DQ06 Search Results
DQ06 Price and Stock
SMC Diode Solutions 10DQ06DIODE SCHOTTKY 60V 1A DO41 |
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10DQ06 | Cut Tape | 4,945 | 1 |
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SMC Diode Solutions 31DQ06DIODE SCHOTTKY 60V 3.3A DO201AD |
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31DQ06 | Cut Tape | 4,574 | 1 |
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SMC Diode Solutions 11DQ06DIODE SCHOTTKY 60V 1.1A DO41 |
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11DQ06 | Ammo Pack | 5,000 |
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Vishay Semiconductors VS-11DQ06DIODE SCHOTTKY 60V 1.1A DO204AL |
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Vishay Semiconductors VS-31DQ06DIODE SCHOTTKY 60V 3.3A C16 |
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DQ06 Datasheets Context Search
Catalog Datasheet |
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Contextual Info: TO SHIBA THMY644071EG-10 TENTATIVE TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT 4,194,304-WORD BY 64-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY644071EG is a 4,194,304-word by 64-bit synchronous dynamic RAM module consisting of four TC59S6416FT DRAMs and an unbuffer on a printed circuit board. |
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THMY644071EG-10 304-WORD 64-BIT THMY644071EG TC59S6416FT THMY644071 | |
r2a3
Abstract: r1a10 M1367 M4589
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THMY728010BEG-80L THMY728010BEG 608-word 72-bit TC59S6408BFTL 72-bit r2a3 r1a10 M1367 M4589 | |
AS8S512K3Contextual Info: ADVANCED iPEM 64 Mb ASYNC SRAM AS8S2M32PEC 64Mb, 2Mx32 CMOS 3.3V, High Speed Static RAM Integrated Plastic Encapsulated Microcircuit FEATURES DESCRIPTION Integrated Real-Time Memory Array Solution No latency or refresh cycles Parallel Read/Write Interface |
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AS8S2M32PEC 2Mx32 M0-47AE AS8S2M32 AS8S2M32PEC AS8S512K3 | |
Contextual Info: . IBM13M64734CCA 64M x 72 2-Bank Registered/Buffered SDRAM Module Features • 168-Pin Registered 8-Byte Dual In-Line Memory Module • 64Mx72 Synchronous DRAM DIMM • Performance: -260 Device Latency fCK Clock Frequency tAC Clock Access Time 2 -360 -360 Units |
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IBM13M64734CCA 168-Pin 64Mx72 66/100MHz PC100 09K3884 F38744 | |
Contextual Info: . IBM13M16734JCA 16M x 72 1 Bank Registered/Buffered SDRAM Module Features • 168-Pin Registered 8-Byte Dual In-Line Memory Module • 16Mx72 Synchronous DRAM DIMM • Performance: Device Latency Clock Frequency Clock Access Time -260 -360 -360 Units 2 2 |
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IBM13M16734JCA 168-Pin 16Mx72 66/100MHz PC100 06K2880 H01193 | |
16Mx8
Abstract: pc133 SDRAM DIMM W9D332647LA-333 079R 32X64 32X64 144 pin
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W9D332647LA-333 32Mx64 168-pin PC-133 16Mx8 400-mil TSOPII-54 12-row, 10-column, pc133 SDRAM DIMM 079R 32X64 32X64 144 pin | |
Memory
Abstract: FTS8L32512V
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FTS8L32512V 512Kx32 FTS8L32512V ADSP-21060L ADSP-21062L TMS320LC31 MPC860 512Kx8, FTI8K32512V Memory | |
MH64S64APFH-5Contextual Info: Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH64S64APFH-5,-5L,-6,-6L,-7,-7L 4294967296-BIT 67108864 - WORD BY 64-BIT SynchronousDRAM DESCRIPTION The MH64S64APFH is 67108864 - word by 64-bit Synchronous DRAM module. This consists of |
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MH64S64APFH-5 4294967296-BIT 64-BIT MH64S64APFH 64-bit 32Mx8 MIT-DS-0392-0 | |
MH32D64AKQJ-75Contextual Info: Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH32D64AKQJ-75,-10 2,147,483,684-BIT 33,554,432-WORD BY 64-BIT Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. |
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MH32D64AKQJ-75 684-BIT 432-WORD 64-BIT) MH32D64AKQJ 64-bit 133MHz. 100MHz 133MHz | |
MH32S72APHBContextual Info: Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH32S72APHB -5,-6,-7 2,415,919,104-BIT 33,554,432 - WORD BY 72-BIT Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of |
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MH32S72APHB 104-BIT 72-BIT 72-bit 16Mx8 94pin 10pin 95pin 85pin | |
ya 741
Abstract: sta 741 a
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MH16S64APHB 824-BIT 64-BIT 64-bit 16Mx8 94pin 10pin 95pin 85pin ya 741 sta 741 a | |
CL333Contextual Info: Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH64S72AWJA -5, -6,-7 4,831,838,208-BIT 67,108,864-WORD BY 72-BIT Synchronous DYNAMIC RAM DESCRIPTION The MH64S72AWJA is 67108864 - word x 72-bit Sy nchronous DRAM module. This consist of t hirty -six |
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MH64S72AWJA 208-BIT 864-WORD 72-BIT 10pin 95pin 11pin 124pin CL333 | |
128*64
Abstract: transistor GW 93 H GW 94 H
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EDI2KG464128V 4x128Kx64, 4x128Kx64 EDI2KG64128VxxD 01581USA EDI2KG464128V 128*64 transistor GW 93 H GW 94 H | |
LM2576 step up converter
Abstract: LM2576-ADJ*. Circuit Diagram using this IC LM2576-ADJ LM2576 BOOST CONVERTER 671 27000 lm2576 charge LM2576-3.3 PE108 lm2574 constant current LM2576
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LM2576/D LM2576 LM2576 LM2576 step up converter LM2576-ADJ*. Circuit Diagram using this IC LM2576-ADJ LM2576 BOOST CONVERTER 671 27000 lm2576 charge LM2576-3.3 PE108 lm2574 constant current | |
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Contextual Info: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s Differential clock terminations included |
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W3J512M64K-XPBX W3J512M64K-XLBX | |
Contextual Info: Mobile 3rd Generation Intel Core Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet, Volume 1 of 2 June 2013 Document Number: 326768-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, |
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Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s Differential clock terminations included |
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W3J512M64G-XPBX W3J512M64G-XLBX | |
Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s Differential clock terminations included |
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W3J512M64G-XPBX W3J512M64G-XLBX | |
EDI2AG272129V
Abstract: GW CSSRM1.PC-MFNQ-5C7E-1-700-R18
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EDI2AG272129V 2x128Kx72, 2x128Kx72 EDI2AG272129VxxD1 2x128Kx72. 14mmx20mm s129V EDI2AG272129V85D1* EDI2AG272129V9D1* EDI2AG272129V10D1 EDI2AG272129V GW CSSRM1.PC-MFNQ-5C7E-1-700-R18 | |
Contextual Info: EDI2GG418128V 4x128Kx18, 3.3V Synchronous Flow-Through SRAM CARD EDGE DIMM FEATURES • 4x128Kx18 Synchronous The EDI2GG418128VxxD2 is a Synchronous SRAM, 60 position Card Edge; DIMM 120 contacts module, organized as 4x128Kx64. The module contains four (4) Synchronous Burst Ram Devices, |
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EDI2GG418128V 4x128Kx18, 4x128Kx18 EDI2GG418128VxxD2 4x128Kx64. 14mmx20mm EDI2GG418128V95D* EDI2GG418128V10D* 4x128Kx18 | |
DIMM_200Contextual Info: EDI2GG46464V 4x64Kx64, 3.3V Synchronous SRAM CARD EDGE DIMM FEATURES • 4x64Kx64 Synchronous The EDI2GG46464VxxD is a Synchronous SRAM, 60 position Dual Key; Card Edge DIMM 120 contacts Module, organized as 4x64Kx64. The Module contains eight (8) Synchronous Burst |
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EDI2GG46464V 4x64Kx64, 4x64Kx64 EDI2GG46464VxxD 4x64Kx64. 14mmx20mm EDI2GG46464V95D* EDI2GG46464V10D EDI2GG46464V11D EDI2GG46464V12D DIMM_200 | |
EDI2CG472128VContextual Info: EDI2CG472128V 4x128Kx72, 3.3V Sync/Sync Burst SRAM Dual Key DIMM FEATURES • 4x128Kx72 Synchronous, Synchronous Burst The EDI2CG472128VxxD2 is a Synchronous/Synchronous Burst SRAM, 84 position Dual Key; Double High DIMM 168 contacts Module, organized as 4x128Kx72. The Module contains eight (8) |
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EDI2CG472128V 4x128Kx72, 4x128Kx72 EDI2CG472128VxxD2 4x128Kx72. 14mmx20mm devic168 EDI2CG472128V85D2* EDI2CG472128V10D2* EDI2CG472128V12D2 EDI2CG472128V | |
AN 7580
Abstract: TC59WM815BFT
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THMD12E11 216-WORD 72-BIT THMD12E11B TC59WM815BFT 72-bit AN 7580 | |
Contextual Info: EDI8F32123C ^ E D I ELECTRONIC DESIGNS, N C .I 128Kx32 Battery Backed SRAM Module ADVANCED Features 128Kx32 bit CMOS Static Random Access Memory with on-board battery backup 128Kx32 Static RAM CMOS, High Speed Module The EDI8F32123C is a 4 megabit Battery Backed SRAM |
OCR Scan |
EDI8F32123C 128Kx32 EDI8F32123C 128Kx 128Kx8 EDI8F32123C70MMC EDI8F32123C85MMC EDBF32123C |