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    DRYPACKED DEVICES Search Results

    DRYPACKED DEVICES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4204F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation

    DRYPACKED DEVICES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AN1260

    Abstract: A112 A113
    Text: MOTOROLA Order this document by AN1260/D SEMICONDUCTOR TECHNICAL DATA AN1260 Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown INTRODUCTION This information provides Motorola customers with the


    Original     		PDF AN1260/D AN1260 AN1260/D* AN1260 A112 A113

    JEDEC J-STD-020d.1

    Abstract: JESD625-a AND8003 12MSB17722C JEDEC J-STD-033b.1 jedec JESD625-a AND8003/D APPLICATION note JESD625 J-STD-020d.1 JEDEC J-STD-020d
    Text: AND8003/D Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown Revised by J. Guzman−Guevarra http://onsemi.com APPLICATION NOTE INTRODUCTION The Humidity Indicator Card provides the customer with a


    Original     		PDF AND8003/D JEDEC J-STD-020d.1 JESD625-a AND8003 12MSB17722C JEDEC J-STD-033b.1 jedec JESD625-a AND8003/D APPLICATION note JESD625 J-STD-020d.1 JEDEC J-STD-020d

    and8003

    Abstract: A112 A113 resistance ALUMINUM
    Text: AND8003/D Storage and Handling of Drypacked Surface Mounted Devices SMD http://onsemi.com Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown APPLICATION NOTE INTRODUCTION The desiccant packed in each bag will keep the internal humidity level below 20% RH for at least one year, under


    Original     		PDF AND8003/D r14153 and8003 A112 A113 resistance ALUMINUM

    TB1334FG

    Abstract: TC90517FG TB1334 TB2926 tc94a92fg TC90517 tc90517fg toshiba tb31224cf tc94a34fg TB31371
    Text: SEMICONDUCTOR GENERAL CATALOG ASSPs Audio & Video Equipment ICs Communications Equipment ICs Radio-Frequency Power Amp ICs Automotive ICs Display Driver ICs Peripheral Equipment LSIs Other Consumer Product ICs 1 2009-8 SCE0004I Audio & Video Equipment ICs


    Original     		PDF SCE0004I TB1334FG HQFP64-P-1010-0 TC90196AFG LQFP208-P-2828-0 TC90192FG TC90192XBG P-FBGA265-1515-0 TB1334FG TC90517FG TB1334 TB2926 tc94a92fg TC90517 tc90517fg toshiba tb31224cf tc94a34fg TB31371

    TMPA8891

    Abstract: TB1334FG TMPA8893 TB32160AFG TB1334 TMPA8897PSCNG TB1318FG TB32302fg TA8275HQ TMPA8879
    Text: ASSPs Audio & Video Equipment ICs z 66 Communications Equipment ICs z 78 Radio-Frequency Power Amp ICs z 81 Automotive ICs z 82 Display Driver ICs z 83 Network & Interface ICs z 86 Peripheral Equipment LSIs z 87 Other Consumer Product ICs z 88 65 Audio & Video Equipment ICs


    Original     		PDF TMPA8873CxCNG TMPA8879CxCNG TMPA8891CxCNG TMPA8893CxCNG TMPA8897CxCNG TMPA8899CxCNG TMPA8863CxNG TMPA8869CxNG TMPA8873PSCNG TMPA8879PSCNG TMPA8891 TB1334FG TMPA8893 TB32160AFG TB1334 TMPA8897PSCNG TB1318FG TB32302fg TA8275HQ TMPA8879

    TCD2959BFG

    Abstract: TCD1709DG TCD2964BFG TCD2713DG TCD2716DG tcd2563bfg TCD1708DG tcd2704dg-1 TCD2955BFG TCD2959
    Text: Sensors/Image Pickup Devices Photosensors z 272 Image Sensors z 276 271 Photosensors Infrared LEDs and Visible LEDs for Sensor Light Sources Electrical/Optical Characteristics Ta = 25°C Part Number with Rank Part Number TLN108(F) TLN201(F) TLN105B(F) TLN110(F)


    Original     		PDF O-18CAN ET8E99-AS TCD2959BFG TCD1709DG TCD2964BFG TCD2713DG TCD2716DG tcd2563bfg TCD1708DG tcd2704dg-1 TCD2955BFG TCD2959

    TC90517FG

    Abstract: TB2956HQ TB2915 TB2939hq tc90517fg toshiba TC94A92FG TB9061FNG tc94a81ug TB32302fg TC90517
    Text: SEMICONDUCTOR GENERAL CATALOG ASSPs Audio & Video Equipment ICs Communications Equipment ICs Automotive ICs Peripheral Equipment LSIs Other Consumer Product ICs 1 2010/9 SCE0004K Audio & Video Equipment ICs TV Set ICs Audio Output ICs Part Number TB2922HQ


    Original     		PDF SCE0004 TB2922HQ TB2924AFG TB2964FTG P-HZIP12-1 P-HSOP36-450-0 P-QFN48-0707-0 TC90517FG TB2956HQ TB2915 TB2939hq tc90517fg toshiba TC94A92FG TB9061FNG tc94a81ug TB32302fg TC90517

    Untitled

    Abstract: No abstract text available
    Text: USS810 USB 2.0 Full-Speed/Low-Speed Transceiver Product Brief Features „ „ „ „ „ „ „ „ Complies with Universal Serial Bus Specification Rev. 2.0. Can be used as a USB device transceiver or a USB host transceiver. Supports full-speed 12 Mbits/s and low-speed


    Original     		PDF USS810 MLCC16 USS810 PB06-049CMPR

    squib driver

    Abstract: TPD7001BF TPD1033F tpd2007f mosfet switch TPD2005F TPD7203F
    Text: Low-voltage intelligent power devices Product No. Use / Function TPD1008SA TPD1009S High-side switch TPD1011S High-side switch TPD1018F High-side switch TPD1024S Low-side switch TPD1024AS Low-side switch TPD1028AS Low-side switch TPD1030F 2-ch low-side switch


    Original     		PDF TPD1008SA squib driver TPD7001BF TPD1033F tpd2007f mosfet switch TPD2005F TPD7203F

    tcm9200md

    Abstract: TCD1254GFG TCD2964bfg TCD2916BFG TCD2717BFG TCD2564 TCD2712DG TCM9001MD tcd2564dg tcd2563bfg
    Text: SEMICONDUCTOR GENERAL CATALOG Sensors/Image Pickup Devices Photosensors Image Sensors Magnetic Sensors 1 2010/9 SCE0004K Photosensors Infrared LEDs and Visible LEDs for Sensor Light Sources Electrical/Optical Characteristics Ta = 25°C Part Number with Rank


    Original     		PDF 2010/9SCE0004K O-18CAN TLN115A tcm9200md TCD1254GFG TCD2964bfg TCD2916BFG TCD2717BFG TCD2564 TCD2712DG TCM9001MD tcd2564dg tcd2563bfg

    TMP94FD53IF

    Abstract: tmp95c265f BM93CM40F0C-M15 TMP47E186M tmp47c422n TMP86CP11AN TMP88CS34F BM11171 TMP87CH46N tmp96c141bf
    Text: Microcomputer & Peripheral LSIs 4-Bit Microcontrollers z 16 8-Bit Microcontrollers z 18 16-Bit Microcontrollers z 24 32-Bit Microcontrollers z 27 16-Bit Microcontrollers for Automotive z 28 32-Bit Microcontrollers for Automotive z 28 8-Bit Microcontrollers for Automotive z 29


    Original     		PDF 16-Bit 32-Bit 64-Bit TLCS-47E TMP47C101P/M TMP47C102P/M TMP47C103N/M TMP94FD53IF tmp95c265f BM93CM40F0C-M15 TMP47E186M tmp47c422n TMP86CP11AN TMP88CS34F BM11171 TMP87CH46N tmp96c141bf

    G004

    Abstract: ipc-sm-786A MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-786 research and development procedure in electronics industry P-21373
    Text: MOISTURE CONTROL MEASURES for Epoxy Encapsulated Surface Mount Magnetic Components Extending Pulse’s Commitment to a Quality Partnership 1996, Pulse Engineering, Inc. G004 EXECUTIVE SUMMARY The Situation Over the past decade, the transition from through-hole to SMT production techniques has revealed quality


    Original     		PDF

    TMP94C251AFG

    Abstract: TMP88ps49ng TMP88PH47NG TMP47C440BNG TMP87pm20fg TMP95C265FG TMP88CM49NG TMP87CM40ang TMP47P860VNG TMP88PH47FG
    Text: Microcomputers 4-Bit Microcontrollers z 3 8-Bit Microcontrollers z 4 16-Bit Microcontrollers z 10 32-Bit Microcontrollers z 13 8-Bit Microcontrollers for Automotive z 14 16-Bit Microcontrollers for Automotive z 16 32-Bit Microcontrollers for Automotive z 16


    Original     		PDF 16-Bit 32-Bit 64-Bit TMP1962C10BXBG PN120013) PN210022) TMP94C251AFG TMP88ps49ng TMP88PH47NG TMP47C440BNG TMP87pm20fg TMP95C265FG TMP88CM49NG TMP87CM40ang TMP47P860VNG TMP88PH47FG

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    ULN2003APG china

    Abstract: tb62216 TB62216FG TC7600FNG TC62D722 ULN2803APG ULN2003APG IC CONNECTION TCV7106 TB62214 TPD1053F
    Text: SEMICONDUCTOR GENERAL CATALOG General-Purpose Linear ICs Operational Amplifier ICs Op Amp ICs & Comparator ICs Analog Switch Intelligent Power Devices (IPDs) Interface Drivers Motor Drivers LED Driver ICs Power Supply ICs Small-Signal MMICs (Radio-Frequency Cell Packs)


    Original     		PDF 2010/9SCE0004K TA75S393F TA75S01F ULN2003APG china tb62216 TB62216FG TC7600FNG TC62D722 ULN2803APG ULN2003APG IC CONNECTION TCV7106 TB62214 TPD1053F

    TST-9100

    Abstract: TST-9000 transformer dash 2 b-5 TST-9102 TST-9112 TST-9106 TST-9107 TST-9104 TST-9117 IPC-9503
    Text: TST-9100 SERIES A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com TWIN-STACKED, 0.320" MAXIMUM HEIGHT, 1553 TRANSFORMERS CONSERVE BOARD SPACE FEATURES DESCRIPTION AND APPLICATIONS


    Original     		PDF TST-9100 MIL-STD-1553A MIL-STD-1553 F-01/08-0 TST-9000 transformer dash 2 b-5 TST-9102 TST-9112 TST-9106 TST-9107 TST-9104 TST-9117 IPC-9503

    TCD2964BFG

    Abstract: TCD2716DG TCD1254GFG tcd2563bfg TCD1103GFG TCD2964 tcd2564dg TCD2712DG tcd2563 TCD2717BFG
    Text: SEMICONDUCTOR GENERAL CATALOG Sensors/Image Pickup Devices Photosensors Image Sensors Magnetic Sensors 1 2009-8 SCE0004I Photosensors Infrared LEDs and Visible LEDs for Sensor Light Sources Electrical/Optical Characteristics Ta = 25°C Part Number with Rank


    Original     		PDF SCE0004I O-18CAN TCD2964BFG TCD2716DG TCD1254GFG tcd2563bfg TCD1103GFG TCD2964 tcd2564dg TCD2712DG tcd2563 TCD2717BFG

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    tb62506fg

    Abstract: TB62207BFG tb62506 TB62207 ULN2803APG ULN2003APG toshiba uln2803apg TPD1047F ULN2003APG motor TB62201AFG
    Text: General-Purpose Linear ICs Operational Amplifier ICs Op Amp ICs & Comparator ICs z 118 Intelligent Power Devices (IPDs) z 121 Interface Drivers z 124 Motor Drivers z 127 Power Supply ICs z 132 Small-Signal MMICs (Radio-Frequency Cell Packs) z 142 117 Operational Amplifier ICs (Op Amp ICs) & Comparator ICs


    Original     		PDF TA75S393F TA75S01F TB7600CTC/TU TB7601CTC/TU TB7602CTC/TU TA4107F 12dBmW tb62506fg TB62207BFG tb62506 TB62207 ULN2803APG ULN2003APG toshiba uln2803apg TPD1047F ULN2003APG motor TB62201AFG

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    tlp 1205 1553

    Abstract: TLP-1115 dielectric tlp 16 tlp 1205 transformer TLP-1112 TLP1005 tlp 1005 1553 transformer IPC-9503 tlp 1005 transformer tlp1012
    Text: TLP-1000 SERIES A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com TWIN LOW-PROFILE 0.155" MAXIMUM HEIGHT MIL-STD-1553 TRANSFORMERS FEATURES DESCRIPTION AND APPLICATIONS


    Original     		PDF TLP-1000 MIL-STD-1553 MIL-STD-1553, MIL-STD-1553A D-01/05-0 tlp 1205 1553 TLP-1115 dielectric tlp 16 tlp 1205 transformer TLP-1112 TLP1005 tlp 1005 1553 transformer IPC-9503 tlp 1005 transformer tlp1012

    mlp-2005

    Abstract: No abstract text available
    Text: A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com MLP-2000 SERIES MINIATURE LOW-PROFILE 0.185" MAXIMUM HEIGHT MIL-STD-1553 SMT TRANSFORMERS FEATURES • New! 3.3V Ratio: MLP-2033, 2233


    Original     		PDF MLP-2000 MIL-STD-1553 MLP-2033, MIL-STD-1553, MLP-2000 K-03/10-0 mlp-2005

    DRFM

    Abstract: No abstract text available
    Text: Data Sheet, Rev. 4 December 2005 USS810 USB 2.0 Full-Speed/Low-Speed Transceiver 1 Features „ Complies with Universal Serial Bus Specification Rev. 2.0. „ Can be used as a USB device transceiver or a USB host transceiver. „ Supports full-speed 12 Mbits/s and low-speed


    Original     		PDF USS810 DS05-035CMPR-4 DS05-035CMPR-3) DRFM

    JEDEC J-STD-033

    Abstract: J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 MIL-PRF-81705D molecular sieve F-1249 D-3464 D-3464D
    Text: ‹ Chapter 9 Dry Packing CHAPTER 9 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products Packages and Packing Methodologies Handbook 1 March 2008 9-1 ‹ Chapter 9 Dry Packing


    Original     		PDF