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    Microchip Technology Inc CDS5311UR-1-TR

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    DS531 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    8132

    Abstract: passivation DS5003
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: July 11, 1994 To: Subject: PRODUCT CHANGE NOTICE – F42101 Description: DS500X/DS53XX Passivation Change The DS500X and DS53XX products (DS5001, DS5002, DS5003, DS5004, DS5311, DS5340) will undergo a change in passivation from the current single layer 10 KA Hotwall OXIDE passivation to a 10


    Original     		PDF F42101 DS500X/DS53XX DS500X DS53XX DS5001, DS5002, DS5003, DS5004, DS5311, DS5340) 8132 passivation DS5003

    Untitled

    Abstract: No abstract text available
    Text: Fremont Micro Devices FT531xx Ultra Low Noise, High PSRR, 250mA LDO FEATURES DESCRIPTION ¾ Ultra-Low Noise for RF Application The FT531xx is designed for portable RF and ¾ Ultra-Fast Response in Line/Load Transient wireless applications with demanding performance


    Original     		PDF FT531xx 250mA FT531xx 100uS) 120mV 100mA DS531-A8

    SHA-256 Cryptographic Accelerator

    Abstract: verilog code for 128 bit AES encryption CS5311 SHA-1 using vhdl SHA-256 verilog code for 8 bit AES encryption verilog code for aes encryption SHA-512 SHA256 verilog code for 32 bit AES encryption
    Text: CS5310/11/12 Standard Hash Algorithm SHA-1 & SHA-2 Cores TM Virtual Components for the Converging World The CS5310/11/12 Hashing Cores are designed to achieve data authentication in digital broadband, wireless, and multimedia systems. These high performance application specific silicon cores support the Secure Hash


    Original     		PDF CS5310/11/12 CS5310/11/12 CS5310 CS5311 SHA-256 DS5310 SHA-256 Cryptographic Accelerator verilog code for 128 bit AES encryption SHA-1 using vhdl verilog code for 8 bit AES encryption verilog code for aes encryption SHA-512 SHA256 verilog code for 32 bit AES encryption

    2a27

    Abstract: 23A13 2464Y 41A32 443A
    Text: 16M x 64 Bit 3.3V BUFFERED EDO DIMM Extended Data Out EDO DRAM DIMM 6416AsEDM4G18TK 168 Pin 16Mx64 EDO DIMM Buffered, 4k Refresh, 3.3V Pin Assignment General Description The 6416AsEDM4G18TK is a 16Mx64 bit, 18 chip, 3.3V, 168 Pin DIMM module consisting of (16)


    Original     		PDF 6416AsEDM4G18TK 16Mx64 DS531-0 2a27 23A13 2464Y 41A32 443A

    aspi-024-aspi-s402

    Abstract: ML510 xilinx mig user interface design VIRTEX-5 DDR2 VIRTEX-5 DDR2 controller virtex ml510 xc5vlx130t ChipScope XAPP778 XPS IIC
    Text: ML510 MIG Design Creation Using ISE 11.1, MIG 3.0 and ChipScope™ Pro 11.1 May 2009 Overview ƒ Hardware Setup ƒ Software Requirements ƒ CORE Generator™ software – Memory Interface Generator MIG ƒ Modify Design – Add ChipScope Pro Cores to Design


    Original     		PDF ML510 ML510 DS694 com/ml510 UG356 aspi-024-aspi-s402 xilinx mig user interface design VIRTEX-5 DDR2 VIRTEX-5 DDR2 controller virtex ml510 xc5vlx130t ChipScope XAPP778 XPS IIC

    Untitled

    Abstract: No abstract text available
    Text: 8M x 64 Bit 3.3V BUFFERED EDO DIMM Extended Data Out EDO DRAM DIMM 6480AsEDM4G10TK 168 Pin 8Mx64 EDO DIMM Buffered, 4k Refresh, 3.3V Pin Assignment General Description The 6480AsEDM4G10TK is a 8Mx64 bit, 10 chip, 3.3V, 168 Pin DIMM module consisting of (8) 8Mx8


    Original     		PDF 6480AsEDM4G10TK 8Mx64 DS531-1

    2N5640

    Abstract: 2N5640 MOTOROLA 2N5638 2N5639 2N5639 MOTOROLA motorola 2N5639
    Text: 2N5638 2N5639 2N5640 ● I N-CHANNEL JUNCTION FIELD-EFFECT TRANSISTORS . . . depletion mode Type A Junction Field-Effect designed for chopper and high-speed switching @ Low Drain-Source “ON” rds(o”) = Resistance Transistors applications. — 30 Ohms (2 N5638)


    Original     		PDF 2N5638 2N5639 2N5640 N5638) N5639) N5640) 2N5640 2N5640 MOTOROLA 2N5638 2N5639 2N5639 MOTOROLA motorola 2N5639

    DS1235YW

    Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
    Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885


    Original     		PDF DS87520 DS87523 DS87530 DS2118 DS1302 DS1315 DS17485 DS1721 DS83CH20 DS1235YW ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A

    SGMII RGMII bridge

    Abstract: RTL code for ethernet 802.3-2005 RGMII to SGMII Bridge UG368 1000BASE-X Ethernet-MAC using vhdl FPGA Virtex 6 Ethernet RGMII constraints sgmii sfp virtex
    Text: Virtex-6 FPGA Embedded Tri-Mode Ethernet MAC User Guide [optional] UG368 v1.0 June 24, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG368 SGMII RGMII bridge RTL code for ethernet 802.3-2005 RGMII to SGMII Bridge UG368 1000BASE-X Ethernet-MAC using vhdl FPGA Virtex 6 Ethernet RGMII constraints sgmii sfp virtex

    SGMII RGMII bridge

    Abstract: sgmii fpga UG368 fpga rgmii verilog code for mdio protocol iodelay sgmii Ethernet sgmii testbench of an ethernet transmitter in verilog 1000BASE-X
    Text: Virtex-6 FPGA Embedded Tri-Mode Ethernet MAC User Guide [optional] UG368 v1.2 January 17, 2010 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG368 SGMII RGMII bridge sgmii fpga UG368 fpga rgmii verilog code for mdio protocol iodelay sgmii Ethernet sgmii testbench of an ethernet transmitter in verilog 1000BASE-X

    DS5312

    Abstract: EUA5312 EUA5312QIR0 EUA5312QIR1 EUA5312QIT1 EUA MARKING CODE stereo amplifier
    Text: EUA5312 2-W Stereo Audio Power Amplifier with Four Selectable Gain Settings DESCRIPTOIN FEATURES The EUA5312 is a stereo audio power amplifier. When driving 1 W into 8–Ω speakers, the EUA5312 has less than 0.8% THD+N across its specified frequency range. Included


    Original     		PDF EUA5312 EUA5312 MO-15 DS5312 EUA5312QIR0 EUA5312QIR1 EUA5312QIT1 EUA MARKING CODE stereo amplifier

    ML505

    Abstract: ml507 MT4HTF3264HY-53e VIRTEX-5 DDR2 ps2 controller ML506 aspi-024-aspi-s402 MT4HTF3264HY DS695 VIRTEX-5 DDR2 controller
    Text: ML505/506/507 MIG Design Creation Using ISE 11.1, MIG 3.0 and ChipScope™ Pro 11.1 May 2009 Overview ƒ Hardware Setup ƒ Software Requirements ƒ CORE Generator™ software – Memory Interface Generator MIG ƒ Modify Design – Add ChipScope Pro Cores to Design


    Original     		PDF ML505/506/507 ML505, ML506, ML507 ML505 com/ml505 ML506 com/ml506 ML507 com/ml507 MT4HTF3264HY-53e VIRTEX-5 DDR2 ps2 controller aspi-024-aspi-s402 MT4HTF3264HY DS695 VIRTEX-5 DDR2 controller

    aspi-024-aspi-s402

    Abstract: DS444 xilinx mig user interface design MT4HTF3264HY-53e VIRTEX-5 DDR2 VIRTEX-5 DDR2 controller XAPP1026 ug086 XPS IIC chipscope manual
    Text: ML501 MIG Design Creation Using ISE 10.1i SP3, MIG 2.3 and ChipScope™ Pro 10.1i November 2008 Overview • Hardware Setup • Software Requirements • CORE Generator™ software – Memory Interface Generator MIG • Modify Design – Add ChipScope Pro Cores to Design


    Original     		PDF ML501 ML501 com/ml501 UG226 kits/ug226 aspi-024-aspi-s402 DS444 xilinx mig user interface design MT4HTF3264HY-53e VIRTEX-5 DDR2 VIRTEX-5 DDR2 controller XAPP1026 ug086 XPS IIC chipscope manual

    ICS85104

    Abstract: marvell ibis 88e1111 South Bridge ALI M1535 ALi M1535D Marvell 88E1111 trace layout guidelines us power supply atx 250w schematic M1535 XAPP925 rtc8564 JS28F256P30T95
    Text: ML510 Embedded Embedded Development Development Platform User Guide [optional] UG356 v1.1 December 11, 2008 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


    Original     		PDF ML510 UG356 DS572, XAPP778, DS481, DS484, DS575, UG081, DS614, DS406, ICS85104 marvell ibis 88e1111 South Bridge ALI M1535 ALi M1535D Marvell 88E1111 trace layout guidelines us power supply atx 250w schematic M1535 XAPP925 rtc8564 JS28F256P30T95

    fsp250-60

    Abstract: alaska atx 250 p4
    Text: ML510 Embedded Embedded Development Development Platform User Guide [optional] UG356 v1.2 June 16, 2011 [optional] R R Copyright 2008 – 2011 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included


    Original     		PDF ML510 UG356 DS572, XAPP778, DS481, DS484, DS575, UG081, DS614, DS406, fsp250-60 alaska atx 250 p4

    DS1235YW

    Abstract: DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241
    Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE DS87520 TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1585 DS1306 DS17485 DS1307 DS17885 DS1315 DS1803 DS1623 DS1806 DS1627 DS2430A DS1670 DS2437 DS1673


    Original     		PDF DS87520 DS87523 DS87530 DS2118 DS1302 DS1302 DS1721 DS83CH20 DS12885B DS1235YW DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241

    32E32

    Abstract: 3MD12
    Text: DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task


    OCR Scan     		PDF DS5311FP 68HC11 32E32 3MD12

    DS2311

    Abstract: No abstract text available
    Text: JUN li 1993 DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task


    OCR Scan     		PDF DS5311FP 68HC11 03736C DS2311

    68hc11a

    Abstract: No abstract text available
    Text: JU N i l 1993 DS5311FP PRELIM INARY PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11-based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task


    OCR Scan     		PDF DS5311FP 68HC11 68HC11-based 68hc11a

    hc11

    Abstract: simm 68hc11 ds5311fp
    Text: DS5311FP FULL DATA SHEET AVAILABLE - CALL 214-450-3836 DALLAS SEMICONDUCTOR DS5311FP 68HC 11 S oftener Chip PACKAGE OUTLINE FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV prograrrtfdata storage - Serial bootstrap loading


    OCR Scan     		PDF DS5311FP 68HC11 DS2311 72-pin DS5311FPHC11 DS5311. hc11 simm 68hc11 ds5311fp

    SOFTENER

    Abstract: DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40
    Text: D S63« P R O D U C T P R E V IE W DALLAS . DS53xx Micro Softener Chips s e m ic o n d u c to r FEATURES PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed


    OCR Scan     		PDF DS53xx DS5340 DS5303 DS2340 DS2301 SOFTENER DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40

    register file

    Abstract: INTEL END OF LIFE 80C196 80C196 BOOT HD6301
    Text: DS53xx PRODUCT PREVIEW DALLAS SEMICONDUCTOR FEATURES DS53xx Micro Softener Chips PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed NV program/data storage


    OCR Scan     		PDF DS53xx -DS5340FP: DS5340 DS5303 DS2340 DS2301 06149Q register file INTEL END OF LIFE 80C196 80C196 BOOT HD6301