|
ISL71610-710EV1Z
|
|
Renesas Electronics Corporation
|
Radiation Tolerant/Hardened Digital Isolators Evaluation Board |
|
|
|
93690-107-10LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. |
|
|
|
54242-107101400LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
|
|
|
98426-G01-07-105LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch. |
|
|
|
54122-107101150LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch |
|
|
