CE5C

Abstract: CEA 243 A12C A14C ZZ1A18 6803 microprocessor pcetc
Contextual Info: DALLAS SEMICONDUCTOR CORP BTE D m 2 b l 4] i 3D Q0033t>E S 1 3 DAL 0S5340 n~'5Z-!>V 0.5 DS5340 V40 Softener Chip DJy.!LAS SEMICONDUCTOR FEATURES PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: -Converts up to 672K bytes of CMOS

8086 assembly language for serial port

Abstract: 8086 hex code IBM POWER3 processor
Contextual Info: DS5340FP DALLAS S E M IC O N D U C T O R FEATURES DS5340FP V40 Softener Chip PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: - Converts up to 672K bytes of CMOS SRAM into lithium-backed NV program/data storage - Serial bootstrap loading for in-system

Contextual Info: DS5340 PRODUCT PREVIEW DALLAS S EM IC O N D U C T O R DS5340 V40 Softener Chip FEATURES PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: -Converts up to 672K bytes of CMOS SRAM into lithium-backed NV program/data storage

8132

Abstract: passivation DS5003
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: July 11, 1994 To: Subject: PRODUCT CHANGE NOTICE – F42101 Description: DS500X/DS53XX Passivation Change The DS500X and DS53XX products (DS5001, DS5002, DS5003, DS5004, DS5311, DS5340) will undergo a change in passivation from the current single layer 10 KA Hotwall OXIDE passivation to a 10

nec v40

Abstract: A13D
Contextual Info: DS5340FP FULL DATA SHEET AV A ILA B LE — C A LL 214-450-3836 M I I - iL Q DS5340FP V40 Softener Chip SEMICONDUCTOR FEATURES PIN DESCRIPTION o • Provides softness for V40-based systems: N o ^ in s < < < < < < < < Q .Q .IL L 1 Q .Q .IL • Adapts to task-at-hand:

Contextual Info: DS5340 PRODUCT PREVIEW DALLAS DS5340 V40 Softener Chip s e m ic o n d u c to r FEATURES PIN DESCRIPTION o«-cg<n^Lrtipr«. • Provides softness for V40-based systems: <<<<<<<< LO.Q.Q.Q.(LCLQ. • Adapts to task-at-hand: - Converts up to 672K bytes of CMOS

Contextual Info: DALLAS s e m ic o n d u c to r DS1336 Afterburner Chip PIN ASSIGNMENT FEATURES • Provides power switching of up to 1.5 amps at voltages between 3 and 5 volts • Five separate power switches • Selectable battery switches battery-backed systems for use

diode ZTN 33 ITT

Abstract: ZTN 33 ITT s1236
Contextual Info: DS1336 DALLAS SEMICONDUCTOR DS1336 A fterburner Chip PIN A S S IG N M E N T • Five separate power switches • Selectable battery switches battery-backed systems for use with • Very low on im pedance of 0.7Q. • Battery backup current of 4 mA O U T5 Q

Contextual Info: DALLAS SEMICONDUCTOR DS1336 Afterburner Chip FEATURES PIN ASSIGNMENT • Provides power switching of up to 1.5 amps at voltages between 3.0 and 5.0 volts • Five separate power switches • Selectable battery switches battery-backed systems for use with • Very low on im pedance of 0.7£2

DS1868

Abstract: LM 4440 AUDIO AMPLIFIER CIRCUIT DS1230y-200 battery date codes circuit diagram laptop motherboard Scans-049 texas instrument catalog 74ls DS1666-50 st c031 s1040 diode
Contextual Info: S ystem E x t e n s i o n Data Book CPU Supervisors Digital Potentiometers Silicon Timed Circuits Thermal Products DALLAS SEMICONDUCTOR Copyright 1994 Dallas Semiconductor Corporation, Dallas, Texas All Rights Reserved. Circuit diagrams are included to illustrate typical semiconductor applications. Complete information sufficient for

MQ-5

Abstract: DS1211 DS1236 DS1239 DS1336
Contextual Info: DS1336 DALLAS SEMICONDUCTOR DS1336 Afterburner Chip PIN ASSIGNMENT FEATURES • Provides power switching of up to 1.5 amps at voltages between 3 and 5 volts OUT5Q • Five separate power switches • Selectable battery switches battery-backed systems for use

IN5 diode

Abstract: battery Power Supply IN4 diode DS1211 DS1212 DS1236 DS1239 DS1336 DIODE IN5
Contextual Info: DS1336 DS1336 Afterburner Chip FEATURES PIN ASSIGNMENT • Provides power switching of up to 1.5 amps at voltages between 3.0 and 5.0 volts • Five separate power switches • Selectable battery switches battery–backed systems for use with • Very low on impedance of 0.7Ω

Contextual Info: DALLAS SEMICONDUCTOR DS1336 Afterburner Chip PIN ASSIGNMENT FEATURES • Provides power switching of up to 1.5 amps at voltages between 3 and 5 volts • Five separate power switches • Selectable battery switches battery-backed systems for use with • Very low on impedance of 0.7 il

IN5 diode

Abstract: DS1211 DS1212 DS1236 DS1239 DS1336
Contextual Info: DS1336 DS1336 Afterburner Chip FEATURES PIN ASSIGNMENT • Provides power switching of up to 1.5 amps at voltages between 3.0 and 5.0 volts • Five separate power switches • Selectable battery switches battery–backed systems for use with • Very low on impedance of 0.7Ω

MQ 6

Abstract: IN5 diode
Contextual Info: Si TìM I ÄQ Ì mm :ÌM DS1336 Afterburner Chip * SEMICONDUCTOR PIN ASSIGNMENT FEATURES • Provides power switching of up to 1.5 amps at voltages between 3.0 and 5.0 volts Five separate power switches Selectable battery switches for use with battery-backed systems

64203ASWM4G09TC

Abstract: 2mx64 sdram
Contextual Info: 2M x 64 Bit PC-66 SDRAM SODIMM PC-66 SYNCHRONOUS DRAM SMALL OUTLINE DIMM 64203ASWM4G09TC 144 Pin 2Mx64 SDRAM SODIMM Unbuffered, 4k Refresh, 3.3V with SPD General Description Pin Assignment The 64203ASWM4G09TC is a 2Mx64 bit, 9 chip, 144 Pin SODIMM module consisting of 8 1Mx8x2

DS1231

Abstract: DS1236 DS1239 DS1336 DS1211 DS1212 DS-126
Contextual Info: DS1336 Afterburner Chip www.dalsemi.com FEATURES PIN ASSIGNMENT § Provides power switching of up to 1.5 amps at voltages between 3.0 and 5.0 volts § Five separate power switches § Selectable battery switches for use with § battery-backed systems § Very low on impedance of 0.7O

8086 Parallel Ports

Abstract: 8086 instruction set instruction set of 8086 microprocessor 8086 instruction
Contextual Info: DS2340 T FULL DATA SHEET AVAILABLE — CALL 214-450-3836 HAI I A S DS2340(T) Soft V40 Flip Stik SEMICONDUCTOR FEATURES PACKAGE OUTLINE • V40-based embedded control system adapts to taskat-hand: - Up to 256K bytes of lithium-backed NVSRAMfor program/data storage

DS1235YW

Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885

SOFTENER

Abstract: DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40
Contextual Info: D S63« P R O D U C T P R E V IE W DALLAS . DS53xx Micro Softener Chips s e m ic o n d u c to r FEATURES PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed

BAT01

Abstract: DS183
Contextual Info: I T DS1336 Afterburner Chip DALLAS B Ê ÏiiC Ô N D Ü C T O F t www.dalsemi.com PIN ASSIGNMENT FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Provides power switching o f up to 1.5 amps at voltages between 3.0 and 5.0 volts Five separate power switches

register file

Abstract: INTEL END OF LIFE 80C196 80C196 BOOT HD6301
Contextual Info: DS53xx PRODUCT PREVIEW DALLAS SEMICONDUCTOR FEATURES DS53xx Micro Softener Chips PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed NV program/data storage

65A3

Abstract: 8086 instruction set 72 PC RAM nec v40 QS5340 60A8 "65a3" 8086 Parallel Ports DS1283 DS2340T
Contextual Info: DAL LAS SEMI CONDUCTOR CORP 3TE 2bl4130 D 0 00 3 20 b 4 DAL DS2340 P UI.UIJ I . 23S3SS D A L L A yWf LIM." -4 ,-t, I. * . '. DS2340 Soft V40 Flip Stik S SEMICONDUCTOR -*• JU M FEATURES PACKAGE OUTLINE • V40-based embedded control system adapts to task-at-hand:

8086 instruction set

Abstract: 8086 Parallel Ports 8086 microprocessor APPLICATIONS 8086 instruction 8086 microprocessor pin description 8086 microprocessor pin 8086 8086 interrupts application DS2340 support chips of 8086
Contextual Info: DALLA S S E M I C O N D U C T O R CORP DS2340 T SOE D 2bl413Q OOOSbbM 1 IDAL _ FULL DATA SH EET AVAILABLE - CALL 214-450-3836 M LLAS DS2340(T) Soft V40 Flip Stik 7^ 9 9 - / 9 - o ' SEMICONDUCTOR FEATURES PACKAGE OUTLINE • V40-based embedded control system adapts to taskat-hand: