Untitled
Abstract: No abstract text available
Text: 8 Megabit High Speed CMOS SRAM DPS512X16MKn3 DESCRIPTION: The DPS512X16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded
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DPS512X16MKn3
DPS512X16MKn3
500mV
30A129-02
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Untitled
Abstract: No abstract text available
Text: PAC M IC R OS Y ST 8 Megabit High Speed CMOS SRAM HMS DPS512X16MKn3 DESCRIPTION: The DPS512X16MKn3 High Speed SRAM "STACK7' modules are a revolutio n a ry new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .
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OCR Scan
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PDF
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DPS512X16MKn3
DPS512X16MKn3
500mV
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Untitled
Abstract: No abstract text available
Text: 8 Megabit High Speed CMOS SRAM D E N S E -P A C MICROSYSTEMS DPS512X16MKn3 D ESCRIPTIO N : The DPS512X16MKn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.
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OCR Scan
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PDF
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DPS512X16MKn3
DPS512X16MKn3
500mV
30A12942
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til 31a
Abstract: Dense-Pac Microsystems
Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM M i C R. O S Y S T E M S DPS512X16MKn3 DESCRIPTION: The DPS512X16MKn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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PDF
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DPS512X16MKn3
DPS512X16MKn3
500mV
30A129-02
til 31a
Dense-Pac Microsystems
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