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    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


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    DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G PDF