6 3 2 LOG , 19 ALL RIGHTS RESERVED. AD REVISIONS ïïT s t 47 DESCRIPTION 19JUN02 REVISED PER 0 5 1 2 - 0 1 3 7 - 02 NATERI AL H0U5ING CONTACT DPS RAP GREY


    OCR Scan     		PDF 19JUN02 08/5EP/98 ANDER50N/UT 08/SEP/98 amp26463/

    lem HA

    Abstract: 50-PIN dps128m8bny
    Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .


    OCR Scan     		PDF DPS128M8CnY/BnY, DPS128X8CA3/BA3 128M8CnY/BnY, 28X8CA3/BA3 50-pin California92841-1428 OA097-31 lem HA dps128m8bny

    c040

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 16 Megabit High Speed C M O S SRAM 1 DPS M X 16 M K n 3 SLCC Stack D E S C R IP T IO N : The D PS1M X16M K n3 High Speed S R A M "S T A C K " modules area re volu tion ary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.


    OCR Scan     		PDF 16-Megabits 500mV 30A129-04 c040

    74S132

    Abstract: AD346 AD585 long range gold detector circuit diagram FL 14-12
    Text: High Speed SUMMING PT AD346 Fast 2 .0 | a s Acquisition Tim e to ± 0 . 01 % Low Droop Rate: 0.5m V/m s Low Offset Low Glitch: < 4 0 m V Aperture Jitter: 40 Dps Extended Tem perature Range: -5 5 ° C to + 125°C internal Hold Capacitor HOLD TTL LOGIC REF REF OUT


    OCR Scan     		PDF AD346 400ps AD585 32-Pin -100ns 350ns; 250ns 750ns 74S132 AD585 long range gold detector circuit diagram FL 14-12