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DPAC TECHNOLOGIES CORP. DPS256X32V3-85B
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	DPS256X32V3-85B		1			1 $12.2454 10 $12.2454 100 $12.2454 1000 $12.2454 10000 $12.2454	Buy Now

DPS256X32V3 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The DPS256X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8	Original	PDF	DPS256X32V3 DPS256X32V3 32LOW 30A044-00
Untitled Abstract: No abstract text available Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8	OCR Scan	PDF	DPS256X32V3 PS256X32V DPS256X32V3 100ns 120ns 150ns 30A044-00
Untitled Abstract: No abstract text available Text: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic	OCR Scan	PDF	DPS256X32V3 DPS256X32V3
Untitled Abstract: No abstract text available Text: □PM DPS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless	OCR Scan	PDF	DPS256X32V3 PS256X32V3 DPS256X32V3 30A04400
180x32 Abstract: No abstract text available Text: DENSE-PAC 8 Megabit CMOS SRAM M ICROSYST E M S DPS256X32V3 DESCRIPTION: The D PS256X32V3 "V E R S A -S T A C K ” m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8	OCR Scan	PDF	DPS256X32V3 DPS256X32V3 120ns 180x32
Untitled Abstract: No abstract text available Text: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 D E SC R IPT IO N : The DPS256X32V3 "VERSA -STAC K" module is a r e v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic	OCR Scan	PDF	DPS256X32V3 DPS256X32V3 128Kx8 30a044-00
Untitled Abstract: No abstract text available Text: □PM Dense-Pac Microsystems. Inc. DPS256X32V3 CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m od ule is a r e v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless	OCR Scan	PDF	DPS256X32V3 DPS256X32V3 30A044-00
A16E Abstract: No abstract text available Text: DPS256X32V3 □PM Dense-Pac Microsystems, Inc. CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS256X32V3 "VERSA-STACK" m od ule is a re v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless	OCR Scan	PDF	DPS256X32V3 PS256X32V3 DPS256X32V3 30A04400 A16E
afa75 Abstract: No abstract text available Text: DPS256X32V3 Dense-Pac Microsystems. Inc. ^ CERAMIC 256K X 32 CM OS SRAM VERSA-STACK PRELIMINARY DESCRIPTION: The DPS256X32V3 "VER SA-STAC K" m o d u le is a r e v o lu t io n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless	OCR Scan	PDF	DPS256X32V3 DPS256X32V3 30A04400 afa75
DP5Z Abstract: No abstract text available Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS	OCR Scan	PDF	128Kx8, 64Kx16, 256Kx8, 384Kx8, DP5Z