DPS256 Search Results

Contextual Info: DPS256P8 Dense-Pac Microsystems. Inc. 256K X 8 CMOS SRAM MODULE O DESCRIPTION: The DPS256P8 is a fully static asynchronous Static Random Access M em o ry SRAM and is organized as 256KX8. The m odule consists o f eight 32K X 8 C M O S SRAMs surface m ounted to an epoxy lam inate (FR4) substrate.

Contextual Info: DPS256S8AN Dense-Pac Microsystems, Inc. O HIGH SPEED MILITARY 256K X 8 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256S8AN is a high speed military 256K X 8 high-density, low-power static RAM module comprised of two high speed ceramic 128K X 8 monolithic

Contextual Info: ^ f= ¡| j¡ñ ¡P > 'v.:. U DPS256X32AV3 ^ l v l Dense-Pac Microsystems, In c ^ y _ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK w ADVANCED INFORMATION DESCRIPTION: The D PS2 5 6 X3 2 A V 3 "V E R SA -ST A C K " module is a revolutionary new high speed memory subsystem

Contextual Info: □PM DPS256S8P Dense-Pac Microsystems, Inc. 256K X 8 CMOS SRAM MODULE O DESCRIPTION: The D P S256 S8P is a 256K X 8 high-density, low-power static RAM module comprised of two 1 2 8 K X 8 m o no lithic SR A M 's, an advanced high-speed C M O S d e co d er and deco upling

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256C32BV3 DESCRIPTION: The DPS256C32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

50-PIN

Abstract: DPS256X
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CM OS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "S T A C K " modules are a revolutionarynew memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " j " leaded

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Abstract: SH 05.22 DPS256X36L AL154
Contextual Info: D E N S E - P A 9 Megabit CMOS SRAM C MICROSYSTEMS DPS256X36L PRELIM ÎNARY D E S C R IP T IO N : The DPS256X36L is a 25 6K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

sRAM 2116

Abstract: DPS256P8-100C DPS256P8-120C DPS256P8-150C STATIC RAM 2114
Contextual Info: DENSE-PAC M I C ROS YS TE MS 07E D | S T S ^ I S Dense~Pac Microsystems, ine. DDDDlbM 2 |~~ DPS256P8 CMOS SRAM 25 6K X -PRELIMINARY- D E S C R IP T IO N : The DPS256P8 is a fully static asynchronous Random Access Memory SRAM and is organized as 128Kx 8.

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM MICROSYSTEMS DPS256X32L/DPS256X32W D ES C R IP T IO N : T he D PS256X32L/DPS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM m odule, intended for high performance computers and digital signal processing applications.

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: 8 Megabit CMOS SRAM D E N S E -P A C MICROSYSTEMS DPS256X32L/DPS256X32W DESCRIPTION: The DPS256X32L/DPS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing applications.

Contextual Info: DENSE-PAC MICROSYSTEMS 2 Megabit CMOS SRAM DPS256S8P/DPS256S8PL/DPS256S8PLL DESCRIPTION: The DPS256S8P/PL/PLL is a 256K x 8 high-density, low-power static RAM module comprised of two 128K x 8 monolithic SRAM's, an advanced high-speed CMOS decoder and decoupling capacitors surface

Contextual Info: DENSE-PAC MICROSYSTEMS 2 Megabit High Speed C M O S SRAM DPS256S8EJ4/EL4/RJ4/RL4 DESCRIPTION: The DPS256S8EJ4/EL4/RJ4/RL4 surface mount SR A M modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines two

Contextual Info: 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The DPS256X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: 2 Megabit High Speed CMOS SRAM DPS256S8BN DESCRIPTION: The DPS256S8BN is a high speed military 256K x 8 high-density, static RAM module comprised of two high speed ceramic 128K x 8 monolithic SRAM’s, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic

Contextual Info: 2 Megabit High Speed CMOS SRAM DPS256S8AP DESCRIPTION: The DPS256S8AP is a high speed 512K x 8 high-density, low-power static RAM module comprised of two high speed ceramic 128K x 8 monolithic SRAM’s, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted

Contextual Info: 1Mx9/512Kx18/256Kx36, 20 - 45ns, ZIP 30A104-10 A 9 Megabit CMOS SRAM DPS256S36LK PRELIMINARY DESCRIPTION: The DPS256S36LK is a 256K X 36 high-density, low-power static RAM module comprised of eight 128Kx8 and four 256Kx4 monolithic SRAM’s, an advanced high-speed CMOS decoder, resistor network

Contextual Info: DPS256X32AV3 Dense-Pac Microsystems. Inc. ~ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK PRELIMINARY D ESC RIPTIO N : The D PS25 6X32 A V3 "V E R S A - S T A C K " m odule is a revolutionary n e w high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "STACK" modules are a revolutionarynew memory subsystem using Dense-PacMicrosystems'ceramicStackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded

Contextual Info: 9 Megabit CMOS SRAM DPS256S36L M ICRO SYSTEM S PRELIMINARY DESCRIPTION: The DPS256S36L is a 256K X 36 high-density, Iow-power static RAM module comprised of eight 128K X 9 monolithic SRAM's, an advanced high-speed CMOS decoder, resistor network and decoupling capacitors

Contextual Info: DENSE-PAC MICROSYSTEMS 9 Megabit CMOS SRAM DPS256X36L PRELIM INARY DESCRIPTION: The DPS256X36L is a 256K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

Contextual Info: □PM DPS256X16A3 Dense-Pac Microsystems, Ina O CERAMIC 256K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC mounted on a